JPH0529543B2 - - Google Patents

Info

Publication number
JPH0529543B2
JPH0529543B2 JP2186133A JP18613390A JPH0529543B2 JP H0529543 B2 JPH0529543 B2 JP H0529543B2 JP 2186133 A JP2186133 A JP 2186133A JP 18613390 A JP18613390 A JP 18613390A JP H0529543 B2 JPH0529543 B2 JP H0529543B2
Authority
JP
Japan
Prior art keywords
prepreg
metal foil
belt
laminate
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2186133A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0473147A (ja
Inventor
Kikuo Kimura
Hiroshi Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP2186133A priority Critical patent/JPH0473147A/ja
Publication of JPH0473147A publication Critical patent/JPH0473147A/ja
Publication of JPH0529543B2 publication Critical patent/JPH0529543B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)
JP2186133A 1990-07-14 1990-07-14 積層板の製造装置 Granted JPH0473147A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2186133A JPH0473147A (ja) 1990-07-14 1990-07-14 積層板の製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2186133A JPH0473147A (ja) 1990-07-14 1990-07-14 積層板の製造装置

Publications (2)

Publication Number Publication Date
JPH0473147A JPH0473147A (ja) 1992-03-09
JPH0529543B2 true JPH0529543B2 (enrdf_load_stackoverflow) 1993-04-30

Family

ID=16182951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2186133A Granted JPH0473147A (ja) 1990-07-14 1990-07-14 積層板の製造装置

Country Status (1)

Country Link
JP (1) JPH0473147A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111715627A (zh) * 2020-07-09 2020-09-29 佘峰 一种电路板加工用压合装置

Also Published As

Publication number Publication date
JPH0473147A (ja) 1992-03-09

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