JPH01187926A - Manufacture of mask and reticle - Google Patents

Abstract

PURPOSE:To electrically connect a dry plate with a charge beam exposure unit reliably, to eliminate the storage of charges on the plate during exposure and to obviate the drift of a pattern by providing an opening for a conductive pin which is to be brought into contact with a metal film on a photoresist film in the metal film. CONSTITUTION:When a charge beam exposure is conducted to form a pattern on a metal film 2 on a glass base 1, thereby manufacturing a mask and a reticle, an opening 7 for a conductive pin 5 to be brought into contact with the film 2 is provided in a photoresist film 4 formed on the film 2. For example, a metal layer 2 made of chromium or the like is formed on the base 1. Then, a coating material 3 made of a vinyl adhesive film or the like is coated in advance on the part to be brought into contact with the pin 5 in an exposure step. Thereafter, after the layer 2 is coated with an electron beam resist 4, the opening 7 is formed by removing the material 3, and the layer 2 of conductive substance is exposed. A dry plate 10A formed in this manner is subjected to a charge beam exposure, thereby forming the mask or the reticle.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing masks and reticles used in manufacturing semiconductor devices and the like.

[Conventional technology]

Conventionally, when performing charged beam exposure in the process of manufacturing masks and reticles, as shown in FIG. By pressing strongly against the dry plate 10, the non-conductive material layer such as the electron beam resist 4 is penetrated, and by contacting the metal layer 2 such as chromium underneath, electrical continuity between the exposure device and the dry plate 1o is established. I was taking it.

[Problem that the invention seeks to solve]

In the conventional exposure method described above, the force of the spring weakens over time, and the tip of the conductive pin 5 wears out as shown in FIG. This has the disadvantage that it becomes difficult to penetrate through the film, and as a result, electrical continuity between the exposure device and the dry plate cannot be established.

If electrical continuity is not established, charge will accumulate on the dry plate during exposure, causing pattern drift, or local pattern misalignment due to sudden discharge.
A very undesirable phenomenon occurs in terms of exposure accuracy. Specifically, pattern drift alone may move nearly 1 μm in 30 minutes, which poses a major problem in terms of mask and reticle accuracy.

[Means for solving problems]

The mask and reticle manufacturing method of the present invention is a mask and reticle manufacturing method in which a pattern is formed on a metal film on a glass substrate by performing charged beam exposure, and the method includes applying a photoresist film formed on the metal film to a photoresist film formed on the metal film. An opening is provided for the conductive pin to be brought into contact.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIGS. 1(a) to 1(d) are cross-sectional views of a glass substrate shown in order of steps for explaining a first embodiment of the present invention.

First, as shown in FIG. 1(a), a metal layer 2 of chromium or the like is formed on a glass substrate 1. Next, a coating material 3 made of vinyl-based adhesive film or the like is adhered in advance to the portion that will be contacted by the conductive pin in the exposure process. coat 3
Any material may be used as long as it does not change in quality even if it comes into contact with the electron beam resist and can be bonded to the metal layer.

Next, as shown in FIG. 1(b), after coating an electron beam resist 4 on the metal layer 2, as shown in FIG. 1(c), the opening 7 is formed by peeling off the coating material 3. form,
The metal layer 2, which is a conductive material, is exposed.

The thus formed dry plate 10A is subjected to charged beam exposure to form a mask or reticle. In this case, as shown in FIG. 1(d), be sure to connect the conductive pin 5 to the metal layer 2.
can be contacted to establish continuity. Therefore, the comparative pattern drift can be suppressed to 115 or less when conduction is not established.

FIG. 2 is a sectional view of a glass substrate and a conductive device for explaining a second embodiment of the present invention.

First, as shown in FIG. 2 <a), a conductive pin 5A with a flat tip is placed on a glass substrate 1 on which a metal layer 2 such as chromium is formed.
The conduction device 8 having the conduction pin 5A is attached to the metal layer 2.
contact with.

Next, as shown in FIG. 2(a), an electron beam resist 4 is applied to the surface of the metal layer 2 to form a dry plate 10B.

Next, as shown in FIG. 2C, the dry plate 10B is set on the sample stage 6 with the conduction device 8 attached, and a mask or reticle is formed by performing charged beam exposure.

In this way, in the second embodiment, the conductive pin 5A of the conductive device 8 is brought into contact with the metal layer 2, and the conductive pin 5A itself serves to form an opening in the resist film. Therefore, the electrical contact between the metal layer 2 and the conductive pin becomes more reliable.

〔Effect of the invention〕

As explained above, the present invention enables the photoresist film on the metal film to have openings for the conductive pins that come into contact with the metal film when performing charged beam exposure for manufacturing masks and reticles. Electrical continuity with the charged beam exposure device is ensured, and charge does not accumulate on the dry plate during exposure, eliminating the occurrence of pattern drift, which improves the precision of masks and reticles. There is.

[Brief explanation of the drawing]

1 and 2 are cross-sectional views of a glass substrate for explaining the first and second embodiments of the present invention, and FIG. 3 is a cross-sectional view of a glass substrate for explaining a conventional mask and reticle manufacturing method. FIG. DESCRIPTION OF SYMBOLS 1... Glass substrate, 2... Metal layer, 3... Coating material, 4... Electron beam resist, 5.5A... Conductive pin, 6... Sample stand, 7... Opening Part, 8... Conduction device, 10° 10A, IOB... Dry plate.

Claims (1)

[Claims] In a method for manufacturing a mask and a reticle in which a pattern is formed on a metal film on a glass substrate by performing charged beam exposure, an opening for a conductive pin to be brought into contact with the metal film is provided in a photoresist film formed on the metal film. Characteristic methods for manufacturing masks and reticles.