JPH05291323A - Electronic-component integrated in-mold formed piece and its manufacturing method - Google Patents

Abstract

PURPOSE:To realize in-mold one-body molding in a simple productive step at low cost along with improved quality thereof, by preventing deformation and a wire brake. CONSTITUTION:An electronic-component integrated in-mold formed piece is made of an electronic component molded in a body with resin. The electronic component includes an electronic part 1 connected to a mounting board 3 through a finger lead 2, an inner lead bonding part (I) sealed with resin 5, and an outer lead bonding part (O) coated with a resin sealing 7 like a resin layer. In an in-mold molding manufacturing step, the electronic part 1 and the mounting board 3 are connected through the finger lead 2. After the inner lead bonding part (I) and the outer lead bonding part (0) are coated with the resin sealing 7, a thermosetting prepreg sheet is layered on at least one side of the electronic part 1. The prepreg sheet is heated and put under pressure so that the electronic-component integrated in-mold formed piece can be obtained.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an in-mold molded article with a built-in electronic component and a method for manufacturing the same, and more specifically,
It is formed by in-molding (embedding) a component (hereinafter referred to as an electronic component component) that combines one or more functions such as oscillation, reception, calculation, and storage as a combination of electronic components such as an IC into a resin. The present invention relates to an in-mold molded product having a built-in electronic component component and a manufacturing method suitable for use in manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, when an electronic component such as an IC is connected to a wiring pattern by finger leads on a mounting substrate called PWB to form an electronic component component, an inner component as shown in FIG. Lead bonding (I
After LB), resin sealing is performed on that portion, but the outer lead bonding (OLB) portion is usually not resin-sealed because sufficient mechanical strength is maintained. On the other hand, as shown in FIG. 7, IC chip components such as tape automated bonding (TAB) and quad flat package (QFP) are fitted into the package 13 having a vertically aligned structure, and the resin 14 is placed in the surrounding hollow portion. A molding means for encapsulating and molding has been put into practical use recently because it has resistance to moisture, corrosive gas, and chemicals.

[0003]

DISCLOSURE OF THE INVENTION The conventional TAB described above
In the case of mounting, if the in-mold integral molding is performed, there is a problem that the finger lead is deformed or broken particularly in the 0 LB portion and is displaced from the wiring pattern during the molding step of heating and pressing. Similarly, QF
When in-mold integral molding is performed with a hard resin such as a fiber reinforced resin without encapsulating the lead wire portion of an IC chip component such as P with resin, disconnection often occurs in the molding process.

In addition, the fitting process using the package 13 requires a complicated process of filling the resin 14 into the hollow portion, which also causes a problem that deformation and disconnection easily occur. In addition, there is a disadvantage that the shape of the package 13 is limited.

An object of the present invention is to realize in-mold integral molding in a simple process, to realize low cost and mass production, and at the same time, to prevent deformation and disconnection in the course of molding process, thereby improving quality. An object of the present invention is to provide an in-mold molded product with a built-in electronic component composition and a manufacturing method suitable for use in manufacturing the same.

[0006]

The present invention has the following constitution in order to achieve the above object. That is, according to the present invention, an electronic component component is formed by resin in which an electronic component and a mounting board are connected by finger leads, an inner lead bonding portion is resin-sealed, and an outer lead bonding portion is covered with a resin layer. It is an in-mold molded product with a built-in electronic component structure, which is integrally molded in-mold.

The present invention is also an in-mold molded product with a built-in electronic component structure according to claim 1, wherein the outer lead bonding portion is resin-sealed in the same manner as the inner lead bonding portion. The portion is covered with a resin molding jacket.
An in-mold molded product with a built-in electronic component structure as described in 1. Furthermore, the present invention provides an electronic component having a structure in which the resin layer covering the outer lead bonding portion is made of a resin having a thermal expansion coefficient equal to or smaller than that of the resin forming the mounting board. It is an in-mold molded product with a built-in component, and is also an in-mold molded product with a built-in electronic component that is formed on any one of an IC card, a panel, and a display product.

According to the present invention, the electronic component and the mounting board are connected by finger leads, the inner lead bonding portion and the outer lead bonding portion are sealed with resin, and then the thermosetting resin prepreg is provided on both surfaces of the electronic component or the electronic component. A method for manufacturing an in-mold molded product with a built-in electronic component structure, comprising laminating on one side surface, heating and pressing to integrally mold in-mold.

[0009]

According to the present invention, it is possible to prevent disconnection and deformation of the outer lead bonding portion due to molding pressure and temperature. Moreover, a complicated molding process such as encapsulating a resin in the hollow portion can be omitted. From the above, it is possible to increase the degree of freedom in the shape of the molding package.

Further, the outer lead portion can be easily protected, and thereby the molding pressure can be increased, and there is no problem even when the pressure is directly applied to the electronic component component. Moreover, by using the sealing resin having a small difference in the coefficient of thermal expansion from the mounting board, the strength against the disconnection, the deformation, and the deviation from the wiring pattern is doubled.

[0011]

EXAMPLES Examples of the present invention will be described in detail below. FIG. 1 is an enlarged sectional view of an electronic component component according to an embodiment of the present invention. The finger lead 2 is connected to an electronic component 1 such as an LSI chip, and the inner lead bonding portion I has a carrier tape 4 adhered thereto via an adhesive 6 and a surrounding area covered and sealed with a sealing resin 5. The electronic component 1 and the finger lead 2 are integrated. This integrated structure is placed on the mounting board 3, and the finger leads 2 are used to form the wiring pattern 8 on the mounting board 3.
An electronic component structure is formed by connecting to.

In the above electronic component structure, the finger leads 2 and the outer lead bonding portions O which are the connection portions between the finger leads 2 and the wiring pattern 8 are sealed 7 by a resin molding method or the like to form inner lead bonding portions. Like I, it has a structure in which the lead portion is covered and protected. As the resin used for this sealing 7, a resin having a property that a difference in thermal expansion coefficient from the resin of the mounting substrate 3 is small is preferable, and, for example, a thermosetting resin such as an epoxy resin or a phenol resin. Any resin is selected from thermoplastic resins such as vinyl chloride type, ABS (acrylic / butadiene / styrene) type.

The electronic component component thus constructed is then in-molded to produce the in-mold molded product of the electronic component component according to the present invention. In Figure 2,
An example of in-mold molding means is schematically shown. A prepreg 11 made of a thermosetting resin is placed on the upper and lower surfaces of the electronic component component and laminated, and is set in the lower mold 9 and then the upper metal mold. The mold 10 was lowered under pressure control to close the mold, and the mold was compressed at a surface pressure of, for example, 5 kgf / cm ² . The mold temperature at this time is 160 ° C., and the curing time of the thermosetting resin is 3 minutes. By the way, the in-mold molded product with a built-in electronic component structure is exemplified by an IC card on which an IC chip and a TAB are mounted, and the finished product has a thickness of 1.5 mm.
The substrate 3 itself has a thickness of 0.3 mm, and the thermosetting resin has a minimum thickness of 0.1 mm.

Next, another embodiment of the present invention will be described with reference to FIGS. 3 and 4 are a plan view and a sectional front view of an electronic component component according to another embodiment of the present invention, FIG. 5 is a structural diagram of a sealing resin in FIG. A plan view, (B) is a sectional view taken along the line A.

Since it takes a considerable amount of time to seal 7 the outer lead bonding portion O by a resin molding method or the like, in this embodiment, the molding jacket 12 made of a hard resin having a thin structure is mounted, In-mold integral molding is performed. The molding casing 12 is mounted on, for example, a rectangular electronic component structure so that the resin molded in the shape of a rectangular frame is covered by the outer lead bonding portion O, and the condition described above is maintained. In-mold integral molding is carried out in the same manner as No. 1 to complete the in-mold molded product with the built-in electronic component component. This manufacturing method has an advantage that the manufacturing time is significantly shortened as compared with the resin molding method in which it takes a long time for the molten resin to solidify.

The in-mold molded product with a built-in electronic component structure manufactured by each of the examples described above is an IC (not shown).
As a card, of course, it is suitable as a product for machine embedding such as OA equipment and HA equipment, and for wall embedding.

[0017]

The present invention has the above-described structure and functions. The in-mold molded product with a built-in electronic component structure according to the present invention, in particular, seals the outer lead bonding portion with resin. Since the in-mold integral molding is performed in this state, the outer lead bonding part is not subject to disconnection or deformation due to molding pressure or temperature,
It can provide high quality products. Further, a complicated process such as encapsulating a resin in the hollow portion can be omitted, the manufacturing cost can be reduced, and the flexibility of the shape of the molding package can be increased. Furthermore, it is possible to increase the molding pressure, and by using a sealing resin that has a small coefficient of thermal expansion difference from the mounting board, disconnection, deformation, and deviation from the wiring pattern can be eliminated over long-term use. It is possible to maintain high performance.

Further, according to the method for manufacturing an in-mold molded product with a built-in electronic component component according to the present invention, a low cost product can be obtained by a simple series of steps, and the electronic component component is a resin layer. It is possible to easily provide an in-mold molded product with a built-in electronic component, which is firmly fixed in the inside and can exhibit the excellent function as described above.

[Brief description of drawings]

FIG. 1 is an enlarged sectional view of an electronic component component according to an embodiment of the present invention.

FIG. 2 is a diagram schematically showing an example of in-mold molding means for an electronic component component according to an embodiment of the present invention.

FIG. 3 is a plan view of an electronic component component according to another embodiment of the present invention.

FIG. 4 is a sectional front view showing an electronic component component according to another embodiment of the present invention.

5A and 5B are structural views of the sealing resin in FIG. 4, in which FIG. 5A is a plan view and FIG. 5B is a sectional view taken along line A.

FIG. 6 is an enlarged cross-sectional view of a conventional electronic component component.

FIG. 7 is an enlarged cross-sectional view of a conventional in-mold molded product with a built-in electronic component structure.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Electronic component, 2 ... Finger lead, 3 ... Mounting board, 4 ... Carrier tape, 5 ... Sealing resin, 6 ... Adhesive agent, 7 ... Resin sealing, 8 ... Wiring pattern, 9 ... Lower mold, 10 ... Upper mold, 11 ... Prepreg, 12 ... Molding jacket, I ... Inner lead bonding portion, O ... Outer lead bonding portion.

Claims (6)

[Claims] 1. An electronic component component formed by connecting an electronic component and a mounting substrate with finger leads, sealing an inner lead bonding portion with a resin, and covering an outer lead bonding portion with a resin layer, with a resin. An in-mold molded product with a built-in electronic component structure, characterized by being integrally molded. 2. The in-mold molded product with a built-in electronic component structure according to claim 1, wherein the outer lead bonding portion is resin-sealed in the same manner as the inner lead bonding portion. 3. The in-mold molded product with a built-in electronic component structure according to claim 1, wherein the outer lead bonding portion is covered with a resin molding outer cover. 4. The resin layer covering the outer lead bonding portion is formed of a resin having a thermal expansion coefficient equal to or smaller than that of a resin forming the mounting substrate. An in-mold molded product with a built-in electronic component structure according to any one of 3 above. 5. The in-mold molded product with a built-in electronic component structure according to claim 1, which is formed on any one of an IC card, a panel, and a display product. 6. An electronic component and a mounting board are connected by finger leads, the inner lead bonding portion and the outer lead bonding portion are sealed with a resin, and then a thermosetting resin prepreg is laminated on both surfaces thereof or on one surface of the electronic component side. Then
A method for manufacturing an in-mold molded product with a built-in electronic component, comprising heating and pressurizing to perform in-mold integral molding.