JPH0521932B2 - - Google Patents

Info

Publication number
JPH0521932B2
JPH0521932B2 JP57018137A JP1813782A JPH0521932B2 JP H0521932 B2 JPH0521932 B2 JP H0521932B2 JP 57018137 A JP57018137 A JP 57018137A JP 1813782 A JP1813782 A JP 1813782A JP H0521932 B2 JPH0521932 B2 JP H0521932B2
Authority
JP
Japan
Prior art keywords
polybutadiene
bismaleimide
aliphatic
group
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57018137A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58136637A (ja
Inventor
Masayuki Ooba
Hikotada Tsuboi
Nobushi Koga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Priority to JP1813782A priority Critical patent/JPS58136637A/ja
Publication of JPS58136637A publication Critical patent/JPS58136637A/ja
Publication of JPH0521932B2 publication Critical patent/JPH0521932B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
JP1813782A 1982-02-09 1982-02-09 硬化性樹脂組成物 Granted JPS58136637A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1813782A JPS58136637A (ja) 1982-02-09 1982-02-09 硬化性樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1813782A JPS58136637A (ja) 1982-02-09 1982-02-09 硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
JPS58136637A JPS58136637A (ja) 1983-08-13
JPH0521932B2 true JPH0521932B2 (enrdf_load_stackoverflow) 1993-03-26

Family

ID=11963211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1813782A Granted JPS58136637A (ja) 1982-02-09 1982-02-09 硬化性樹脂組成物

Country Status (1)

Country Link
JP (1) JPS58136637A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4826995A (en) * 1987-11-25 1989-05-02 Texaco Inc. Bismaleimide derivatives of higher molecular weight polyoxyalkyleneamines
WO2024202375A1 (ja) * 2023-03-29 2024-10-03 積水化学工業株式会社 硬化性樹脂組成物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS544942A (en) * 1977-06-15 1979-01-16 Hitachi Ltd Thermosetting resin composition

Also Published As

Publication number Publication date
JPS58136637A (ja) 1983-08-13

Similar Documents

Publication Publication Date Title
JP6872081B2 (ja) ポリアミック酸樹脂、ポリイミド樹脂およびこれらを含む樹脂組成物
US4393188A (en) Thermosetting prepolymer from polyfunctional maleimide and bis maleimide
WO2022004583A1 (ja) イソシアネート変性ポリイミド樹脂、樹脂組成物及びその硬化物
JP2017160409A (ja) イソシアネート変性エポキシ樹脂及びその用途
JPH01129025A (ja) ポリアミノビスイミド系樹脂組成物
JPH02158626A (ja) ヒンダードジアミンから製造したイミド基含有ポリマー製造用混合物
TW202030235A (zh) 無規共聚物化合物、末端改質高分子化合物及含有此等化合物的樹脂組成物
JPS5815515A (ja) 熱硬化性樹脂組成物
JPH0521932B2 (enrdf_load_stackoverflow)
JPS5889619A (ja) 硬化性樹脂組成物
JPH0343287B2 (enrdf_load_stackoverflow)
JPH0557284B2 (enrdf_load_stackoverflow)
JPH07119300B2 (ja) 耐熱性積層板用プリプレグの製造方法
JPS62177033A (ja) 耐熱積層板の製造方法
JPS63312321A (ja) 硬化性樹脂組成物
JP2715853B2 (ja) 銅張り積層板の製造方法
JP2580935B2 (ja) 銅張り積層板の製造方法
JPH0525886B2 (enrdf_load_stackoverflow)
JPH0319837A (ja) 耐熱性積層板
JPH0411649A (ja) 熱硬化性樹脂組成物
JPS63277227A (ja) 積層板用樹脂組成物
JPH0343421A (ja) 耐熱性樹脂組成物
JP3290243B2 (ja) 低誘電率熱硬化性樹脂組成物
JPS6339613B2 (enrdf_load_stackoverflow)
JPH02229040A (ja) 耐熱性積層板