JPH05270173A - Card base material - Google Patents

Abstract

PURPOSE:To prevent printing shift and to enhance impact resistance, in the base material of a bank card, by laminating hard plastic sheets so as to form a curable polyurethane resin layer with a predetermined thickness between them. CONSTITUTION:Predetermined printing is applied to two hard polyvinyl chloride sheets with a thickness of about 0.4mum to form a surface sheet 1 and a back sheet 2. A humidity curable polyurethane hot-melt adhesive is applied to the unprinted surfaces of both sheets 1,2 in a thickness of about 30mum to laminate both sheets 1,2. Both sheets are pressed under predetermined pressure, for example, pressure of 5kg/am<2> to be bonded. Subsequently, both sheets 1,2 are allowed to stand at room temp. without applying pressure to form a cured polyurethane layer 3. The thickness of the cured polyurethane layer 3 is set to 5-50mum.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a card base material such as a magnetic card such as a bank card and a credit card, and an IC card.

[0002]

2. Description of the Related Art Conventionally, when manufacturing card base materials such as bank cards and credit cards, printing is performed on a hard plastic sheet such as a hard vinyl chloride sheet, and two or three sheets are printed. The printed base material of the required thickness is obtained by directly heating and press bonding, but the heating temperature is raised to 100 to 150 ° C. and pressing is performed for 3 to 10 minutes. There is a problem in that the print pitch shifts due to heat shrinkage and the thickness becomes uneven.

Further, since warping occurs when the material is rapidly cooled after being heat-pressed, 1
It is necessary to cool slowly over 0 to 20 minutes, and it tends to require a large-scale device for pressure cooling. Further, an IC storage portion 4 as shown in front sectional views in FIGS.
In the case of a hard plastic sheet that requires heat, that portion is deformed by heating. Moreover, the obtained card base material has insufficient impact resistance, and sometimes breakage such as cracking may occur during intermediate processing such as embossing.

In order to solve these problems, a method of bonding at a low temperature using a solvent type adhesive can be considered, but it is used for a hard plastic sheet such as a hard vinyl chloride sheet which has a risk of solvent deterioration. Can not.

[0005]

DISCLOSURE OF THE INVENTION The present invention relates to a card base material comprising a hard plastic sheet laminated and a curable polyurethane resin layer having a thickness of 5 to 50 microns formed between the plastic sheets. Is.

The present invention will be described below with reference to the drawings. FIG. 1 is a front sectional view showing an example of a card substrate of the present invention, FIG.
Is a front sectional view showing another example of the card substrate of the present invention, and FIG. 3 is a perspective view showing an example of an IC card.

The present invention relates to hard plastic sheets 1 and 2
And a thickness of 5 to
It is a card substrate formed by forming a 50-micron curable polyurethane resin layer 3.

In the present invention, as the hard plastic sheets 1 and 2, a hard vinyl chloride sheet, polyester,
A single substance such as polypropylene, polycarbonate, polystyrene, or a combination thereof can be used, and a hard vinyl chloride sheet is particularly preferable because it has excellent printability. The thickness of the hard plastic sheets 1 and 2 is 0.1 to 0.5 mm
The range is preferable from the viewpoint of ease of molding.

Since the curable polyurethane resin layer 3 of the present invention is a curable type, it exhibits plasticity at a relatively low temperature before curing and can be easily processed, so that the hard plastic sheet is not thermally deformed during lamination and is once cured. After that, a layer having a high heat resistance can be formed, and since the urethane resin, which is originally abundant in elasticity, is the main component, it has an advantage that it has excellent impact resistance even after being cured.

In the present invention, as the curable polyurethane resin layer 3, an isocyanate group-terminated urethane prepolymer which undergoes a crosslinking reaction by water in the air to be cured, various thermoplastic polymers for improving strength, tackifying resins,
A so-called moisture-curable polyurethane resin hot melt adhesive containing a plasticizer, a catalyst and the like can be preferably used.

If the curable polyurethane resin layer 3 is thinner than 5 μm, the adhesive strength becomes weak and it becomes impractical. Moreover, not only will the cost increase if applied thicker than 50 microns, but also the curable polyurethane resin layer 3
There is also a problem that the card itself becomes soft because the physical properties such as elasticity of the card appear too strongly.

To form the curable polyurethane resin layer 3 having a thickness of 5 to 50 μm between the hard plastic sheets 1 and 2, for example, 100 to 120 ° C. on one side or both sides when the hard plastic sheets 1 and 2 are laminated. Moisture-curing polyurethane resin hot melt adhesive heated and melted at about 5 to 50 microns is applied, laminated and pressed, then 1
There is a method of spontaneous curing at a temperature of 0 to 40 ° C.

In addition, it is possible to efficiently produce by stacking in an area of 10 to 50 times the size of the card and then punching out a large number of cards as shown in FIG. Even if the area is large in this way, the heating temperature is low, so that the printing pitch is not displaced, deformed, or warped, which is preferable.

In the example of FIG. 1, a through hole is formed in the hard plastic sheet 1 to form an IC storage section 4, and in the example of FIG. 2, the hard plastic sheet 1 is thermoformed in advance to provide the IC storage section 4. .. As described above, the IC card having the IC storage portion 4 is particularly preferable because the IC storage portion 4 is not deformed by heat at the time of bonding and the lamination processing can be performed accurately and favorably.

By providing the curable polyurethane resin layer 3, even if the thickness of the sheet varies, it is absorbed by the intermediate curable polyurethane resin layer 3 during press lamination, so that the thickness of the card substrate is made uniform. There is an effect that can be.

A hardenable polyurethane resin layer 3 which is more flexible than the hard plastic sheets 1 and 2 between the card base materials.
By providing the card, the bending stress applied to the hard plastic sheet is absorbed even if the obtained card is strongly bent, so if the stress is removed, elastic recovery occurs and permanent deformation is small, and damage such as cracks occurs during intermediate processing. There is no fear.

[0017]

Example: A hard vinyl chloride sheet having a size of 400 mm × 500 mm and a thickness of 0.4 mm is printed to produce a front sheet and a back sheet, and a moisture-curable polyurethane resin hot melt adhesive is applied at 120 ° C. on the non-printed surface. It is heated and melted and is coated with a roll coater to a thickness of 30 microns, and the other sheet is overlaid and the pressure is 5 kg per square cm.
After pressing and adhering for 10 seconds, the moisture-curable polyurethane resin hot-melt adhesive is cross-linked and cured by moisture in the air at room temperature without being pressed for several hours to be cured. 3 is formed, and the card base material of the present invention is completed.

The card of the present invention has no printing deviation.
Even if it was bent to 90 degrees at room temperature, the flatness was restored when the stress was removed. Further, the IC storage unit 4 was also highly accurate and could store the IC smoothly.

[0019]

[Comparative Example] A hard vinyl chloride sheet having a size of 400 mm x 500 mm and a thickness of 0.4 mm is printed to produce a front sheet and a back sheet, which are directly subjected to 120 to 130 ° C and 1 square c.
After thermocompression bonding with a heating press device at 6 kg per m, it was cooled for 20 minutes under pressure to form a conventional card substrate.

In this conventional card, printing was misaligned, and the IC storage section 4 was deformed so that the IC could not be inserted.

[0021]

INDUSTRIAL APPLICABILITY According to the present invention, a hard plastic sheet is laminated and a thickness of 5 to 5 is provided between the plastic sheets.
Since it is a card substrate formed with a 0-micron curable polyurethane resin layer, it is not heated during lamination, so there is no printing pitch deviation, deformation, or warpage, and there is flexibility between plastic sheets for curing. By providing the type polyurethane resin layer, a card base material having high impact resistance can be provided, damage such as cracks during intermediate processing can be prevented, and permanent deformation is small even when the card is strongly bent.

[Brief description of drawings]

FIG. 1 is a front sectional view showing an example of a card substrate of the present invention.

FIG. 2 is a front sectional view showing another example of the card substrate of the present invention.

FIG. 3 is a perspective view showing an example of an IC card.

[Explanation of symbols]

 1 plastic sheet 2 plastic sheet 3 curable polyurethane resin layer

Claims (1)

[Claims] 1. A card substrate comprising a hard plastic sheet laminated and a curable polyurethane resin layer having a thickness of 5 to 50 microns formed between the plastic sheets.