JPH05218386A - 光集積回路 - Google Patents
光集積回路Info
- Publication number
- JPH05218386A JPH05218386A JP4277591A JP27759192A JPH05218386A JP H05218386 A JPH05218386 A JP H05218386A JP 4277591 A JP4277591 A JP 4277591A JP 27759192 A JP27759192 A JP 27759192A JP H05218386 A JPH05218386 A JP H05218386A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- optical
- devices
- full
- coupling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 84
- 230000008878 coupling Effects 0.000 claims abstract description 44
- 238000010168 coupling process Methods 0.000 claims abstract description 44
- 238000005859 coupling reaction Methods 0.000 claims abstract description 44
- 239000000463 material Substances 0.000 claims description 30
- 239000002346 layers by function Substances 0.000 claims description 22
- 230000006870 function Effects 0.000 claims description 15
- 230000005540 biological transmission Effects 0.000 claims description 12
- 230000032258 transport Effects 0.000 claims description 8
- 230000003321 amplification Effects 0.000 claims description 7
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 7
- 230000008093 supporting effect Effects 0.000 claims description 4
- 230000004907 flux Effects 0.000 abstract description 26
- 238000004519 manufacturing process Methods 0.000 abstract description 17
- 238000013461 design Methods 0.000 abstract description 12
- 239000010410 layer Substances 0.000 description 61
- 239000000758 substrate Substances 0.000 description 12
- 230000008901 benefit Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 230000003993 interaction Effects 0.000 description 8
- 230000001965 increasing effect Effects 0.000 description 7
- 238000005086 pumping Methods 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 238000004891 communication Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 230000012010 growth Effects 0.000 description 4
- 230000001976 improved effect Effects 0.000 description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 230000006798 recombination Effects 0.000 description 4
- 238000005215 recombination Methods 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 230000008033 biological extinction Effects 0.000 description 3
- 239000000969 carrier Substances 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 230000002087 whitening effect Effects 0.000 description 3
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 240000001987 Pyrus communis Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011532 electronic conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000033001 locomotion Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 230000008450 motivation Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000009057 passive transport Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000021715 photosynthesis, light harvesting Effects 0.000 description 1
- 230000005701 quantum confined stark effect Effects 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/262—Optical details of coupling light into, or out of, or between fibre ends, e.g. special fibre end shapes or associated optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1042—Optical microcavities, e.g. cavity dimensions comparable to the wavelength
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
- H01S5/125—Distributed Bragg reflector [DBR] lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/18—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities
- H01S5/183—Surface-emitting [SE] lasers, e.g. having both horizontal and vertical cavities having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/777,888 US5148504A (en) | 1991-10-16 | 1991-10-16 | Optical integrated circuit designed to operate by use of photons |
| US777888 | 1991-10-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05218386A true JPH05218386A (ja) | 1993-08-27 |
Family
ID=25111610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4277591A Pending JPH05218386A (ja) | 1991-10-16 | 1992-10-16 | 光集積回路 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5148504A (OSRAM) |
| EP (1) | EP0541247A1 (OSRAM) |
| JP (1) | JPH05218386A (OSRAM) |
| CA (1) | CA2072247C (OSRAM) |
| NO (1) | NO923989L (OSRAM) |
| PT (1) | PT100954A (OSRAM) |
| TW (1) | TW246748B (OSRAM) |
Families Citing this family (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5497140A (en) * | 1992-08-12 | 1996-03-05 | Micron Technology, Inc. | Electrically powered postage stamp or mailing or shipping label operative with radio frequency (RF) communication |
| USRE42773E1 (en) | 1992-06-17 | 2011-10-04 | Round Rock Research, Llc | Method of manufacturing an enclosed transceiver |
| US6045652A (en) * | 1992-06-17 | 2000-04-04 | Micron Communications, Inc. | Method of manufacturing an enclosed transceiver |
| US5776278A (en) | 1992-06-17 | 1998-07-07 | Micron Communications, Inc. | Method of manufacturing an enclosed transceiver |
| US5779839A (en) * | 1992-06-17 | 1998-07-14 | Micron Communications, Inc. | Method of manufacturing an enclosed transceiver |
| DE4345610B4 (de) * | 1992-06-17 | 2013-01-03 | Micron Technology Inc. | Verfahren zur Herstellung einer Hochfrequenz-Identifikationseinrichtung (HFID) |
| US7158031B2 (en) * | 1992-08-12 | 2007-01-02 | Micron Technology, Inc. | Thin, flexible, RFID label and system for use |
| DE4312881C1 (de) * | 1993-04-20 | 1994-03-17 | Fraunhofer Ges Forschung | Substrat-Halbzeug für optisch-elektrische Hybridschaltungen und Verfahren zu seiner Herstellung |
| US5751466A (en) * | 1996-01-11 | 1998-05-12 | University Of Alabama At Huntsville | Photonic bandgap apparatus and method for delaying photonic signals |
| US5988510A (en) * | 1997-02-13 | 1999-11-23 | Micron Communications, Inc. | Tamper resistant smart card and method of protecting data in a smart card |
| US6329213B1 (en) | 1997-05-01 | 2001-12-11 | Micron Technology, Inc. | Methods for forming integrated circuits within substrates |
| US6339385B1 (en) | 1997-08-20 | 2002-01-15 | Micron Technology, Inc. | Electronic communication devices, methods of forming electrical communication devices, and communication methods |
| US6262830B1 (en) | 1997-09-16 | 2001-07-17 | Michael Scalora | Transparent metallo-dielectric photonic band gap structure |
| US5907427A (en) | 1997-10-24 | 1999-05-25 | Time Domain Corporation | Photonic band gap device and method using a periodicity defect region to increase photonic signal delay |
| US6028693A (en) * | 1998-01-14 | 2000-02-22 | University Of Alabama In Huntsville | Microresonator and associated method for producing and controlling photonic signals with a photonic bandgap delay apparatus |
| US6744552B2 (en) * | 1998-04-02 | 2004-06-01 | Michael Scalora | Photonic signal frequency up and down-conversion using a photonic band gap structure |
| US6304366B1 (en) | 1998-04-02 | 2001-10-16 | Michael Scalora | Photonic signal frequency conversion using a photonic band gap structure |
| US6396617B1 (en) | 1999-05-17 | 2002-05-28 | Michael Scalora | Photonic band gap device and method using a periodicity defect region doped with a gain medium to increase photonic signal delay |
| US6273339B1 (en) | 1999-08-30 | 2001-08-14 | Micron Technology, Inc. | Tamper resistant smart card and method of protecting data in a smart card |
| WO2001023948A1 (en) | 1999-09-30 | 2001-04-05 | Aguanno Giuseppe D | Efficient non-linear phase shifting using a photonic band gap structure |
| US6339493B1 (en) | 1999-12-23 | 2002-01-15 | Michael Scalora | Apparatus and method for controlling optics propagation based on a transparent metal stack |
| US6414780B1 (en) | 1999-12-23 | 2002-07-02 | D'aguanno Giuseppe | Photonic signal reflectivity and transmissivity control using a photonic band gap structure |
| US6392257B1 (en) | 2000-02-10 | 2002-05-21 | Motorola Inc. | Semiconductor structure, semiconductor device, communicating device, integrated circuit, and process for fabricating the same |
| US6693033B2 (en) * | 2000-02-10 | 2004-02-17 | Motorola, Inc. | Method of removing an amorphous oxide from a monocrystalline surface |
| JP2004522982A (ja) * | 2000-02-17 | 2004-07-29 | ナノヴェイション テクノロジーズ インコーポレイテッド | 封じ込め作用の強い偏波無依存性シングルモードリッジ光導波路 |
| WO2001093336A1 (en) | 2000-05-31 | 2001-12-06 | Motorola, Inc. | Semiconductor device and method for manufacturing the same |
| AU2001277001A1 (en) | 2000-07-24 | 2002-02-05 | Motorola, Inc. | Heterojunction tunneling diodes and process for fabricating same |
| JP4638005B2 (ja) * | 2000-08-28 | 2011-02-23 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US20020096683A1 (en) | 2001-01-19 | 2002-07-25 | Motorola, Inc. | Structure and method for fabricating GaN devices utilizing the formation of a compliant substrate |
| WO2002082551A1 (en) | 2001-04-02 | 2002-10-17 | Motorola, Inc. | A semiconductor structure exhibiting reduced leakage current |
| JP2003015175A (ja) | 2001-04-27 | 2003-01-15 | Mitsubishi Electric Corp | 固体光源装置 |
| US6709989B2 (en) | 2001-06-21 | 2004-03-23 | Motorola, Inc. | Method for fabricating a semiconductor structure including a metal oxide interface with silicon |
| US6992321B2 (en) | 2001-07-13 | 2006-01-31 | Motorola, Inc. | Structure and method for fabricating semiconductor structures and devices utilizing piezoelectric materials |
| US7019332B2 (en) * | 2001-07-20 | 2006-03-28 | Freescale Semiconductor, Inc. | Fabrication of a wavelength locker within a semiconductor structure |
| US6693298B2 (en) | 2001-07-20 | 2004-02-17 | Motorola, Inc. | Structure and method for fabricating epitaxial semiconductor on insulator (SOI) structures and devices utilizing the formation of a compliant substrate for materials used to form same |
| US6855992B2 (en) | 2001-07-24 | 2005-02-15 | Motorola Inc. | Structure and method for fabricating configurable transistor devices utilizing the formation of a compliant substrate for materials used to form the same |
| US6639249B2 (en) * | 2001-08-06 | 2003-10-28 | Motorola, Inc. | Structure and method for fabrication for a solid-state lighting device |
| US20030026310A1 (en) * | 2001-08-06 | 2003-02-06 | Motorola, Inc. | Structure and method for fabrication for a lighting device |
| US20030034491A1 (en) | 2001-08-14 | 2003-02-20 | Motorola, Inc. | Structure and method for fabricating semiconductor structures and devices for detecting an object |
| WO2003017372A1 (de) * | 2001-08-14 | 2003-02-27 | Infineon Technologies Ag | Photodiodenanordnung mit zwei photodioden |
| US6673667B2 (en) * | 2001-08-15 | 2004-01-06 | Motorola, Inc. | Method for manufacturing a substantially integral monolithic apparatus including a plurality of semiconductor materials |
| US20030071327A1 (en) | 2001-10-17 | 2003-04-17 | Motorola, Inc. | Method and apparatus utilizing monocrystalline insulator |
| US6916717B2 (en) | 2002-05-03 | 2005-07-12 | Motorola, Inc. | Method for growing a monocrystalline oxide layer and for fabricating a semiconductor device on a monocrystalline substrate |
| US7169619B2 (en) * | 2002-11-19 | 2007-01-30 | Freescale Semiconductor, Inc. | Method for fabricating semiconductor structures on vicinal substrates using a low temperature, low pressure, alkaline earth metal-rich process |
| US6885065B2 (en) | 2002-11-20 | 2005-04-26 | Freescale Semiconductor, Inc. | Ferromagnetic semiconductor structure and method for forming the same |
| US6806202B2 (en) | 2002-12-03 | 2004-10-19 | Motorola, Inc. | Method of removing silicon oxide from a surface of a substrate |
| US6963090B2 (en) | 2003-01-09 | 2005-11-08 | Freescale Semiconductor, Inc. | Enhancement mode metal-oxide-semiconductor field effect transistor |
| US6965128B2 (en) | 2003-02-03 | 2005-11-15 | Freescale Semiconductor, Inc. | Structure and method for fabricating semiconductor microresonator devices |
| US7286770B2 (en) * | 2003-07-18 | 2007-10-23 | International Business Machines Corporation | Fiber optic transmission lines on an SOC |
| US7570849B2 (en) * | 2005-06-21 | 2009-08-04 | Hewlett-Packard Development Company, L.P. | Integrated circuit device having optically coupled layers |
| US7352602B2 (en) | 2005-12-30 | 2008-04-01 | Micron Technology, Inc. | Configurable inputs and outputs for memory stacking system and method |
| EP2698598B1 (en) | 2006-10-23 | 2015-12-02 | J.A. Woollam Co., Inc. | System and method for setting and compensating errors in AOI and POI of a beam of EM radiation |
| US7469085B1 (en) * | 2007-07-12 | 2008-12-23 | International Business Machines Corporation | Method and apparatus for minimizing propagation losses in wavelength selective filters |
| US20090317033A1 (en) * | 2008-06-20 | 2009-12-24 | Industrial Technology Research Institute | Integrated circuit and photonic board thereof |
| KR20100067487A (ko) * | 2008-12-11 | 2010-06-21 | 삼성전자주식회사 | 테스트 인터페이스 장치, 테스트 시스템 및 광 인터페이스 메모리 장치 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2152464B1 (OSRAM) * | 1971-09-16 | 1974-05-31 | Thomson Csf | |
| FR2613826B1 (fr) * | 1987-04-07 | 1990-10-26 | Commissariat Energie Atomique | Capteur de deplacement en optique integree |
| US4762382A (en) * | 1987-06-29 | 1988-08-09 | Honeywell Inc. | Optical interconnect circuit for GaAs optoelectronics and Si VLSI/VHSIC |
| DE3815293A1 (de) * | 1988-05-05 | 1989-11-16 | Licentia Gmbh | Dreidimensional angeordnete wellenleiter |
-
1991
- 1991-10-16 US US07/777,888 patent/US5148504A/en not_active Expired - Lifetime
-
1992
- 1992-04-01 TW TW081102484A patent/TW246748B/zh active
- 1992-06-24 CA CA002072247A patent/CA2072247C/en not_active Expired - Fee Related
- 1992-10-08 EP EP92309166A patent/EP0541247A1/en not_active Ceased
- 1992-10-13 PT PT100954A patent/PT100954A/pt not_active Application Discontinuation
- 1992-10-14 NO NO92923989A patent/NO923989L/no unknown
- 1992-10-16 JP JP4277591A patent/JPH05218386A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| NO923989L (no) | 1993-04-19 |
| TW246748B (OSRAM) | 1995-05-01 |
| US5148504A (en) | 1992-09-15 |
| CA2072247C (en) | 1997-03-25 |
| NO923989D0 (no) | 1992-10-14 |
| EP0541247A1 (en) | 1993-05-12 |
| CA2072247A1 (en) | 1993-04-17 |
| PT100954A (pt) | 1994-05-31 |
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