JPH0529140B2 - - Google Patents
Info
- Publication number
- JPH0529140B2 JPH0529140B2 JP3695587A JP3695587A JPH0529140B2 JP H0529140 B2 JPH0529140 B2 JP H0529140B2 JP 3695587 A JP3695587 A JP 3695587A JP 3695587 A JP3695587 A JP 3695587A JP H0529140 B2 JPH0529140 B2 JP H0529140B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode terminal
- characteristic testing
- characteristic
- semiconductor substrate
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 description 19
- 239000000758 substrate Substances 0.000 description 11
- 239000000523 sample Substances 0.000 description 4
- 238000000605 extraction Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3695587A JPS63204623A (ja) | 1987-02-19 | 1987-02-19 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3695587A JPS63204623A (ja) | 1987-02-19 | 1987-02-19 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63204623A JPS63204623A (ja) | 1988-08-24 |
| JPH0529140B2 true JPH0529140B2 (cs) | 1993-04-28 |
Family
ID=12484166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3695587A Granted JPS63204623A (ja) | 1987-02-19 | 1987-02-19 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63204623A (cs) |
-
1987
- 1987-02-19 JP JP3695587A patent/JPS63204623A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63204623A (ja) | 1988-08-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6824395B2 (en) | Semiconductor device-socket | |
| JPH0529140B2 (cs) | ||
| JP2657315B2 (ja) | プローブカード | |
| JPS6080772A (ja) | プロ−ブニ−ドル | |
| JPS626653B2 (cs) | ||
| JPH065674A (ja) | 半導体集積回路装置 | |
| JPH0661316A (ja) | プローブ集合体 | |
| JPH0725724Y2 (ja) | マイクロパッド | |
| JPH0262947B2 (cs) | ||
| JPH0621025Y2 (ja) | 隣接する2つのチップを同時に測定するプローブカード | |
| JP2002214274A (ja) | 回路配線の検査方法 | |
| JPH04115545A (ja) | プローブカード | |
| JPH06104316A (ja) | フィルムキャリアテ−プ | |
| JPS6118144A (ja) | 半導体デバイス測定装置 | |
| JPH0322456A (ja) | 半導体装置及びその検査方法 | |
| JPS58182239A (ja) | 半導体素子の特性測定装置 | |
| JPH0618559A (ja) | プローブカード | |
| JPH02223874A (ja) | 測定用ソケット | |
| JPH02186654A (ja) | 半導体集積回路の試験方法 | |
| JPH0754814B2 (ja) | Icチツプの試験測定方法 | |
| JPH02180046A (ja) | 半導体ウェハー | |
| JPH0562310B2 (cs) | ||
| JPH02303139A (ja) | 半導体素子用プローブカード | |
| JPH04361549A (ja) | 半導体装置の絶縁耐圧検査方法 | |
| JPH0943275A (ja) | ウエハプローバ及びプローブカード |