JPH05289309A - Reticle and its production - Google Patents

Abstract

PURPOSE:To prevent the charge-up and surface flaw by forming the reticle with a substrate having a through-hole at the periphery and a patterned light- shielding film formed on the substrate. CONSTITUTION:A reticle 1 is provided with a chromium light-shielding film 3a patterned on a quartz substrate 2, and a through-hole 2a is formed at the periphery of the substrate 2. In this case, a conductive pin is brought into contact with the light-shielding film, which is exposed with an electron beam. Accordingly, continuity is secured, a resist film formed on the light-shielding film need not be released, hence the adhesiveness between the resist film and substrate 2 is not reduced, and the film is not flawed. Further, if the resist film on the through-hole 2a is also exposed, the light-shielding film 3a at this position is etched off, hence the continuity by the conductive pin is broken, and the end point of etching is detected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improved reticle and a method of manufacturing the reticle. In the step of forming a resist film on the surface of the dry plate having the light-shielding film formed on the surface of the substrate and exposing the resist film with an electron beam, in order to prevent the dry plate from being charged up by electrons, The resist film is peeled off and the conductive pins are brought into contact with the light-shielding film to remove the accumulated charge, but the conduction is insufficient and the peeled resist causes surface defects, reducing the reticle manufacturing yield. I am letting you.

Under the circumstances as described above, there is a demand for a reticle manufacturing method which can surely establish conduction by a light-shielding film and can prevent surface defects due to peeling of a resist film.

[0003]

2. Description of the Related Art A conventional reticle and its manufacturing method are shown in FIG.
And FIG. 4 will be described in detail. 3 is a side sectional view showing a conventional reticle, and FIG. 4 is a side sectional view showing a conventional reticle manufacturing method in the order of steps.

As shown in FIG. 3, the conventional reticle 11 is a reticle having a patterned light-shielding film 13 on the surface of a substrate 12. In order to manufacture the reticle 11 having such a structure, first, as shown in FIG. 4A, a resist is applied to the entire surface of the light-shielding film 13 of the dry plate composed of the substrate 12 and the light-shielding film 13 to form the resist film 14. And the dry plate is placed on the stage 15.

Next, as shown in FIG. 4 (b), a part of the resist film 14 at the peripheral portion is peeled off, and a conductive pin is attached to the exposed light-shielding film 13.
After the resist film 14 is exposed to a predetermined pattern by using an electron beam in a state where 16 is brought into contact with the conductive film, the resist film 14 is developed and patterned.

Next, the light-shielding film 13 is etched and patterned by using the resist film 14 patterned as shown in FIG. 4C as a mask, and then the resist film 14 is peeled off to manufacture the reticle 11 as shown in FIG. is doing.

[0007]

In the conventional method for manufacturing a reticle described above, a part of the peripheral edge of the resist film formed on the entire surface of the light-shielding film on the surface of the substrate is peeled off and the exposed light-shielding film is electrically connected. The light-shielding film is exposed to a predetermined pattern using an electron beam in the state where the pins are in contact with each other for conduction, but this method does not provide sufficient conduction, and some of the resist is stripped, so the remaining However, there is a problem in that the adhesive force between the resist film and the substrate is affected, and the resist debris turns into dust, causing surface defects and reducing the manufacturing yield of the reticle.

In view of the above situation, the present invention uses a dry plate having a simple structure and is provided on the substrate without peeling off a part of the peripheral edge of the resist film formed on the surface of the light shielding film. A method for manufacturing a reticle capable of exposing a resist film with an electron beam by bringing a conductive pin into contact with a light-shielding film formed on a side wall of a through hole to ensure conduction, and a reticle manufactured by this method. It is intended to be provided.

[0009]

The reticle of the present invention comprises a substrate having a through hole in its peripheral portion and a patterned light-shielding film formed on the surface of the substrate.

The method of manufacturing a reticle of the present invention is the method of manufacturing a reticle described above, wherein a light-shielding film is formed on the surface of a substrate having a through hole in the peripheral portion, and the light-shielding film is also formed on the side wall of the through hole. The step of forming a resist film on the surface of the light-shielding film of the dry plate on which is formed, and the state where the conductive pin is brought into contact with the light-shielding film formed on the side wall of the through hole, the resist film is used with an electron beam. And exposing.

[0011]

That is, in the present invention, the light-shielding film is formed on the surface of the substrate having the through-hole in the peripheral portion, and the side wall of the through-hole also has the light-shielding film integrated with the surface light-shielding film. A resist film is formed on the entire surface of the light-shielding film formed on this surface, and a conduction pin is brought into contact with the light-shielding film formed on the side wall of the through hole to establish conduction. Since it is possible to surely establish conduction because the exposure is performed using, and since it is not necessary to peel off the resist film formed on the surface of the light-shielding film, the resist film and the substrate that are generated to peel off a part of the resist It is possible to prevent a decrease in adhesion force between the surfaces and a surface defect caused by peeling residue of the resist.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention in which the light shielding film is chrome will be described in detail below with reference to FIGS.

FIG. 1 is a side sectional view showing a reticle of one embodiment according to the present invention, and FIG. 2 is a side sectional view showing a method of manufacturing a reticle of one embodiment according to the present invention in the order of steps. The reticle 1 according to one embodiment of the present invention has a plate thickness of 2.3 m as shown in FIG.
The substrate 2 made of quartz with a thickness of 5,000 Å is provided on the surface of the substrate 2 with a light-shielding film 3a made of chrome.
Is a reticle in which a through hole 2a having a diameter of 1 to 10 mm is formed in the peripheral edge portion of.

In order to manufacture the reticle 1 having such a structure, first, as shown in FIG. 2 (a), the light shielding film 3a is formed on the surface of the substrate 2 having the through holes 2a in the peripheral portion, The resist film 4 is applied to the entire surface of the light-shielding film 3 of the dry plate in which the light-shielding film 3b is also formed on the side wall of the through hole 2a, and the conductive pin 6 provided on the stage 5 is provided on the peripheral portion of the substrate 2. The substrate 2 is placed on the surface of the mounting table 5 by inserting the substrate 2 into the through hole 2a and bringing the conductive pin 6 into contact with the light shielding film 3b formed on the side wall of the through hole 2a.

Next, as shown in FIG. 2 (b), the resist film 4 is exposed to a predetermined pattern by using an electron beam in a state where the conductive pin 6 is thus conducted, and then the resist film 4 is exposed. Develop and pattern. At this time, the resist film 4 at the position of the through hole 2a is also exposed.

Then, the light-shielding film 3a is etched and patterned by using the resist film 4 patterned as shown in FIG. 2C as a mask, and then the resist film 4 is peeled off to obtain the reticle 1 as shown in FIG. Manufacturing. Since the resist film 4 at the position of the through hole 2a has also been exposed by the electron beam, the light-shielding film 3a and the light-shielding film 3b at this position are also removed by etching, so that conduction by the conduction pin 6 cannot be established, and the end point of etching. Can be detected.

Since the conductive pin 6 and the light-shielding film 3b are brought into contact with each other and the exposure is performed by the electron beam as described above, it is possible to surely establish the conduction and the resist formed on the surface of the light-shielding film. Since it is not necessary to peel off the film, it is possible to prevent a decrease in adhesion between the resist film and the substrate caused by peeling off a part of the resist, and to prevent surface defects due to resist peeling residue. If the resist film 4 at the position of the hole 2a is also exposed, the light shielding film 3a at this position is exposed.
Also, since the light-shielding film 3b is removed by etching, conduction by the conduction pin 6 cannot be obtained, and the end point of etching can be detected.

[0018]

As is apparent from the above description, according to the present invention, a dry plate having a remarkably simple structure is used, and the resist film is exposed by an electron beam by conducting electricity by the improved method. It is possible to reliably prevent the exposure and to expose the light-shielding film. Also, since a part of the resist film is not peeled to establish conduction, it is possible to prevent surface defects caused by peeling. Therefore, it is possible to provide a reticle and a method for manufacturing the reticle, which can be expected to have significant economic and reliability improvement effects.

[Brief description of drawings]

FIG. 1 is a side sectional view showing a reticle according to an embodiment of the present invention,

FIG. 2 is a side sectional view showing a method of manufacturing a reticle according to an embodiment of the present invention in the order of steps,

FIG. 3 is a side sectional view showing a conventional reticle,

FIG. 4 is a side sectional view showing a conventional reticle manufacturing method in order of steps.

[Explanation of symbols]

 1 is a reticle, 2 is a substrate, 2a is a through hole, 3a is a light-shielding film, 3b is a light-shielding film, 4 is a resist film, 5 is a stage, 6 is a conductive pin,

Claims (2)

[Claims] 1. A substrate (2) having a through hole (2a) in a peripheral portion thereof.
And a patterned light-shielding film (3a) formed on the surface of the substrate (2). 2. The method of manufacturing a reticle according to claim 1, wherein the light-shielding film (3) is formed on the surface of the substrate (2) having a through hole (2a) in the peripheral portion.
a) is formed, and a light-shielding film is also formed on the sidewall of the through hole (2a).
Conducting the step of forming a resist film (4) on the surface of the light shielding film (3a) of the dry plate on which (3b) is formed, and the light shielding film (3b) formed on the side wall of the through hole (2a). And a step of exposing the resist film (4) with an electron beam in a state where the pin (6) is in contact with the pin (6).