JP5219138B2 - Combination IC card and manufacturing method thereof - Google Patents

Description

  The present invention relates to an IC card used for various certificates, electronic settlement systems, door opening / closing systems, and the like, and a manufacturing method thereof, and more particularly, a combination IC card (contact type) having both contact type and non-contact type communication means. Type non-contact type common IC card) and a manufacturing method thereof.

  Currently, IC cards are roughly classified into two types according to the communication connection method with an external device. First, an IC module containing an IC chip is mounted on a card, the external device connection terminal of the IC module is exposed on the card surface, and communication is performed by connecting the external device connection terminal and the input terminal of the external device. It is a contact type IC card provided with contact type communication means. The other is a non-contact type IC card in which an antenna and an IC module are embedded in the card and provided with non-contact type communication means for performing wireless communication with an external device via radio waves.

  The contact type IC card requires a non-contact type IC card to embed an IC module inside the card, whereas the external device connection terminal portion of the IC module can be arranged on the card surface. It is possible to mount an IC chip having a higher function than a non-contact type IC card, and it is often used for an authentication system that requires high security such as a bank card or a credit card.

  Unlike a contact IC card that communicates via an external device connection terminal, a non-contact IC card can communicate with an external device at a remote location because it can communicate wirelessly via an antenna. In many cases, it is used for an entrance gate system of a transportation facility or a theme park without needing to connect an input terminal of an external device like a contact type IC card.

  In recent years, in response to the strong demand of the market to receive various services with a single card, the multi-function and high security of the IC card has been achieved, and it has the functions of both a contact IC card and a non-contact IC card. Combination IC cards (contact-type non-contact-type common IC cards) have been proposed and are becoming popular.

  Combination IC cards are often used for personal authentication such as employee cards, membership cards, and credit cards. Generally, face images and names for personal authentication are printed on the surface of a combination IC card. Yes. Printing on the card surface is often performed by using a dedicated printer in conjunction with information writing to the IC chip, and general printing methods include sublimation thermal transfer printing and hot melt thermal transfer printing. In general, considering the deformation of the card due to the heat of the sublimation type thermal transfer printing and heat melting type thermal transfer printing, the card is constituted by laminating a resin sheet having a high heat resistance temperature indicating the thermal characteristics of the resin sheet. Resin sheet with high temperature does not have suitability for sublimation thermal transfer printing and thermal fusion thermal transfer printing, and it is necessary to provide an image receiving layer with suitability for sublimation thermal transfer printing and thermal fusion thermal transfer printing on the card surface. is there.

  Japanese Patent Application Laid-Open Publication No. 2004-228561 discloses a combination IC card and a method for manufacturing the combination IC card that can increase the connection strength of the antenna coil and simplify the manufacturing process.

  The combination IC card described in Patent Document 1 includes an external device connection terminal, an antenna coil embedded in the card base, and an antenna coil connection terminal. The contact surface is cut so that the antenna coil connection terminal is exposed, and the connection between the IC module side antenna coil connection terminal and the card base side antenna coil connection terminal, which is fitted into the recess from the outside of the card base, and By using only the conductive adhesive material for bonding to the IC module contact surface, or by using the conductive adhesive material and the insulating adhesive material together, the connection strength of the antenna coil can be increased and the manufacturing process can be simplified.

  Also, in an IC card provided with an image receiving layer on the card surface for performing sublimation type thermal transfer printing and hot melt type thermal transfer printing, the heat resistance temperature produced so as not to cause thermal damage to the image receiving layer by the heat of laminating the resin sheets is Patent Document 2 discloses a non-contact type IC card with a high image receiving layer and a method for manufacturing the same.

  A non-contact type IC card with an image receiving layer described in Patent Document 2 includes a member forming a card base and a member for a card surface having an image receiving layer to which a face image is thermally transferred, and at least a member forming a card base Can be bonded at a low temperature by bonding the surface member to the surface member through an adhesive member made of a reactive hot melt resin, the thermal damage of the image receiving layer can be eliminated, and the curing reaction after bonding As the heat resistant temperature rises, an IC card with an image receiving layer having a high heat resistant temperature can be obtained.

JP 2000-182017 A JP 2000-137786 A

  A general combination IC card and a manufacturing method thereof are disclosed in, for example, Patent Document 1, in which both a contact type and a non-contact type communication function are provided on a card substrate in which an antenna coil is sandwiched between resin sheets and stacked. The concave portion for mounting the IC module for the combination IC card provided with is cut, the end of the antenna coil is exposed, the end of the antenna coil is joined to the IC module, and the IC module is placed in the concave portion provided on the card base. It is obtained by fitting and adhering to the card substrate via a thermoplastic adhesive.

  Furthermore, in order to provide an image receiving layer on a combination IC card, for example, as disclosed in Patent Document 2, a temperature at which the resin sheet is not deformed by heat when performing sublimation thermal transfer printing or heat melting thermal transfer printing on the image receiving layer. In other words, using a resin sheet with a high heat resistance temperature, the antenna coil is sandwiched between the resin sheets with a high heat resistance temperature provided with an image receiving layer via a reactive hot melt resin, and the image receiving layer deteriorates due to thermal damage. In addition, there is a method of laminating at a temperature at which ink for sublimation type thermal transfer printing or thermal fusion type thermal transfer printing cannot be received, that is, a temperature lower than the thermal deterioration temperature.

  In the combination IC card, it is necessary to cut a recess for mounting the IC module in the card base. Further, in order to connect the end of the antenna to the IC module, it is necessary to cut the end of the antenna embedded in the card base and expose it in the recess. Here, it is difficult to visually identify the end of the antenna embedded in the card base, and in general, the position embedded in the outer shape of the card base is specified. Therefore, the antenna of the card base does not flow when being sandwiched and laminated by the resin sheet, and must be embedded at the design position of the card base.

  However, the reactive hot melt resin used for laminating shows high heat resistance after curing, but when reacting by heating during laminating, it has the property of exhibiting fluidity like a general hot melt resin, There is a risk of being susceptible to misalignment of the card base antenna.

  In addition, when cutting the recesses on the card base, if different materials are laminated, cutting burrs tend to occur near the laminated boundary, and cutting is performed near the laminated boundary between the resin sheet and the reactive hot melt resin. Burr may occur. This cutting burr makes the fitting between the IC module and the concave portion of the card base insufficient, and there is a risk of causing poor bonding between the IC module and the end of the antenna.

  An object of the present invention is a combination IC card which solves the above-mentioned problems, comprises a card substrate with a resin sheet having a high heat-resistant temperature, and is provided with an image receiving layer on the card surface for performing sublimation thermal transfer printing and thermal fusion thermal transfer printing. And a method of manufacturing the same.

According to the present invention, an IC module including a contact communication unit and a non-contact communication unit and a card substrate in which an antenna for non-contact communication is sandwiched and laminated by a resin sheet, the recess is formed by cutting the card substrate. A combination IC card in which the end of the antenna is exposed and the IC module is fitted and mounted in the recess and the end of the antenna and the IC module are joined to each other. A combination IC card provided with an image receiving layer capable of sublimation type thermal transfer printing and / or heat melting type thermal transfer printing on at least one surface, wherein the first IC has a heat resistant temperature higher than the image receiving temperature of the image receiving layer. and a noncrystalline polyester-based resin sheet, wherein the image receiving layer has a thermal degradation temperature higher than the heating temperature at the time of stacking,且one said A second amorphous polyester resin sheet comprising a second amorphous polyester resin sheet having a heat resistant temperature of 35 ° C. or more lower than the heat temperature, wherein a plurality of the first amorphous polyester resin sheets are used as the second amorphous polyester resin sheet. A combination IC card characterized by being stacked via a card is obtained.

  Further, according to the present invention, the antenna for non-contact communication is sandwiched between the resin sheet and the adhesive sheet, the card base is obtained by thermocompression bonding, the card base is cut to provide the concave portion, and the end of the antenna is In the method of manufacturing a combination card in which an IC module that is exposed and includes contact communication means and non-contact communication means is fitted into the recess and attached, and the terminal of the antenna is joined to the IC module, the resin sheet is sublimated. The first non-crystalline polyester resin using the first non-crystalline polyester resin sheet having a heat resistance higher than the image receivable temperature of the image-receiving layer that enables mold heat transfer printing and / or heat melting type heat transfer printing The image receiving layer is printed on a sheet to produce a sheet with an image receiving layer, and the antenna is connected to the first non-crystalline polyester resin sheet. An embedded antenna sheet is produced, and a second amorphous polyester resin sheet having a heat resistance temperature lower than the heat deterioration temperature of the image receiving layer and lower by 35 ° C. or more than the heating temperature at the time of lamination is used for the adhesive sheet. After the antenna sheet is sandwiched between the second non-crystalline polyester resin sheets, the image receiving layer-attached sheet is further provided so that the surface without the image receiving layer is in contact with the second non-crystalline polyester resin sheet. A combination IC card manufacturing method is obtained, in which a card base is obtained by heating, pressurizing, and laminating at a temperature lower than the heat deterioration temperature of the image receiving layer.

  The present invention relates to a sheet with an image receiving layer in which an amorphous polyester resin sheet having self-bonding property that can be laminated between resin sheets by heating and pressurizing is used as a resin sheet constituting a card substrate, and an image receiving layer is provided. The first amorphous polyester resin sheet having a heat resistance higher than the image receivable temperature of the image receiving layer is used, and the adhesive sheet used for laminating the resin sheet is laminated at a temperature lower than the heat deterioration temperature of the image receiving layer. By using a second amorphous polyester resin sheet having a heat resistance temperature lower by 35 ° C. or more than the heating temperature at the time, and laminating at a temperature lower than the thermal deterioration temperature of the image receiving layer provided on the card surface, It is possible to prevent the printing characteristics of the image receiving layer from deteriorating and to prevent the occurrence of cutting burrs when cutting the concave portion for the IC module on the card base material. Engaged securely fitted in the recess of de base, the junction between the end of the IC module and the antenna can be reliably performed.

  In the present invention, an amorphous polyester-based resin sheet that causes the resin sheet itself to be fused by heating and pressurizing the resin sheet constituting the card base, and an image receiving layer-provided sheet and an antenna are embedded. The non-crystalline polyester resin sheet having a heat resistance higher than the image receivable temperature of the image receiving layer is used for the antenna sheet, and the temperature between the sheet with the image receiving layer and the antenna sheet is lower than the heat deterioration temperature of the image receiving layer. In addition, sandwiching an amorphous polyester resin sheet having a heat resistance lower by 35 ° C. or more than the heating temperature at the time of lamination, heating at a temperature not higher than the thermal degradation temperature of the image receiving layer, and pressurizing, heat damage to the image receiving layer Without deterioration, printing characteristic deterioration due to heat can be prevented.

  Further, in the present invention, the resin sheet is laminated without using a conventional reactive hot-melt resin sheet, but using an amorphous polyester tree sheet having a heat resistance temperature lower than the heat deterioration temperature of the image receiving layer, By laminating a non-crystalline polyester resin sheet having a heat resistance higher than the image receivable temperature, it is possible to prevent the occurrence of cutting burrs when cutting the concave portion for the IC module on the card base. The IC module and the end of the antenna can be reliably joined by reliably fitting into the recess of the base.

According to the present invention, the first non-crystalline polyester resin sheet having a higher heat resistance temperature than the image-receivable temperature of the image receiving layer, at a lower thermal degradation temperature of the image receiving layer temperature, and 35 ° C. than the heating temperature at the time of stacking Through the second non-crystalline polyester resin sheet having a low heat-resistant temperature, the image receiving layer has no image quality deterioration due to heat by heating and pressing at a temperature lower than the heat deterioration temperature of the image receiving layer. , A combination IC card in which the joining of the IC module and the end of the antenna is reliable, and a method for manufacturing the same are obtained.

  With reference to the drawings, the combination card of the present invention and the manufacturing method thereof will be described.

  First, the combination card of the present invention will be described. FIG. 1 is a diagram for explaining a combination card of the present invention. The combination card 1 has an IC module 3 installed on the surface of a card base 304 in which an antenna 2 is embedded, and electrically connects the end of the antenna 2 and the IC module 3.

  FIG. 2 is a partial cross-sectional view taken along the line AA in FIG. The combination card is provided with an adhesive sheet 12a and an adhesive sheet 12b on which resin sheets are laminated on both sides of the antenna 2a, antenna 2b, antenna end 19c and antenna sheet 13 embedded with the antenna end 19d. An image receiving layer 9a and an image receiving layer 9b on which the image receiving layer 9a and the image receiving layer 9b are printed are provided on the pattern printing unit 10a and the pattern printing unit 10b provided on the sheet to form a card base, and an external device connection terminal 4. The IC module 3 including the IC module substrate 16, the resin sealing portion 5, the antenna connection terminal 6a and the antenna connection terminal 6b is mounted on the card base with the thermoplastic adhesive 8a and the thermoplastic adhesive 8b, and the antenna The end 19c, the end 19d of the antenna, the antenna connection terminal 6a, and the antenna The Na connection terminal 6b, fabricated in solder bonding a solder paste 7a and the solder paste 7b.

Antenna sheet 13, a non-crystalline polyester antenna route the copper to the resin sheet in a loop to produce embedded by thermal compression bonding. The non - crystalline polyester resin sheet is preferably a non- crystalline polyester resin sheet having a high heat resistance temperature in consideration of thermal deformation during processing, and a card substrate in consideration of cutting burrs when cutting the concave portion for an IC module. It is desirable that the non- crystalline polyester resin sheet is the same as the non- crystalline polyester resin sheet of the other part constituting the structure. Furthermore, any non- crystalline polyester resin sheet having self-bonding property may be used, and it is preferable to select as appropriate. For example, a commercially available non- crystalline polyester resin sheet mixed with 40% or more of a polycarbonate resin in order to improve heat resistance can be used.

The image-receiving layer-attached sheet 11a and the image-receiving-layer-attached sheet 11b are provided with a pattern printing unit 10a and a pattern printing unit 10b on a resin sheet by an offset printing method or a silk screen printing method, and then a silk screen printing method or gravure printing thereon. The image receiving layer 9a and the image receiving layer 9b are printed by a method. The resin sheet is preferably a non- crystalline polyester resin sheet having a heat resistance higher than the image receivable temperature of the image receiving layer, considering the heat when performing sublimation thermal transfer printing and heat melting thermal transfer printing on the image receiving layer, Considering cutting burrs when cutting the IC module recess, it is desirable that the non- crystalline polyester resin sheet is the same as the non- crystalline polyester resin sheet of the other part constituting the card base. Furthermore, any non- crystalline polyester resin sheet having self-bonding property may be used, and it is preferable to select as appropriate. For example, a commercially available non- crystalline polyester resin sheet mixed with 40% or more of a polycarbonate resin in order to improve heat resistance can be used.

The adhesive sheet 12a, the adhesive sheet 12b, the antenna sheet 13, the image receiving layer-attached sheet 11a and the image receiving layer-attached sheet 11b may be any adhesive sheet and resin sheet that can be laminated at a temperature lower than the thermal degradation temperature of the image receiving layer. In consideration of cutting burrs when cutting the IC module recess, it is desirable that the adhesive sheet 12a, the adhesive sheet 12b, the antenna sheet 13, the image receiving layer-attached sheet 11a, and the image receiving layer-attached sheet 11b be similar resin sheets. Furthermore, any resin sheet having self-bonding property may be used, and it is preferable to select appropriately. For example, an amorphous polyester resin sheet in which less than 40% of a polycarbonate resin is mixed to increase heat resistance can be used.

  The IC module may be any combination card IC module having the functions shown below, and a commercially available combination card IC module can be used, and it is preferable to select as appropriate.

  FIG. 4 is a diagram illustrating the IC module of the present invention, and FIG. 4A is a diagram illustrating the surface of the IC module. The surface of the IC module is formed by providing external device connection terminals 41, 42, 43, 44, 45, 46, 47, 48 on the IC module substrate 16.

  FIG. 4B is a diagram illustrating the back surface of the IC module. The back surface of the IC module is electrically connected to the IC chip 14 mounted on the IC module substrate 16 with the antenna connection terminal 6a and the antenna connection terminal 6b provided on the IC module substrate 16 through the bonding wire 15a and the bonding wire 15b. After that, the resin sealing portion 5 is provided by resin sealing, and the thermoplastic adhesive 8 is provided on the IC module substrate 16.

  FIG.4 (c) is sectional drawing along CC line of Fig.4 (a) and FIG.4 (b). The IC module is provided with the external device connection terminal 4 on one surface of the IC module substrate 16, and the IC chip 14, the antenna connection terminal 6a, the antenna connection terminal 6b, the bonding wire 15a, on the other surface of the IC module substrate 16. A bonding wire 15b, a resin sealing portion 5, a thermoplastic adhesive 8a, and a thermoplastic adhesive 8b are provided. Furthermore, the IC chip 14 and the external device connection terminal 4 are electrically joined through a substrate circuit pattern and a through hole (not shown) of the IC module substrate 16.

  Next, the manufacturing method of the combination card of this invention is demonstrated. The method for manufacturing a combination card of the present invention mainly includes a card base manufacturing process, a recess cutting process, and an IC module joining process.

  First, a card base is produced in the card base manufacturing process. FIG. 3 is a diagram for explaining the card substrate manufacturing process of the present invention, and FIG. 3 (a) is a diagram for explaining the card substrate 301. The card base 301 has a card outer shape defined by JISX6301 and is manufactured by drawing the end of the antenna 2 to the mounting position of the IC module specified by JISX6303 and embedding the loop antenna 2 inside.

  FIG.3 (b) is sectional drawing along the BB line of Fig.3 (a). The adhesive sheet 12a and the adhesive sheet 12b are superimposed on both sides of the antenna sheet 13 in which the antenna 2a, the antenna 2b, the antenna 2c, the antenna 2d, the antenna end 19a and the antenna end 19b, that is, the antenna sheet 13 in which the antenna 2 is embedded, Furthermore, after printing the pattern printing unit 10a and the pattern printing unit 10b on the resin sheet in advance, the image receiving layer 9a and the image receiving layer 9b on which the image receiving layer 9a and the image receiving layer 9b are printed, The image receiving layer 9a and the image receiving layer 9b are overlapped so that they are the outermost layers, heated using a heat press machine (not shown) at a temperature lower than the heat deterioration temperature of the image receiving layer, pressurized, and then subjected to JIS X6301 using a card punching machine (not shown). The card base 301 is manufactured by punching out the card outer shape defined in the above.

  Next, in the recess cutting process, the IC module recess and the solder paste filling recess are cut in the card base 301. FIG. 5 is a diagram for explaining the recess cutting process of the present invention. FIG. 5A is a cross-sectional view illustrating the card base 301 and shows the card base manufactured in the card base manufacturing process. FIG. 5B is a cross-sectional view for explaining a card base 302 in which an IC module recess is provided in the card base 301. FIG. 5C is a cross-sectional view illustrating a card base 303 in which a recess for filling solder paste is provided in the card base 302.

  In the recess cutting process, a cutting machine (not shown) is mounted at the mounting position of the IC module defined in JIS X6303 of the card base 301 in which the antenna 2a, antenna 2b, antenna 2c, antenna 2d, antenna end 19a and antenna end 19b are embedded. Then, the IC module recess 17 is provided to cut the IC module according to the shape of the IC module, and the card base 302 is manufactured. Further, the IC module recess 17 of the card base 302 has the antenna end 19a and the antenna end 19b. The solder paste filling concavity 18a and the solder paste filling concavity 18b for filling the solder paste for joining the IC module and the antenna are cut and provided, and the antenna end 19a and the antenna end are provided. 19b was cut to expose the copper wire part. To prepare a terminal 19c and the antenna terminal 19d, to produce a card base 303.

  Finally, in the IC module joining step, the IC module is mounted on the card base 303 and the antenna and the IC module are joined. FIG. 6 is a diagram for explaining the IC module joining step of the present invention. FIG. 6A is a cross-sectional view for explaining the card base 303 and shows a card base having a concave portion for IC module and a concave portion for filling with solder paste manufactured by a concave cutting process. FIG. 6B is a cross-sectional view of the card base 304 in which the solder paste filling recess is filled with the solder paste. FIG. 6C is a cross-sectional view of the IC module 3 and the card base 304 showing a state in which the IC module is mounted in the IC module recess. The IC module is fitted into the IC module recess and the filled solder is interposed. In this state, the antenna and the IC module are soldered together, and the IC module and the card base 303 are fixed through a thermoplastic adhesive provided on the IC module.

  In the IC module joining step, the antenna 2a, the antenna 2b, the antenna 2c, the antenna 2d, the antenna end 19c and the antenna end 19d are embedded, and the IC module recess 17, the solder paste filling recess 18a, and the solder paste filling recess 18b. In the card base 303 provided with the solder paste filling recess 18a and the solder paste filling recess 18b, the solder paste 7a and the solder paste 7b are filled to produce the card base 304, and then the external device connection terminal 4 and the IC module substrate. 16, the IC module 3 including the resin sealing portion 5, the antenna connection terminal 6a, and the antenna connection terminal 6b is inserted into the IC module recess 17. Subsequently, a heating jig (not shown) is pressed against the external device connection terminal 4 and heated and pressurized to melt the solder paste 7a and the solder paste 7b, and the antenna connection terminal 6a, the antenna end 19c, and the antenna end 19d The antenna connection terminal 6b is soldered and the thermoplastic adhesive 8a and the thermoplastic adhesive 8b are melted by the heat of a heating jig (not shown) to fix the IC module substrate 16 to the IC module concave portion 17 so that the combination card is Make it.

  Embodiments of the present invention will be described below with reference to the drawings.

  In the present invention, a commercially available combination card IC module having the function shown in FIG. 4 already described above is used. The IC module has a total thickness of 280 μm including the external device connection terminal 4 and the IC module substrate 16 made of a glass epoxy substrate. The IC module substrate 16 has a width dimension of 12 mm and a length dimension of 14 mm. Further, the resin sealing portion 5 has a thickness of 320 μm, a width-direction dimension of 8 mm, and a length-direction dimension of 8 mm. Moreover, the hot-melt-adhesive sheet | seat was used for the thermoplastic adhesive 8, the thermoplastic adhesive 8a, and the thermoplastic adhesive 8b.

Next, the image-receiving layer-attached sheet 11a and the image-receiving-layer-attached sheet 11b shown in FIG. 3 described above are made of a vinyl acetate resin having an image receiving temperature of 60 ° C. and a heat deterioration temperature of 150 ° C. The resin sheet having an image-receiving layer ink and having a heat resistance higher than the image-receiving temperature of 60 ° C. of the image-receiving layer is 40% of a polycarbonate resin among non- crystalline polyester resin sheets called PET-G sheets. A commercially available PET-G sheet with a heat resistant temperature raised to 105 ° C. by mixing 50% or less was used.

  The sheet 11a with the image receiving layer and the sheet 11b with the image receiving layer have a thickness of 200 μm, a width dimension of 90 mm, a length dimension of 140 mm, and a heat resistant temperature of 105 ° C. After the pattern printing unit 10a and the pattern printing unit 10b are provided by the offset printing method, the image receiving layer ink is printed on the pattern printing unit 10a and the pattern printing unit 10b by the silk screen printing method, and the image receiving layer 9a and the image receiving layer 9b are formed. Provided.

  Next, the antenna sheet 13 shown in FIG. 3, which has already been described above, has a thickness of 200 μm, a widthwise dimension of 90 mm, and a lengthwise direction, similar to the sheet 11a with the image receiving layer and the sheet 11b with the image receiving layer. A commercially available urethane-coated copper wire with a wire diameter of 100 μm is wound around a PET-G sheet having a dimension of 140 mm and a heat resistant temperature of 105 ° C. in a loop shape, heated at a temperature of 100 ° C., and at a pressure of 0.8 MPa. Pressurized and embedded to produce.

  Next, for the adhesive sheet 12a and adhesive sheet 12b shown in FIG. 3 already described above, a resin similar to the PET-G sheet having a heat resistant temperature of 105 ° C. is used, and less than 40% of a polycarbonate resin is mixed. 8 levels of PET-G sheets having different heat resistance temperatures of 100 ° C., having heat resistance temperatures of 60 ° C., 65 ° C., 70 ° C., 75 ° C., 80 ° C., 85 ° C., 90 ° C., and 95 ° C. Yes, a sheet having a width dimension of 90 mm and a length dimension of 140 mm was prepared and used for stacking card bases for each level.

  Next, as shown in FIG. 3 already described above, after sandwiching both sides of the antenna sheet 13 with the adhesive sheet 12a and the adhesive sheet 12b, the adhesive sheet 12a and the adhesive sheet 12b are provided with a surface on which no image receiving layer is printed. Then, the image-receiving layer-attached sheet 11a and the image-receiving-layer-attached sheet 11b are stacked, heated at a temperature of 120 ° C., pressurized and laminated at a pressure of 6 MPa, and the length dimension is 85. A card base 301 was manufactured by punching into a card having a width of 60 mm and a dimension in the width direction of 54.00 mm. According to the JIS standard, the dimensions of the IC card are 85.47 mm to 85.72 mm in the length direction and 53.92 mm to 54.03 mm in the width direction.

  In the production of the card base 301, the above-described 8-level PET-G sheet having different heat-resistant temperatures is used as an adhesive sheet, and the card base 301 is prepared for each level by the above-described manufacturing method. did.

  Next, as shown in FIG. 5 described above, the center point of the mounting position of the IC module on the card base 301 is determined in accordance with the position of the external device connection terminal in the contact IC card specified in JIS X6303. The calculated center position of the IC module mounting position and the center of the IC module recess 17 to be cut are aligned, the width dimension is 12 mm, the length dimension is 14 mm, and from the surface of the card base 301. After the recess having a depth of 280 μm is cut, the center of the recess to be cut is similarly aligned, the width dimension is 8 mm, the length dimension is 8 mm, and the depth from the surface of the card base 301 is A card base 302 was manufactured by cutting a recess having a length of 600 μm and providing an IC module recess 17 matched to the shape of the IC module.

  Subsequently, a recess having a diameter of 3 mm and a depth of 120 μm is cut at a position where the antenna end 19 a and the antenna end 19 b are embedded in the IC module recess 17 of the card base 302, and a solder paste filling recess 18 a is formed. And the solder paste filling recess 18b, and the antenna end 19a and the antenna end 19b are cut to produce the antenna end 19c and the antenna end 19d with the copper wire exposed, thereby producing the card base 303. did.

  Further, the 8-level card base 301 produced by using the above-described 8-level PET-G sheet having different heat-resistant temperatures as the adhesive sheet in the manufacturing method of the card base 302 is cut, and the IC module recess 17 and the solder are cut. A paste filling recess 18a and a solder paste filling recess 18b were provided to produce an eight-level card base 303.

  In the present embodiment, the above-mentioned eight-level card bases 303 are produced 100 per level, and the card bases 303 are visually checked one by one, and the IC module recess 17, the solder paste filling recess 18 a and the solder paste. The presence or absence of cutting burrs in the filling recess 18b was examined.

  Table 1 shows the results of examining the presence or absence of cutting burrs in the IC module recesses 17 of the above-mentioned eight-level card base 303 in terms of the occurrence rate of cutting burrs for each heat-resistant temperature level of the PET-G sheet for adhesive sheets. It is a representation. From the results of the experiment, the adhesive sheet is a PET-G sheet having a heat resistance temperature of 90 ° C. or higher under the lamination conditions in which the heat resistance temperature of the PET-G sheet to be laminated is 105 ° C. and the heating temperature at the time of lamination is 120 ° C. In some cases, it was found that the lamination between the PET-G sheets was insufficient, and cutting burrs accompanied by separation between sheets were generated. It was also found that cutting burrs would not occur if the heat-resistant temperature of the PET-G sheet used as the adhesive sheet was 85 ° C. or lower. That is, it was found that if a PET-G sheet having a heat resistant temperature lower by 35 ° C. or more than the heating temperature at the time of lamination is used as the adhesive sheet, the lamination between the PET-G sheets is sufficient and no cutting burrs are generated.

  Next, as shown in FIG. 6 described above, the solder paste filling recess 18a and the solder paste filling recess 18b of the card base 303 are filled with a low-temperature solder paste having a melting point of 95 ° C., and the solder paste 7a. Then, the solder paste 7b was provided to produce the card base 304, and then the IC module 3 was inserted into the IC module recess 17. Subsequently, a heating jig (not shown) is applied to the external device connection terminal 4, the jig temperature of the heating jig is set to 180 ° C., and pressed for 10 seconds at a pressure of 0.1 MPa to melt the solder paste 7a and the solder paste 7b, thereby connecting the antenna. A thermoplastic adhesive 8a made of EVA (ethylene vinyl acetate copolymer) hot melt having a softening point of 95 ° C. and solder-bonding the terminal 6a to the antenna end 19c, and the antenna end 19d and the antenna connection terminal 6b, and The thermoplastic adhesive 8b was melted, and the IC module substrate 16 was fixed to the IC module recess 17 to produce a combination card.

  Further, in this example, 100 eight-level combination cards were produced for each level, contactless communication of the combination cards was performed, and the presence or absence of solder joint failure between the IC module and the antenna was examined.

  Table 2 shows the results of examining the presence or absence of solder joint failure between the IC module and the antenna of the above-mentioned eight-level combination card, for each level of heat resistance temperature of the PET-G sheet for adhesive sheets. It is expressed as a rate. As a result of the experiment, in a combination card using a PET-G sheet having a heat-resistant temperature of 90 ° C. or more as an adhesive sheet in which cutting burrs have occurred, a bonding failure may occur in the solder bonding between the IC module and the antenna. I understood. Further, it was found that in a combination card using a PET-G sheet having a heat-resistant temperature of 85 ° C. or less and no cutting burrs as an adhesive sheet, no bonding failure occurs in solder bonding between the IC module and the antenna. In other words, it was found that if the occurrence of cutting burrs in the IC module recess 17 is prevented, the solder bonding between the IC module of the combination card and the antenna can be ensured.

(Comparative example)
The comparative example is a urethane-based moisture that can start the curing reaction at the heating temperature and pressure in the lamination of the example instead of the adhesive sheet composed of an amorphous polyester-based resin sheet mixed with less than 40% of the polycarbonate resin of the example. The combination card of the comparative example is processed in the card substrate manufacturing process, the concave cutting process and the IC module joining process, as in the example, except that a reactive hot melt resin sheet made of a curable hot melt is used. Was made.

  FIG. 7 is a diagram for explaining a combination card of a comparative example. The combination card 111 was manufactured by embedding the antenna 2 in the card base 704 and installing the IC module 3 at a position where the end of the antenna 2 of the card base 704 was buried.

  FIG. 8 is a partial cross-sectional view taken along line EE of FIG. The combination card of the comparative example is centered on the antenna sheet 13 in which the antenna 2a, the antenna 2b, the end 19c of the antenna and the end 19d of the antenna are embedded in a PET-G sheet having a heat resistant temperature of 105 ° C., and urethane-based on both sides thereof. The pattern printing unit 10a and the pattern printing unit 10b are sandwiched between a reactive hot melt resin sheet 712a and a reactive hot melt resin sheet 712b made of moisture-curing hot melt resin, and further, a PET-G sheet having a heat resistant temperature of 105 ° C. After printing, the image-receiving layer-attached sheet 11a provided with the image-receiving layer 9a and the image-receiving layer 9b by printing an image-receiving layer ink made of a vinyl acetate resin having an image receiving temperature of 60 ° C. and a heat deterioration temperature of 150 ° C. The image receiving layer-attached sheet 11b was stacked, heated, and pressurized to produce a card substrate 701.

  Further, the card base 701 was cut to provide the IC module recess 17. As a result, a cutting burr 99a and a cutting burr 99b were generated in the vicinity of the reactive hot melt resin sheet 712a and the reactive hot melt resin sheet 712b. Subsequently, the recess 19 for filling the IC module recess 17 with the solder paste 7a and the solder paste 7b was cut, and the end 19c of the antenna and the end 19d of the antenna were exposed by cutting to expose the copper wire portion.

  Next, a recess for filling the solder paste 7a and the solder paste 7b is filled with a low-temperature solder paste having a melting point of 95 ° C. to provide the solder paste 7a and the solder paste 7b, and the IC module recess 17 is connected to an external device. The IC module 3 including the terminal 4, the IC module substrate 16, the resin sealing portion 5, the antenna connection terminal 6a, and the antenna connection terminal 6b is inserted, and a heating jig (not shown) is connected to the external device connection terminal 4 to fix the heating jig. The tool temperature was set to 180 ° C. and pressed for 10 seconds at a pressure of 0.1 MPa.

  As a result, the cutting burr 99a and the cutting burr 99b prevent the IC module 3 and the IC module recess 17 from being fitted, and the solder paste 7a and the solder paste 7b can be brought into contact with the antenna connection terminal 6a and the antenna connection terminal 6b. It cannot be done and solder joint is not made. Further, the thermoplastic adhesive 8a and the thermoplastic adhesive 8b made of EVA (ethylene vinyl acetate copolymer) hot melt having a softening point of 95 ° C. are melted, and the IC module substrate 16 is bonded to the IC module recess 17. However, it is not the adhesion to the cutting surface of the IC module recess 17 provided with the solder paste 7a and the solder paste 7b, but the adhesion to the side surface of the IC module recess 17 including the cutting burr 99a and the cutting burr 99b. It was found that the adhesive strength was not ensured.

From the above comparison, in the method of manufacturing a combination IC card using a conventional reactive hot-melt resin sheet and laminating a non- crystalline polyester resin sheet having a heat-resistant temperature provided with an image receiving layer, the printing characteristics deteriorate due to heat. A first non- crystalline property having a heat resistant temperature higher than the image receivable temperature of the image receiving layer of the present invention, although it is impossible to produce a combination IC card having a non-image receiving layer and reliable joining of the IC module and the end of the antenna The heat of the image receiving layer is passed through the second non-crystalline polyester resin sheet having a heat resistance temperature lower than the heat deterioration temperature of the image receiving layer and 35 ° C. lower than the heating temperature at the time of lamination. In the method of manufacturing a combination IC card that is heated and pressed at a temperature equal to or lower than the deterioration temperature, the image receiving layer has no print characteristic deterioration due to heat. Combination IC card junction with the ends of the IC module and the antenna is reliable could be produced.

  The embodiment of the present invention has been described above with reference to the drawings. However, the present invention is not limited to this embodiment, and the present invention can be changed even if there are changes in members and configurations without departing from the spirit of the present invention. include. That is, it goes without saying that the present invention also includes various modifications and corrections that would be obvious to those skilled in the art.

The figure explaining the combination card of this invention. FIG. 2 is a partial cross-sectional view taken along line AA in FIG. 1. FIG. 3A is a diagram for explaining a card substrate manufacturing process of the present invention, FIG. 3A is a diagram for explaining a card substrate, and FIG. 3B is a cross-sectional view taken along line BB in FIG. FIG. 4A is a diagram illustrating the front surface of the IC module, FIG. 4B is a diagram illustrating the back surface of the IC module, and FIG. 4C is FIG. 4A. And sectional drawing along CC line of FIG.4 (b). FIG. 5A is a cross-sectional view illustrating a card base, FIG. 5B is a cross-sectional view illustrating a card base provided with a concave portion for an IC module, and FIG. FIG. 5C is a cross-sectional view illustrating a card substrate in which a solder paste filling recess is provided on the card substrate. FIG. 6A is a cross-sectional view illustrating a card substrate, FIG. 6B is a cross-sectional view of a card substrate in which a solder paste filling recess is filled with solder paste, and FIG. FIG. 6C is a cross-sectional view of the IC module and the card substrate showing a state where the IC module is mounted in the IC module recess. The figure explaining the combination card of a comparative example. The fragmentary sectional view in alignment with the EE line of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,111 Combination card 2, 2a, 2b, 2c, 2d Antenna 3 IC module 4, 41, 42, 43, 44, 45, 46, 47, 48 External apparatus connection terminal 5 Resin sealing part 6a, 6b Antenna connection terminal 7a, 7b Solder paste 8, 8a, 8b Thermoplastic adhesives 9a, 9b Image receiving layers 10a, 10b Image printing portions 11a, 11b Image receiving layer-attached sheets 12a, 12b Adhesive sheets 13 Antenna sheets 14 IC chips 15a, 15b Bonding wires 16 IC Module substrate 17 IC module recesses 18a, 18b Solder paste filling recesses 19a, 19b, 19c, 19d Antenna ends 99a, 99b Cutting burrs 301, 302, 303, 304, 701, 704 Card base 712a, 712b Reactive hot melt Resin sheet

Claims (2)

An IC module provided with contact communication means and non-contact communication means, and a card base in which an antenna for non-contact communication is sandwiched between resin sheets and stacked, and the card base is cut to provide a recess and at the end of the antenna In a combination IC card in which the IC module is fitted and mounted in the recess and the IC module is joined to the IC module, on at least one of the front and back surfaces of the card base, A first non-crystalline polyester resin having a heat resistance higher than the image receivable temperature of the image receiving layer, which is a combination IC card provided with an image receiving layer capable of performing sublimation thermal transfer printing and / or heat melting thermal transfer printing a sheet, said image-receiving layer has a thermal degradation temperature higher than the heating temperature at the time of stacking, 35 from且one said heating temperature It consists of a second non-crystalline polyester resin sheet having a low heat-resistant temperature, and a plurality of the first non-crystalline polyester resin sheets are laminated via the second non-crystalline polyester resin sheet. Combination IC card characterized by this. An antenna for non-contact communication is sandwiched between a resin sheet and an adhesive sheet, and a card base is obtained by thermocompression bonding. The card base is cut to provide a recess, and the end of the antenna is exposed, and contact communication means and non-contact communication In a method of manufacturing a combination IC card in which an IC module having contact communication means is fitted in the recess and attached, and the terminal of the antenna and the IC module are joined together, sublimation thermal transfer printing and / or heat is applied to the resin sheet. Printing the image-receiving layer on the first non-crystalline polyester resin sheet using a first non-crystalline polyester resin sheet having a heat resistance higher than the image-receiving temperature of the image-receiving layer that enables melt-type thermal transfer printing To prepare a sheet with an image receiving layer, and the antenna is embedded in the first non-crystalline polyester resin sheet A second non-crystalline polyester resin sheet having a heat resistance lower than the heat deterioration temperature of the image receiving layer and 35 ° C. lower than the heating temperature at the time of lamination for the adhesive sheet, After sandwiching the antenna sheet with the second non-crystalline polyester resin sheet, the surface without the image receiving layer is further in contact with the second non-crystalline polyester resin sheet with the image receiving layer-attached sheet. A method of manufacturing a combination IC card, characterized in that it is sandwiched, heated at a temperature not higher than the heat deterioration temperature of the image receiving layer, pressurized, and laminated to obtain a card substrate.

Images