JPH0524148Y2 - - Google Patents
Info
- Publication number
- JPH0524148Y2 JPH0524148Y2 JP11759088U JP11759088U JPH0524148Y2 JP H0524148 Y2 JPH0524148 Y2 JP H0524148Y2 JP 11759088 U JP11759088 U JP 11759088U JP 11759088 U JP11759088 U JP 11759088U JP H0524148 Y2 JPH0524148 Y2 JP H0524148Y2
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- lead wire
- terminal plate
- welding
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000010438 heat treatment Methods 0.000 claims description 22
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 22
- 238000003466 welding Methods 0.000 description 17
- 239000004020 conductor Substances 0.000 description 10
- 239000010408 film Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 239000013039 cover film Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- BIJOYKCOMBZXAE-UHFFFAOYSA-N chromium iron nickel Chemical compound [Cr].[Fe].[Ni] BIJOYKCOMBZXAE-UHFFFAOYSA-N 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- -1 fluororesin Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11759088U JPH0524148Y2 (US20100223739A1-20100909-C00005.png) | 1988-09-07 | 1988-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11759088U JPH0524148Y2 (US20100223739A1-20100909-C00005.png) | 1988-09-07 | 1988-09-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0239491U JPH0239491U (US20100223739A1-20100909-C00005.png) | 1990-03-16 |
| JPH0524148Y2 true JPH0524148Y2 (US20100223739A1-20100909-C00005.png) | 1993-06-18 |
Family
ID=31361184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11759088U Expired - Lifetime JPH0524148Y2 (US20100223739A1-20100909-C00005.png) | 1988-09-07 | 1988-09-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0524148Y2 (US20100223739A1-20100909-C00005.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011103293A (ja) * | 2009-11-10 | 2011-05-26 | Qinghua Univ | ヒーター及びその製造方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2579197Y2 (ja) * | 1991-12-19 | 1998-08-20 | 株式会社クラベ | フィルムヒータ |
| JP6155545B2 (ja) * | 2012-03-15 | 2017-07-05 | 株式会社デンソー | 外部接続導体付き回路基板及びその製造方法 |
-
1988
- 1988-09-07 JP JP11759088U patent/JPH0524148Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011103293A (ja) * | 2009-11-10 | 2011-05-26 | Qinghua Univ | ヒーター及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0239491U (US20100223739A1-20100909-C00005.png) | 1990-03-16 |
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