JPH05226674A - センサー用シリコン基板構造及びその製造方法 - Google Patents

センサー用シリコン基板構造及びその製造方法

Info

Publication number
JPH05226674A
JPH05226674A JP4312095A JP31209592A JPH05226674A JP H05226674 A JPH05226674 A JP H05226674A JP 4312095 A JP4312095 A JP 4312095A JP 31209592 A JP31209592 A JP 31209592A JP H05226674 A JPH05226674 A JP H05226674A
Authority
JP
Japan
Prior art keywords
substrate
silicon
sensor
cavity
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4312095A
Other languages
English (en)
Japanese (ja)
Inventor
Byong-Kwon Ju
炳 勸 朱
Myong-Hwan Oh
明 煥 呉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Korea Advanced Institute of Science and Technology KAIST
Original Assignee
Korea Advanced Institute of Science and Technology KAIST
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Korea Advanced Institute of Science and Technology KAIST filed Critical Korea Advanced Institute of Science and Technology KAIST
Publication of JPH05226674A publication Critical patent/JPH05226674A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
JP4312095A 1991-11-21 1992-11-20 センサー用シリコン基板構造及びその製造方法 Pending JPH05226674A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019910020835A KR940010492B1 (ko) 1991-11-21 1991-11-21 실리콘 용융접합을 이용한 센서용 실리콘 구조 및 그 제조방법
KR20835/1991 1991-11-21

Publications (1)

Publication Number Publication Date
JPH05226674A true JPH05226674A (ja) 1993-09-03

Family

ID=19323231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4312095A Pending JPH05226674A (ja) 1991-11-21 1992-11-20 センサー用シリコン基板構造及びその製造方法

Country Status (2)

Country Link
JP (1) JPH05226674A (ko)
KR (1) KR940010492B1 (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11501123A (ja) * 1995-02-28 1999-01-26 ローズマウント インコーポレイテッド 圧力センサおよび圧力トランスミッタ
US6199430B1 (en) 1997-06-17 2001-03-13 Denso Corporation Acceleration sensor with ring-shaped movable electrode
US6388300B1 (en) 1999-01-25 2002-05-14 Denso Corporation Semiconductor physical quantity sensor and method of manufacturing the same
US6388279B1 (en) 1997-06-11 2002-05-14 Denso Corporation Semiconductor substrate manufacturing method, semiconductor pressure sensor and manufacturing method thereof
WO2006128953A2 (en) * 2005-06-02 2006-12-07 Okmetic Oyj Thinning op a si wafer for mems-sensors applications

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11501123A (ja) * 1995-02-28 1999-01-26 ローズマウント インコーポレイテッド 圧力センサおよび圧力トランスミッタ
US6388279B1 (en) 1997-06-11 2002-05-14 Denso Corporation Semiconductor substrate manufacturing method, semiconductor pressure sensor and manufacturing method thereof
US6199430B1 (en) 1997-06-17 2001-03-13 Denso Corporation Acceleration sensor with ring-shaped movable electrode
US6388300B1 (en) 1999-01-25 2002-05-14 Denso Corporation Semiconductor physical quantity sensor and method of manufacturing the same
WO2006128953A2 (en) * 2005-06-02 2006-12-07 Okmetic Oyj Thinning op a si wafer for mems-sensors applications
WO2006128953A3 (en) * 2005-06-02 2007-02-01 Okmetic Oyj Thinning op a si wafer for mems-sensors applications

Also Published As

Publication number Publication date
KR940010492B1 (ko) 1994-10-24

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