JPH052690B2 - - Google Patents
Info
- Publication number
- JPH052690B2 JPH052690B2 JP22005384A JP22005384A JPH052690B2 JP H052690 B2 JPH052690 B2 JP H052690B2 JP 22005384 A JP22005384 A JP 22005384A JP 22005384 A JP22005384 A JP 22005384A JP H052690 B2 JPH052690 B2 JP H052690B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- methylimidazole
- epoxy resin
- curing agent
- terpene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 42
- 239000011347 resin Substances 0.000 claims description 42
- 239000003822 epoxy resin Substances 0.000 claims description 29
- 229920000647 polyepoxide Polymers 0.000 claims description 29
- 239000003795 chemical substances by application Substances 0.000 claims description 22
- 235000007586 terpenes Nutrition 0.000 claims description 21
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 20
- 150000003505 terpenes Chemical class 0.000 claims description 20
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 18
- 239000008096 xylene Substances 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 description 12
- 238000003860 storage Methods 0.000 description 10
- 239000000843 powder Substances 0.000 description 8
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- -1 boron trifluoride amine Chemical class 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000004570 mortar (masonry) Substances 0.000 description 2
- 229910015900 BF3 Inorganic materials 0.000 description 1
- 239000000899 Gutta-Percha Substances 0.000 description 1
- 240000000342 Palaquium gutta Species 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Substances FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 229920000588 gutta-percha Polymers 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22005384A JPS6197321A (ja) | 1984-10-18 | 1984-10-18 | エポキシ樹脂用硬化剤の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22005384A JPS6197321A (ja) | 1984-10-18 | 1984-10-18 | エポキシ樹脂用硬化剤の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6197321A JPS6197321A (ja) | 1986-05-15 |
| JPH052690B2 true JPH052690B2 (fr) | 1993-01-13 |
Family
ID=16745187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22005384A Granted JPS6197321A (ja) | 1984-10-18 | 1984-10-18 | エポキシ樹脂用硬化剤の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6197321A (fr) |
-
1984
- 1984-10-18 JP JP22005384A patent/JPS6197321A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6197321A (ja) | 1986-05-15 |
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