JPH0526187B2 - - Google Patents

Info

Publication number
JPH0526187B2
JPH0526187B2 JP58095567A JP9556783A JPH0526187B2 JP H0526187 B2 JPH0526187 B2 JP H0526187B2 JP 58095567 A JP58095567 A JP 58095567A JP 9556783 A JP9556783 A JP 9556783A JP H0526187 B2 JPH0526187 B2 JP H0526187B2
Authority
JP
Japan
Prior art keywords
polyimide
general formula
acid
mol
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58095567A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59220730A (ja
Inventor
Tsunetomo Nakano
Hiroshi Yasuno
Itsusho Nishio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ube Corp
Original Assignee
Ube Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Industries Ltd filed Critical Ube Industries Ltd
Priority to JP9556783A priority Critical patent/JPS59220730A/ja
Publication of JPS59220730A publication Critical patent/JPS59220730A/ja
Publication of JPH0526187B2 publication Critical patent/JPH0526187B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP9556783A 1983-05-30 1983-05-30 溶媒可溶性の感光性ポリイミド Granted JPS59220730A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9556783A JPS59220730A (ja) 1983-05-30 1983-05-30 溶媒可溶性の感光性ポリイミド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9556783A JPS59220730A (ja) 1983-05-30 1983-05-30 溶媒可溶性の感光性ポリイミド

Publications (2)

Publication Number Publication Date
JPS59220730A JPS59220730A (ja) 1984-12-12
JPH0526187B2 true JPH0526187B2 (en:Method) 1993-04-15

Family

ID=14141167

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9556783A Granted JPS59220730A (ja) 1983-05-30 1983-05-30 溶媒可溶性の感光性ポリイミド

Country Status (1)

Country Link
JP (1) JPS59220730A (en:Method)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5851736A (en) * 1991-03-05 1998-12-22 Nitto Denko Corporation Heat-resistant photoresist composition, photosensitive substrate, and process for forming heat-resistant positive or negative pattern
JP3709997B2 (ja) * 1994-03-29 2005-10-26 日東電工株式会社 耐熱性ネガ型フォトレジスト組成物および感光性基材、ならびにネガ型パターン形成方法
JP4529252B2 (ja) 1999-09-28 2010-08-25 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、パターンの製造法及び電子部品
US7638254B2 (en) 2004-05-07 2009-12-29 Hitachi Chemical Dupont Microsystems Ltd Positive photosensitive resin composition, method for forming pattern, and electronic part
EP1744213B1 (en) 2004-05-07 2014-09-03 Hitachi Chemical DuPont Microsystems Ltd. Positive photosensitive resin composition, method for forming pattern, and electronic component
WO2007034604A1 (ja) 2005-09-22 2007-03-29 Hitachi Chemical Dupont Microsystems Ltd. ネガ型感光性樹脂組成物、パターン形成方法及び電子部品
KR101438857B1 (ko) 2007-03-12 2014-09-05 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 감광성 수지 조성물, 그 수지 조성물을 이용한 패턴 경화막의 제조방법 및 전자부품
TWI439811B (zh) 2007-10-29 2014-06-01 Hitachi Chem Dupont Microsys 正型感光性樹脂組成物、圖案的製造方法以及電子零件
JP2018070829A (ja) * 2016-11-02 2018-05-10 東レ株式会社 樹脂組成物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5545747A (en) * 1978-09-29 1980-03-31 Hitachi Ltd Photosensitive polymer and its production
JPS6345412A (ja) * 1986-08-13 1988-02-26 Honda Motor Co Ltd 内燃機関における制御弁駆動装置

Also Published As

Publication number Publication date
JPS59220730A (ja) 1984-12-12

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