JP3252317B2 - IC card manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an IC card.

[0002]

2. Description of the Related Art In the prior art, for example, Japanese Unexamined Patent Publication No.
Like the IC card disclosed in Japanese Patent No. 2998,
A frame, a circuit board on which an IC chip is mounted, and an insulating outer layer that seals both openings of the frame are formed, and a coil for transmitting and receiving data is formed on the inner surface of one of the insulating outer layers. The IC card is formed by incorporating these into predetermined positions.

[0003]

According to the above prior art, I
When a C card is manufactured, a frame must be prepared as a separate component, so that there is a problem in that the cost for processing the frame is increased, and the assembling is troublesome, resulting in poor mass productivity.

[0004]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides an IC module in a soft plastic sheet by applying pressure while heating an IC module and a soft plastic sheet without using a frame. Embedded. By adopting the heat press process in this way, mass production can be performed at lower cost than when a frame is used.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An IC card manufacturing method according to the present invention comprises a connecting step of connecting a circuit board on which an IC is mounted to a coil for transmitting and receiving data to form an IC module; A first hot pressing step of pressing the IC module and the soft plastic sheet while heating the IC module and the soft plastic sheet with the sides on which the IC module is mounted and embedding the IC module in the soft plastic sheet; 2nd lamination of insulating hard decorative sheet on both sides of the sheet
This IC module comprises an IC
Is connected to a coil for data transmission and reception, and the circuit board and the coil are fixed by a positioning sheet so as not to be displaced.

For this reason, the present invention prevents damage between the coil and the circuit at the time of embedding.

Further, the method further includes a step of positioning a plurality of IC modules on one soft plastic sheet so as to face each other, and temporarily fixing the positioning sheet to the soft plastic sheet. preferable.

[0008] In the first heat pressing step, the thermal processing with the first release sheet behind the IC module and the second release sheet behind the soft plastic sheet intervenes uniformly. This is preferable because it does not exert an excessive force on the circuit at the time of mold release as much as possible.

Furthermore, in the first heat pressing step, it is preferable from the viewpoint of efficiency that a plurality of sets are laminated and subjected to thermal processing, with the IC module and the soft plastic sheet being sandwiched by a release sheet as one set.

Further, when connecting a coil for data transmission and reception to the circuit board, forming a folded portion which is folded back in a direction opposite to the winding direction of the coil at both ends of the coil causes disconnection of the coil. It is preferable in that it becomes difficult.

[0011]

1 and 2 show an IC card formed by the manufacturing method of the present invention. I on the circuit board 1
C2 and other circuit elements 3 are mounted, and coil terminals 4a and 4b at both ends thereof are drawn out from a square-shaped data transmission / reception coil 4 which largely surrounds the outside of the circuit board 1, and is mounted on the circuit board 1. Are connected to the connection terminals 1a and 1b. Further, a positioning sheet 5 for keeping the mutual position between the circuit board 1 and the coil 4 without displacement is bonded to the circuit board 1 and the coil 4 to constitute an IC module A. The IC module A is embedded in the soft plastic layer 6. The soft plastic layer in which the IC module A is embedded has insulating hard decorative sheet sheets 7 and 8 on both sides and transparent protective sheets 9 and 8 on the outer surface. 10 are laminated. The IC card thus configured is usually printed with card numbers and other necessary items on the outer surfaces of the hard decorative sheets 7 and 8 and protected by the protection sheets 9 and 10.

FIG. 3 et seq. Illustrate the steps of manufacturing an IC card for each step. First, FIG. 3 shows an IC on a circuit board 1.
2 shows a process of mounting the circuit elements 2 and other circuit elements 3 and covering necessary portions (not shown) with a potting resin, and then connecting the coil 4 for data transmission and reception. When the coil 4 for data transmission / reception is connected to the circuit board 1, one coil terminal 4a of the coil 4 is connected to the coil 4 from the same side as the front side of the circuit board 1 as shown in FIG. 3B, and is connected to the connection terminal 1a on the circuit board 1 as shown in FIG. 3B. The other coil terminal 4b is pulled out from a middle height of the thickness of the coil inside the coil 4 so as to be inclined slightly inward with respect to the winding direction of the coil 4, and is connected to the circuit board 1. Connect to terminal 1b.
The back surface of the circuit board 1 and the other surface of the coil 4 are shown in FIG.
(A) As shown in FIG.

In the state shown in FIG. 3B, the side of the circuit board 1 to which the coil terminals 1a and 1b are not connected (the lower side) is in an unstable state. Therefore, as shown in FIG. And is fixed using the positioning sheet 5. That is, the protrusions 5a and 5b are made to protrude from both upper and lower ends of the positioning sheet 5, and the circuit board 1 and the coil
The adhesive is applied to the position 5 and pressed by a trowel from above the protruding portions 5a, 5b to thereby bond them. The IC module A can be formed by the above steps.

FIG. 5 shows a pre-stage process for embedding the IC module A in the soft PVC sheet 6. In this example, two soft PVC sheets 6 and 6 are used in an overlapping state. Further, four IC modules A are embedded at one time. That is, the positioning plate 11 having the four positioning holes 11a formed on the soft PVC sheet 6 is overlapped with the outer shape thereof. Then, the IC module A is inserted into each of the positioning holes 11a with its front surface facing downward.

Next, as shown in FIG. 6, a heated iron is pressed from above the positioning sheet 5 to melt the positioning sheet, thereby temporarily fixing the soft iron to the soft PVC sheet 6 at a plurality of locations 12. Positioning plate 11 shown in FIG.
Remove.

FIG. 7 shows a first hot pressing step of embedding the temporarily fixed IC module A in the soft PVC sheet 6. That is, the press plates 13 and 14 of the hot press machine are preferably hard plates made of stainless steel or the like, and the press surfaces are desirably mirror-finished. The IC module A temporarily fixed to the soft PVC sheet 6 is sandwiched between the press plates 13 and 14, and between the IC module A and the press plate 13, for example, a surface such as a glass cloth-containing fluororesin. A first release sheet 15 having irregularities (a height difference of about 5 to 20 μm) for improving air bleeding is interposed between the soft PVC sheet 6 and the press plate 14, for example, paper or glass. Thermal processing is performed with a second release sheet 16 made of a cloth resin or the like interposed therebetween. If the release sheet 15 is not interposed, the mirror surface and the circuit are bonded to each other, resulting in a failure. In addition, if the release sheet 16 is not interposed, the mirror surface and the soft PVC sheet 6 come into close contact with each other, which causes inconvenience such as applying a stress to the circuit when peeling off. The purpose of the glass cloth is not to be hard, because it is not to make the surface of the release sheet rough but to make the air escape better.

The condition of the first hot pressing step is 145
In the heat press set to ℃, 4
A pressure of ２2 kg / cm 2 is applied and heated and pressed for 600 seconds. Therefore, the pressure is changed to 10 to 8 kg / cm 2, and cooling and pressurizing are performed for 900 seconds while cooling the hot press with water. By this first heat pressing step, the IC module A is sufficiently embedded in the flexible PVC sheet 6, and the coil terminals 4a and 4b are embedded in the flexible PVC sheet 6 so as not to be seen from the surface.

FIG. 8 shows a pre-stage process for laminating the hard decorative sheets 7 and 8 on both sides of the soft PVC sheet 6 in which the IC module A is embedded. Back side (top side) of flexible PVC sheet 6 in which four IC modules A are embedded
Then, the positioning plate 17 is made to face. Positioning plate 17
Are formed in a predetermined array, and each of the positioning holes 17a has an IC.
By confirming that the module A is located, it can be confirmed that the four IC modules A are embedded without displacement.

Next, based on the outer shape of the positioning plate 17, the hard decorative sheet 7 is aligned on the front side (lower side), and the protective sheet 9 on the front side is further aligned. Temporarily fix it by applying a trowel to the location. Here, the alignment plate 17 is removed.
Then, based on the outer shape of the temporarily fixed hard decorative sheet 7, the hard decorative sheet 8 is aligned on the back side (upper side), and the protective sheet 10 on the rear side is further aligned. Temporarily fix it by applying a trowel to the four positions on the outer periphery.

FIG. 9 shows a second hot pressing step of laminating hard decorative sheets 7 and 8 on both sides of the soft PVC sheet 6 in which the IC module A is embedded. That is, the press plates 13 and 14 of the hot press machine are preferably hard plates made of stainless steel or the like, and the press surfaces are desirably mirror-finished. The soft PVC sheet 6 (IC module A in which the hard decorative sheet 7 and the protective sheet 9 and the hard decorative sheet 8 and the protective sheet 10 are temporarily fixed by the process of FIG. 8 is embedded between the press plates 13 and 14. ) Is sandwiched and heat-processed. The conditions of the second hot pressing step are as follows: a pressure of 12 to 10 kg / cm 2 is applied in a hot press set at 145 ° C.
Heat and press for 0 seconds. So 22 ~ 20kg / cm2
And pressurizing for 900 seconds while cooling the hot press with water. When the surface of the IC card is to be frosted, the press plates 13 and 14 may be matted instead of mirror-finished plates.
4 is a mirror plate, and the press plate and the protective sheet 1
Alternatively, heat processing may be performed with a non-adhesive satin-finished sheet interposed between 0 and 9. In this way, four IC cards are manufactured at a time, so that cutting the IC cards one by one completes the manufacture of the IC cards.

FIG. 10 shows another embodiment of the first hot pressing step described with reference to FIG. That is, the first release sheet 15, the IC module A, the soft PVC sheet 6, and the second release sheet 16 described with reference to FIG. Each time a hot press is performed. More specifically, each set B is sandwiched between mirror-surface plates 18, and this is attached to a highly rigid bending prevention plate 1.
A desired number of layers are laminated with 9 interposed. An upper cushion material set C and a lower cushion material set D are arranged above and below the entire laminated body with a rigid flaw prevention plate 20 interposed therebetween. The upper and lower cushion members C and D are formed by sandwiching a cushion member such as sponge or rubber between metal plates, and a handle is formed on the lower cushion member D.

The group thus stacked is positioned between each of the press plates 21, 22 and 23 of the hot press machine. Press. The conditions of the heat press at this time are:
It is the same as that described in the first hot pressing step, but it is desirable to lengthen the time depending on the number of layers. In this manner, a plurality of sets B are hot-pressed at one time, so that a large number of IC modules A can be embedded in the flexible PVC sheet 6 at the same time.

Next, another method of manufacturing an IC card according to the present invention will be described with reference to FIGS. FIG. 11 shows an IC (not shown) and other circuit elements 33... Mounted on a circuit board 31, and after covering the IC with a potting resin 32, both coil terminals 3 of a coil 34 for data transmission and reception are shown.
4a and 34b are connected to the connection terminals 31 on the circuit board 31, respectively.
a and 31b are shown. Circuit board 31
When connecting the coil 34 for data transmission / reception to the coil terminal 34a, a folded portion which is folded back from the same surface as the front side of the circuit board 31 in the opposite direction to the winding direction of the coil to one coil terminal 34a of the coil 34 The other coil terminal 34b forms a folded portion 34b1 that is folded back in a direction opposite to the coil winding direction from a middle height of the coil inside the coil 34 and pulled out. It is. The back surface of the circuit board 31 and the other surface of the coil 34 are set to the same level as in the previous embodiment.

In the state shown in FIG. 11, the side of the circuit board 31 to which the coil terminals 34a and 34b are not connected (the lower side) is in an unstable state. The IC module A is formed by using a positioning sheet according to the above. Hereinafter, similarly to the previous embodiment, the positioning sheet is heated using a positioning plate (not shown), melted by a trowel, and temporarily fixed to the soft PVC sheet 6 at a plurality of locations, and then the first heat is applied. The IC module A temporarily fixed to the flexible PVC sheet 6 in the pressing step is embedded in the flexible PVC sheet 6. In the first heat pressing step, the substrate 31 and the coil 34 of the circuit module A move mutually, due to the flow of the soft PVC sheet 6 generated when the circuit module A is heated and pressurized on the soft PVC sheet 6, and the coil is moved. The terminals 34a and 34b may be pulled. In this case, since the fusion force (not shown) of the coils around the folded portions 34a1 and 34b1 is weakened by heat, the bonding force between the coils is weakened.
When b is pulled, the fusion film is peeled off by the force within the elastic limit of the coil 34, and the coil 34 is peeled off from the position shown by the dotted line in FIG. 12 to the position shown by the solid line. That is, when the coil terminals 34a, 34b are pulled in the first heat pressing step, the periphery of the folded portions 34a1, 34b1 is peeled off before the coil terminals 34a, 34b are cut off, and the substrate 31 and the coil 34 move relatively. As a result, the tension applied to the coil terminals 34a and 34b is reduced, so that the coil 34 is hardly disconnected. After this step, an IC card is manufactured in the same manner as in the previous embodiment.

[0025]

According to the present invention, the IC module is embedded in the soft plastic sheet by hot pressing, and the insulating hard decorative sheet is laminated on both sides by hot pressing, so that another member such as a frame is unnecessary, and the manufacturing is easy. Yes, mass production is possible and cost can be reduced. Since the circuit board and the coil are fixed so as not to be displaced by the positioning sheet, the coil is not damaged in the first heat pressing step of embedding the IC module, and the production yield can be improved. Since a plurality of IC modules are temporarily fixed to one soft plastic sheet and then the first heat pressing step is performed, a plurality of IC modules can be simultaneously embedded without displacement and workability can be improved.

In the first hot pressing step, an IC
Since the first release sheet is behind the module and the second release sheet is behind the soft plastic sheet , the uneven IC module can be uniformly embedded in the soft plastic sheet . The quality of the circuit can be improved, and the circuit is not damaged because no excessive force is applied to the circuit at the time of release. Further, since the first hot pressing step is performed by stacking a plurality of sets in a state where the IC module and the soft plastic sheet are sandwiched between the release sheets, a plurality of sets can be laminated, so that the manufacturing can be efficiently performed.

Further, when connecting a coil for data transmission / reception to the circuit board, a folded portion is formed at both ends of the coil so as to be folded back in a direction opposite to the winding direction of the coil, so that the first hot pressing step is performed. soft up the circuit module in
Soft plastic generated when heating and pressing the plastic sheet
By the flow of sticks sheet, when the substrate and the coil of the circuit module is a coil terminal is pulled to move relative to each other, peeling fusing film around the folded portion of the coil by the force of the elastic limit of the coil, the coil Since the coil terminal is released, only a force within the elastic limit is applied to the coil terminal, so that the coil is hardly disconnected.

[Brief description of the drawings]

FIG. 1 is a partially cutaway front view showing an embodiment of an IC card manufactured according to the present invention.

FIG. 2 is an enlarged vertical sectional view of a main part of FIG.

3A and 3B show steps of a method of manufacturing an IC card according to the present invention, in which FIG. 3A is an enlarged sectional view showing a state of connection between a coil and a circuit board, and FIG. 3B is a front view.

FIG. 4 is a front view showing a step of connecting a coil and a circuit board using a positioning sheet to form an IC module.

FIG. 5 is a developed perspective view showing a step of arranging a plurality of IC modules on a soft plastic sheet.

FIG. 6 is a front view showing a step of temporarily fixing an IC module on a soft plastic sheet to the soft plastic sheet.

FIG. 7 is a cross-sectional view showing a step of embedding an IC module in a soft plastic sheet.

FIG. 8 is an exploded perspective view showing a step of aligning a plurality of IC modules embedded in a soft plastic sheet and joining hard decorative sheets to both surfaces thereof.

FIG. 9 is an enlarged sectional view of a part of the above.

FIG. 10 is a schematic diagram showing a method of embedding an IC module in a soft plastic sheet in a state where a large number of the modules are stacked and collectively.

FIG. 11 is a partially broken enlarged sectional view showing a state of a step of connecting a coil and a circuit board in another IC card manufacturing method of the present invention.

FIG. 12 is an enlarged partial view of a main part showing a step of embedding an IC module in a flexible plastic sheet in another IC card manufacturing method of the present invention.

[Explanation of symbols]

 Reference Signs List 1 circuit board 2 IC 4 coil 5 positioning sheet 6 soft plastic sheet 7, 8 hard decorative sheet 15 first release sheet 16 second release sheet 34a1, 34b1 folded portion A IC module B set

Claims (5)

(57) [Claims] 1. A connecting step of connecting a circuit board on which an IC is mounted to a coil for transmitting and receiving data to form an IC module, and the step of mounting the IC module on a soft plastic sheet with the surface on which the IC is mounted facing the soft plastic sheet. A first heat pressing step of pressurizing the IC module and the soft plastic sheet while heating and embedding the IC module in the soft plastic sheet; insulating both sides of the soft plastic sheet in which the IC module is embedded; A second heat pressing step of laminating the hard decorative sheet of the above, wherein the IC module connects the circuit board on which the IC is mounted to a coil for data transmission and reception, and positions the circuit board and the coil by a positioning sheet. A method for manufacturing an IC card, wherein the IC card is fixed so as not to be displaced. 2. The method according to claim 1, further comprising the step of positioning a plurality of the IC modules on one soft plastic sheet so as to face each other, and temporarily fixing the positioning sheet to the soft plastic sheet. Of manufacturing an IC card. 3. The method according to claim 1, wherein
The first hot pressing step is characterized in that the first hot pressing step is heat-processed by interposing a first release sheet behind the IC module and a second release sheet behind the soft plastic sheet. Card manufacturing method. 4. The heat processing step according to claim 3, wherein the first hot pressing step comprises laminating a plurality of sets in a state where the IC module and the soft plastic sheet are sandwiched between the release sheets. I characterized by
Manufacturing method of C card. 5. The coil according to claim 1, wherein when the coil for data transmission and reception is connected to the circuit board, a folded portion is formed at both ends of the coil so as to be folded back in a direction opposite to a winding direction of the coil. I characterized by
Manufacturing method of C card.