JPH0526759Y2 - - Google Patents

Info

Publication number
JPH0526759Y2
JPH0526759Y2 JP1987082912U JP8291287U JPH0526759Y2 JP H0526759 Y2 JPH0526759 Y2 JP H0526759Y2 JP 1987082912 U JP1987082912 U JP 1987082912U JP 8291287 U JP8291287 U JP 8291287U JP H0526759 Y2 JPH0526759 Y2 JP H0526759Y2
Authority
JP
Japan
Prior art keywords
lead
leads
end portion
semiconductor chip
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987082912U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63191647U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987082912U priority Critical patent/JPH0526759Y2/ja
Publication of JPS63191647U publication Critical patent/JPS63191647U/ja
Application granted granted Critical
Publication of JPH0526759Y2 publication Critical patent/JPH0526759Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/50
    • H10W72/884
    • H10W90/736
    • H10W90/756
JP1987082912U 1987-05-29 1987-05-29 Expired - Lifetime JPH0526759Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987082912U JPH0526759Y2 (enExample) 1987-05-29 1987-05-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987082912U JPH0526759Y2 (enExample) 1987-05-29 1987-05-29

Publications (2)

Publication Number Publication Date
JPS63191647U JPS63191647U (enExample) 1988-12-09
JPH0526759Y2 true JPH0526759Y2 (enExample) 1993-07-07

Family

ID=30936002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987082912U Expired - Lifetime JPH0526759Y2 (enExample) 1987-05-29 1987-05-29

Country Status (1)

Country Link
JP (1) JPH0526759Y2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2782717B2 (ja) * 1988-04-26 1998-08-06 岩崎電気株式会社 発光ダイオード
EP0400176B1 (de) * 1989-05-31 2000-07-26 Osram Opto Semiconductors GmbH & Co. OHG Verfahren zum Montieren eines oberflächenmontierbaren Opto-Bauelements
JP3992301B2 (ja) * 1995-04-26 2007-10-17 シチズン電子株式会社 チップ型発光ダイオード
WO2004093204A1 (ja) * 2003-04-16 2004-10-28 Tabuchi Electric Co., Ltd. 反射型発光ダイオード
EP2674973B1 (en) 2011-02-09 2019-12-11 Mitsubishi Electric Corporation Power semiconductor module

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5614585U (enExample) * 1979-07-16 1981-02-07
US4529902A (en) * 1982-09-01 1985-07-16 Powertron Division Of Contraves Goerz Corp. Frame module for forming tubular frame of permanent magnet direct current motor

Also Published As

Publication number Publication date
JPS63191647U (enExample) 1988-12-09

Similar Documents

Publication Publication Date Title
US5874784A (en) Semiconductor device having external connection terminals provided on an interconnection plate and fabrication process therefor
US7443022B2 (en) Board-on-chip packages
US6700188B2 (en) Low-pin-count chip package having concave die pad and/or connections pads
KR100440416B1 (ko) 반도체 디바이스
KR0169274B1 (ko) 반도체장치 및 그 제조방법
JP3509274B2 (ja) 樹脂封止型半導体装置およびその製造方法
JPH06105721B2 (ja) 半導体装置
JPWO1998001907A1 (ja) 樹脂封止型半導体装置およびその製造方法
JP3033227B2 (ja) 半導体装置
KR0147397B1 (ko) 반도체장치 및 그 제조방법
JPH0526759Y2 (enExample)
JPH04363031A (ja) 半導体装置
US6404059B1 (en) Semiconductor device having a mounting structure and fabrication method thereof
JP4901669B2 (ja) 半導体パッケージ及び半導体パッケージの製造方法
JPH0955407A (ja) テープキャリア構造
JP2017028131A (ja) パッケージ実装体
JP2006286679A (ja) 半導体装置およびその製造方法
JP2001035947A (ja) 半導体発光装置
KR0183649B1 (ko) 리드프레임 조립체 및 그 리드프레임 조립체를 사용한 반도체장치
JP2743157B2 (ja) 樹脂封止型半導体装置
JPH08274234A (ja) 半導体装置およびその製造方法並びに半導体実装モジュール
JP2536439B2 (ja) 半導体装置用リ―ドフレ―ム及びこれを用いた樹脂封止型半導体装置
JPH0448769A (ja) 半導体装置
KR960002344Y1 (ko) 반도체 패키지
KR100258605B1 (ko) 반도체 l.o.c 패키지 구조