JPH05347242A - Manufacture of mask - Google Patents
Manufacture of maskInfo
- Publication number
- JPH05347242A JPH05347242A JP15486592A JP15486592A JPH05347242A JP H05347242 A JPH05347242 A JP H05347242A JP 15486592 A JP15486592 A JP 15486592A JP 15486592 A JP15486592 A JP 15486592A JP H05347242 A JPH05347242 A JP H05347242A
- Authority
- JP
- Japan
- Prior art keywords
- glass substrate
- cassette
- substrate
- metal film
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Electron Beam Exposure (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は半導体集積回路の製造等
に使用する密着マスクもしくはレティクルマスクの製造
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a contact mask or reticle mask used for manufacturing semiconductor integrated circuits and the like.
【０００２】[0002]
【従来の技術】従来、マスク製造のための荷電ビーム露
光工程において、ガラス基板上の金属膜と露光装置間の
電気的導通は、導通ピン等をバネの力等を利用して金属
膜上のレジストの非導電性物質膜を貫通させて取ってい
た。そして、ガラス基板の端面部分の金属膜が無い部分
については、導電性を持たす機構は備えていなかった。2. Description of the Related Art Conventionally, in a charged beam exposure process for manufacturing a mask, electrical conduction between a metal film on a glass substrate and an exposure apparatus is performed by using a conductive pin or the like on a metal film by utilizing a spring force or the like. It was taken through the non-conductive material film of the resist. Then, the end surface of the glass substrate, which has no metal film, is not provided with a mechanism for providing conductivity.
【０００３】[0003]
【発明が解決しようとする課題】この従来の露光法で
は、ガラス基板の端面部分の金属が無い部分では、ガラ
ス基板の端部は金属膜形成上金属が形成されない露光装
置と電気的導通が無いという欠点がある。In this conventional exposure method, in the portion of the end surface of the glass substrate where there is no metal, the end of the glass substrate has no electrical continuity with the exposure apparatus in which no metal is formed on the metal film formation. There is a drawback.
【０００４】電気的導通が取れていないと、露光ビーム
の調整及び露光状態を確認する為に使用する露光装置に
設けている原点マークにビームを移動、又は前記調整確
認作業中に、ビームのモレ等により電荷が蓄積する。If the electrical connection is not established, the beam is moved to the origin mark provided in the exposure apparatus used for adjusting the exposure beam and confirming the exposure state, or the beam leaks during the adjustment confirmation work. Etc., the electric charge is accumulated.
【０００５】このガラス基板端面部分に蓄積した電荷
は、原点マークでのビーム調整、露光状態確認作業時、
ビームを曲げたりし、正常動作が不可能となる。実験上
ビームの曲がりは、１μｍに達する事があり、マスク及
びレティクル精度上大きな問題となっていた。The electric charges accumulated on the end surface of the glass substrate are adjusted during the beam adjustment at the origin mark and the exposure state confirmation work.
The beam may bend, making normal operation impossible. Experimentally, the bending of the beam could reach 1 μm, which was a serious problem in terms of mask and reticle accuracy.
【０００６】[0006]
【課題を解決するための手段】本発明のマスク（密着マ
スクやレティクルマスク）の製造方法は、荷電ビームに
よりパターンを形成する際、ガラス基板上の端面部分を
導電性のある金属等で覆う、導電性カバーを備えてい
る。According to the method for manufacturing a mask (contact mask or reticle mask) of the present invention, when a pattern is formed by a charged beam, an end face portion on a glass substrate is covered with a conductive metal or the like. It has a conductive cover.
【０００７】[0007]
【実施例】次に本発明について図面を参照して説明す
る。図１は本発明の第１の実施例の断面図である。金属
膜２はガラス基板３上に形成されており、そのガラス基
板３はバネ７により押し上げられカセット６の上面に設
けているガラス基板規制板４と接している。The present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of the first embodiment of the present invention. The metal film 2 is formed on the glass substrate 3, and the glass substrate 3 is pushed up by the spring 7 and is in contact with the glass substrate regulating plate 4 provided on the upper surface of the cassette 6.
【０００８】カセット６は同様にバネ（図示せず）等に
より押し上げ露光装置に設けているカセット規制板５と
接しており、カセット規制板５の先端部分に接している
のが本発明の導電性カバー１である。Similarly, the cassette 6 is in contact with the cassette regulating plate 5 provided in the exposing device by a spring (not shown) or the like, and the tip of the cassette regulating plate 5 is in contact with the conductivity of the present invention. The cover 1.
【０００９】図２は図１の平面図であり、図２のＡ−Ａ
部の断面が図１である。この図２に示す原点マーク８は
先に延べた様に、ビームの調整及び露光状態を確認する
際使用するものである。FIG. 2 is a plan view of FIG. 1, and is taken along line AA of FIG.
The section is shown in FIG. The origin mark 8 shown in FIG. 2 is used when adjusting the beam and confirming the exposure state, as described above.
【００１０】従来は、ビームの調整及び露光状態の確認
の為、原点マーク８にビームを移動する際、又は、ビー
ム調整、露光状態作業中ビームのモレ電荷がガラス基板
３の端部の金属膜２が形成されていない所に蓄積され、
ビームがその蓄積された電荷により曲げられていた。Conventionally, when the beam is moved to the origin mark 8 in order to adjust the beam and confirm the exposure state, or during the beam adjustment and exposure state work, the leak charge of the beam is a metal film on the end portion of the glass substrate 3. 2 accumulates where it is not formed,
The beam was bent by its accumulated charge.
【００１１】本発明では、導電性カバー１はガラス基板
３の原点マーク８側の端部を完全に覆う様に取り付けい
る。この事により、ビームのモレ電荷はガラス基板３の
端部には到達されず、ビームが曲げられるという精度上
問題となる欠点は無くなる。In the present invention, the conductive cover 1 is attached so as to completely cover the end of the glass substrate 3 on the side of the origin mark 8. As a result, the leak charge of the beam does not reach the end portion of the glass substrate 3 and the disadvantage that the beam is bent, which is a problem in accuracy, is eliminated.
【００１２】尚モレ電荷は導電性カバー１を介して露光
装置側に逃げていく。The leak charge escapes to the exposure apparatus side through the conductive cover 1.
【００１３】図３および図４は本発明の第２実施例の断
面図および平面図である。第２の実施例では、カセット
６に導電性カバー１１を備えている。この実施例によれ
ば露光装置を改造する事無く、ビームモレ電荷による精
度上問題となる欠点を無くす効果がある。3 and 4 are a sectional view and a plan view of a second embodiment of the present invention. In the second embodiment, the cassette 6 is provided with a conductive cover 11. According to this embodiment, there is an effect of eliminating a defect which causes a problem in accuracy due to the beam leak charge without modifying the exposure apparatus.
【００１４】[0014]
【発明の効果】以上説明したように本発明は、ガラス基
板上の端面部分を導電性のある金属等で覆う事により、
ビームのモレ電荷によるビーム曲がり又はビームの広が
りという精度上問題となる欠点を無くす効果を有する。As described above, according to the present invention, by covering the end face portion on the glass substrate with a conductive metal or the like,
This has the effect of eliminating the drawback of accuracy in beam bending or beam divergence due to the leakage charge of the beam.
【００１５】尚、本発明で説明した導電性カバーは、導
電性を持つものであれば金属以外のものでも良い。The conductive cover described in the present invention may be made of materials other than metal as long as it has conductivity.
【図１】本発明の第１の実施例を示す断面図。FIG. 1 is a sectional view showing a first embodiment of the present invention.
【図２】本発明の第１の実施例を示す平面図。FIG. 2 is a plan view showing a first embodiment of the present invention.
【図３】本発明の第２の実施例を示す断面図。FIG. 3 is a sectional view showing a second embodiment of the present invention.
【図４】本発明の第２の実施例を示す平面図。FIG. 4 is a plan view showing a second embodiment of the present invention.
１，１１ 導電性カバー ２ 金属膜 ３ ガラス基板 ４ ガラス基板規制板 ５ カセット規制板 ６ カセット ７ バネ ８ 原点マーク 1,11 Conductive cover 2 Metal film 3 Glass substrate 4 Glass substrate regulation plate 5 Cassette regulation plate 6 Cassette 7 Spring 8 Origin mark
Claims (1)
金属膜にパターンを形成するマスクの製造方法におい
て、前記ガラス基板の端面部分を導電性のある金属等で
カバーしてパターンを形成する事を特徴とするマスクの
製造方法。1. In a method of manufacturing a mask for forming a pattern on a metal film on a glass substrate by performing charged beam exposure, the pattern is formed by covering an end face portion of the glass substrate with a conductive metal or the like. A method for manufacturing a featured mask.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15486592A JPH05347242A (en) | 1992-06-15 | 1992-06-15 | Manufacture of mask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15486592A JPH05347242A (en) | 1992-06-15 | 1992-06-15 | Manufacture of mask |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05347242A true JPH05347242A (en) | 1993-12-27 |
Family
ID=15593613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15486592A Withdrawn JPH05347242A (en) | 1992-06-15 | 1992-06-15 | Manufacture of mask |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05347242A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5912468A (en) * | 1996-05-10 | 1999-06-15 | Kabushiki Kaisha Toshiba | Charged particle beam exposure system |
| JP2007266361A (en) * | 2006-03-29 | 2007-10-11 | Nuflare Technology Inc | Grounding mechanism of substrate, and charged particle beam drawing apparatus |
| JP2008058809A (en) * | 2006-09-01 | 2008-03-13 | Nuflare Technology Inc | Substrate cover, and charged particle beam drawing device and method |
-
1992
- 1992-06-15 JP JP15486592A patent/JPH05347242A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5912468A (en) * | 1996-05-10 | 1999-06-15 | Kabushiki Kaisha Toshiba | Charged particle beam exposure system |
| JP2007266361A (en) * | 2006-03-29 | 2007-10-11 | Nuflare Technology Inc | Grounding mechanism of substrate, and charged particle beam drawing apparatus |
| JP2008058809A (en) * | 2006-09-01 | 2008-03-13 | Nuflare Technology Inc | Substrate cover, and charged particle beam drawing device and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990831 |