JPS599935A - Manufacture of probe card - Google Patents

Abstract

PURPOSE:To prevent the generation of displacement among contactors by forming the contactors at wafer terminals, connecting lead wires to the contactors, molding the contactors with an elastic body, and fixing the elastic body to a board. CONSTITUTION:A photo-resist 2 is applied to a copper substrate 1, the terminal patterns 3 of a wafer to be treated are baked, and developed, and the photo- resist of the terminal pattern sections is removed. Gold is attached to the sections of the pattern sections 3 and the contactors 4 to wafer terminals are formed, the resist 2 remaining in sections except the pattern sections 3 is removed, and the lead wires 5 are welded to the contactors 4. A frame 6 is assembled around the contactors 4, the contactors 4 are molded with the elastic body 7, a reinforcing plate 8 is formed onto the elastic body, and the frame 6 is removed. The reinforcing plate 8 is fixed to a glass epoxy resin board 9. According to said manufacture, the contactors 4 are obtained through a predetermined photographic baking process, and displacement is not generated among the contactors 4.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a probe card used for testing semiconductor wafers.

Conventional probe cards have an insulating substrate with a hole in the center for microscopic observation, and probes are arranged radially around the hole. Semiconductor wafer to be tested placed on
It is necessary to adjust the position of each probe so that the tip of the probe coincides with the arrangement position of the terminals on the wafer while observing a diagram depicting the terminals or the arrangement position of the terminals. Not only is this process becoming increasingly time-consuming and complex, especially as the number of terminals on wafers increases, but probe cards manufactured using this method are also difficult to handle. There is a drawback that the position of the probe changes due to slight carelessness, requiring readjustment of the probe position.

The present invention eliminates the above-mentioned drawbacks, and eliminates the possibility that the relative positional relationship between the contact pieces for one wafer terminal deviates during a certain work process, regardless of the number of terminals on the wafer or the complexity of the terminal arrangement pattern. It is an object of the present invention to provide a method for manufacturing a probe card that does not cause slippage of the contacts even if the terminals are hump-shaped.

For the above purpose, the present invention involves baking a terminal pattern of a semiconductor wafer to be tested on a substrate coated with photoresist, then removing the photoresist in the terminal pattern area and applying metal to the predetermined thickness. a step of forming a contact to one terminal of the wafer by attaching it to the wafer, a step of electrically connecting a lead wire to the contact, and a step of molding the contact with an elastic body with the lead wire pulled out to the outside. , after molding the contact with the elastic body, the method comprises the steps of removing the substrate, and fixing the elastic body on which the contact has been molded to a plate having a predetermined strength.

Embodiments of the present invention will be described below based on the drawings.

First, as shown in Figure 1, a copper substrate 1 with a thickness of 0.2
For example, Microresist 752 manufactured by Kodasoku Co., Ltd. is applied as the photoresist 2 whose exposed areas dissolve in a developing solution, and after the terminal pattern 3 of the semiconductor wafer to be tested is printed on it, it is developed to remove the photoresist in the terminal pattern area. Remove.

In this case, the baking is performed in such a way that parts other than the terminal pattern are exposed to light. FIG. 2 shows the state of adhesion of the photoresist on the copper substrate at this stage in a cross section taken along line L in FIG.

Next, apply gold electroplating to the copper substrate 1 from the side with the terminal backing, and as shown in FIG. After forming the contact 4 to the wafer one terminal, the fourth
As shown in the figure, the photoresist 2 remaining in the area other than the terminal pattern portion is melted and removed using a solvent, for example, a microresist removal solution manufactured by Kodasoku Co., Ltd., and the lead wire 5 is explosively connected to the contact 4. Thereafter, a frame 6 is assembled around the contact 4, and with the lead wire 5 pulled out, rubber is poured into the frame 6 and solidified, the contact is molded with an elastic body 7, and then Pour epoxy resin and solidify the reinforcing plate 8, then remove the frame 6 (Figure 6)
. Next, the elastic body is etched in carbon tetrachloride to the extent that the contact surface of the contact is sufficiently exposed. This is fixed to a glass epoxy resin plate 9 as shown in FIG. 7 to obtain a probe card according to the manufacturing method of the present invention.

As described above, according to the present invention, the contacts to the terminals of the wafer to be tested can be obtained through a certain photoprinting process regardless of the number of terminals or the complexity of the arrangement pattern, and the contacts between the contacts can be No deviation occurs. Furthermore, if the probe card manufactured by the method based on the present invention is used, the two-dimensional position of the wafer and the probe card can be adjusted even when positioning the contacts and the terminals of the chef 1 during wafer testing. All you have to do is decide on the relationship once,
There is no need to monitor and adjust the contact between the probe and the wafer terminal for each probe using a microscope, as is the case with conventional probe cards.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a state in which the terminal arrangement of a semiconductor wafer is printed onto a photoresist on a copper substrate in an embodiment of the present invention. Figure 2 is a cross-sectional view showing the developed state of the photoresist on the substrate shown in Figure 1, and Figure 3 is a cross-sectional view showing the developed terminal pattern shown in Figure 2 with a contact for one terminal on the wafer. FIG. 4 shows a state in which lead wires are connected to the contacts and the remaining photoresist on the copper substrate is removed. FIG. 5 is a diagram for explaining the process of molding the contact with an elastic body and providing a reinforcing plate. FIG. 6 shows a cross section of a contact unit molded with an elastic body and provided with a reinforcing plate. 7Fg is a diagram showing a cross section of the probe card manufactured according to this example. ■...Copper substrate, 2...Photoresist,
3...Terminal pattern, 4...Contact, 5...Lead wire, 6...Frame, 7...Elastic body,
8... Reinforcement plate, 9... Glass epoxy resin. Patent applicant: Nippon Electronic Materials Co., Ltd. Agent: Patent attorney: Nishi 1) New procedural amendment (Yi dismissed in 1982 Patent Application No. 118939 2, Name of invention: Probe card manufacturing method Representative: Masao Okubo 4, Agent address: 15-13-5 Usagano-cho, Kita-ku, Osaka City, Date of amendment order: October 26, 1981 (Shipping date) 159-

Claims (1)

[Claims] After photo-printing a terminal pattern of a semiconductor wafer to be tested on a substrate coated with photoresist, the photoresist of the terminal pattern is removed to expose the surface of the substrate in that area, and a predetermined thickness is applied thereto. How many metals are applied to the semiconductor wafer to form contacts to the terminals of the semiconductor wafer?
After a lead wire is electrically connected to the contact, the contact is molded with an elastic body with the lead wire pulled out, and the substrate is removed. A method for manufacturing a probe card, in which the probe card is formed by fixing it to a plate having strength.