JPH0524660B2 - - Google Patents
Info
- Publication number
- JPH0524660B2 JPH0524660B2 JP63314033A JP31403388A JPH0524660B2 JP H0524660 B2 JPH0524660 B2 JP H0524660B2 JP 63314033 A JP63314033 A JP 63314033A JP 31403388 A JP31403388 A JP 31403388A JP H0524660 B2 JPH0524660 B2 JP H0524660B2
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- amount
- tank
- concentration
- chemical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Weting (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63314033A JPH02159029A (ja) | 1988-12-13 | 1988-12-13 | 薬液処理方法およびその装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63314033A JPH02159029A (ja) | 1988-12-13 | 1988-12-13 | 薬液処理方法およびその装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02159029A JPH02159029A (ja) | 1990-06-19 |
| JPH0524660B2 true JPH0524660B2 (enExample) | 1993-04-08 |
Family
ID=18048407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63314033A Granted JPH02159029A (ja) | 1988-12-13 | 1988-12-13 | 薬液処理方法およびその装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02159029A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5275184A (en) * | 1990-10-19 | 1994-01-04 | Dainippon Screen Mfg. Co., Ltd. | Apparatus and system for treating surface of a wafer by dipping the same in a treatment solution and a gate device for chemical agent used in the apparatus and the system |
| JP3473063B2 (ja) | 1993-11-15 | 2003-12-02 | 松下電器産業株式会社 | シリコン基板の洗浄方法 |
| KR20000050397A (ko) * | 1999-01-08 | 2000-08-05 | 윤종용 | 반도체 세정액 농도 제어장치 및 방법 |
| JP4462146B2 (ja) | 2004-09-17 | 2010-05-12 | 栗田工業株式会社 | 硫酸リサイクル型洗浄システムおよび硫酸リサイクル型過硫酸供給装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0739043B2 (ja) * | 1986-07-10 | 1995-05-01 | 株式会社ミヤノ | 材料支持具 |
-
1988
- 1988-12-13 JP JP63314033A patent/JPH02159029A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02159029A (ja) | 1990-06-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4319803B2 (ja) | 湿式洗浄装置および方法 | |
| US7255749B2 (en) | Substrate cleaning method and substrate cleaning apparatus | |
| TW200823989A (en) | Etching liquid management apparatus | |
| KR940020502A (ko) | 처리장치 및 처리방법(process apparatus and process method) | |
| US6921193B2 (en) | Chemical concentration control device for semiconductor processing apparatus | |
| US6286526B1 (en) | Method for treatment of semiconductor substrate with chemical solution and apparatus used for said treatment | |
| KR102511986B1 (ko) | 기판 처리 장치 및 기판 처리 방법 | |
| TWI747286B (zh) | 基板處理裝置及基板處理方法 | |
| KR101597182B1 (ko) | 수중의 불소이온 측정 방법 및 장치 | |
| US5746233A (en) | Washing apparatus and method therefor | |
| US20070034231A1 (en) | Substrate treating apparatus and method | |
| US4710261A (en) | Apparatus and method for maintaining a uniform etching solution composition | |
| JPH0524660B2 (enExample) | ||
| JP3615954B2 (ja) | 基板処理装置用の槽内液面検出装置 | |
| EP0442250B1 (en) | Control method with redox-potential | |
| KR20190127653A (ko) | 규정 농도수의 공급 방법 및 장치 | |
| KR940007702B1 (ko) | 약액처리장치 | |
| JPH0634890B2 (ja) | 薬液調合方法 | |
| KR100278768B1 (ko) | 에칭액 관리장치 | |
| JPH0158270B2 (enExample) | ||
| JPH05259141A (ja) | 半導体装置の洗浄方法 | |
| JPH11154665A (ja) | 基板の表面処理方法 | |
| JPH0396234A (ja) | 薬液処理装置 | |
| JP3492901B2 (ja) | 基板の表面処理方法および表面処理装置 | |
| JP3589888B2 (ja) | 基板の浸漬処理装置 |