JPH0522699B2 - - Google Patents
Info
- Publication number
- JPH0522699B2 JPH0522699B2 JP59196426A JP19642684A JPH0522699B2 JP H0522699 B2 JPH0522699 B2 JP H0522699B2 JP 59196426 A JP59196426 A JP 59196426A JP 19642684 A JP19642684 A JP 19642684A JP H0522699 B2 JPH0522699 B2 JP H0522699B2
- Authority
- JP
- Japan
- Prior art keywords
- acetylene
- bis
- cured
- ether group
- reaction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Indole Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59196426A JPS6176459A (ja) | 1984-09-19 | 1984-09-19 | アセチレン基含有イミド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59196426A JPS6176459A (ja) | 1984-09-19 | 1984-09-19 | アセチレン基含有イミド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6176459A JPS6176459A (ja) | 1986-04-18 |
| JPH0522699B2 true JPH0522699B2 (cs) | 1993-03-30 |
Family
ID=16357645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59196426A Granted JPS6176459A (ja) | 1984-09-19 | 1984-09-19 | アセチレン基含有イミド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6176459A (cs) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4525131B2 (ja) * | 2004-03-29 | 2010-08-18 | 住友ベークライト株式会社 | エポキシ樹脂組成物およびそれを用いた半導体装置 |
| JP2009046622A (ja) * | 2007-08-22 | 2009-03-05 | Fujifilm Corp | 膜形成用組成物、膜及び電子デバイス |
| JP5965792B2 (ja) * | 2012-09-05 | 2016-08-10 | 三菱瓦斯化学株式会社 | 芳香族ポリカーボネート樹脂組成物および成形品 |
| EP3514869B1 (en) * | 2017-08-23 | 2023-10-04 | UBE Corporation | Binder resin for electrodes, electrode mixture paste, electrode and method for producing electrode |
| WO2019146378A1 (ja) * | 2018-01-23 | 2019-08-01 | Jsr株式会社 | レジスト下層膜形成用組成物、レジスト下層膜及びその形成方法並びにパターニングされた基板の製造方法 |
| JP7308168B2 (ja) | 2019-04-16 | 2023-07-13 | 信越化学工業株式会社 | 有機膜形成用材料、半導体装置製造用基板、有機膜の形成方法、パターン形成方法、及び有機膜形成用化合物 |
| JP7308167B2 (ja) | 2019-04-16 | 2023-07-13 | 信越化学工業株式会社 | 有機膜形成用材料、半導体装置製造用基板、有機膜の形成方法、パターン形成方法、及び有機膜形成用化合物 |
-
1984
- 1984-09-19 JP JP59196426A patent/JPS6176459A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6176459A (ja) | 1986-04-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4251418A (en) | Polyimide oligomers | |
| US5760168A (en) | Imide oligomers endcapped with phenylethynl phthalic anhydrides and polymers therefrom | |
| US4299750A (en) | Novel partially acetylene end-capped polyimide oligomers | |
| US4255313A (en) | Novel end-capped polyimide oligomers | |
| US5689004A (en) | Diamines containing pendent phenylethynyl groups | |
| CA1219398A (en) | Polyimides, polyamic acid and ester intermediates thereof, and novel aromatic diamines for their preparation | |
| US4276407A (en) | Acetylene terminated imide oligomers which melt at low temperatures | |
| CN102844291B (zh) | 新型交联剂 | |
| US5573854A (en) | Composites made from multidimensional oligomers | |
| US4206106A (en) | Vinyl end-capped polyimide oligomers | |
| JPS63128025A (ja) | ポリイミド | |
| JPS61250031A (ja) | 熔融可能なポリイミド共重合体 | |
| US4600769A (en) | Amine terminated bisaspartimide polymer | |
| JP2597183B2 (ja) | 末端変性イミドオリゴマー組成物 | |
| JPWO2008096441A1 (ja) | 炭素−炭素三重結合を有する化合物を含む熱硬化性樹脂組成物、その低温硬化方法及び製品 | |
| JPS6284124A (ja) | 累積フエニレンスルフイド単位を含有する結晶性ポリイミド | |
| JPH0522699B2 (cs) | ||
| JPH01129025A (ja) | ポリアミノビスイミド系樹脂組成物 | |
| CN103113581A (zh) | 一种聚酰胺酸、热固性聚苯并恶嗪酮酰亚胺及其制备方法 | |
| US4579782A (en) | Laminate comprising fibers embedded in cured amine terminated bis-imide | |
| EP0408672A4 (en) | Tough, high performance, addition-type thermoplastic polymers | |
| KR101786509B1 (ko) | 고온 내열용 프리프레그 제조를 위한 수지 조성물 및 그 제조 방법 | |
| JPH0551455A (ja) | 熱硬化性樹脂組成物 | |
| JP6567067B2 (ja) | [(2−エトキシ−5−trans−1−プロペン−1−イル)−フェノキシル]末端化合物 | |
| JPH01125364A (ja) | 不飽和イミド化合物 |