JPH0521498A - 半導体素子等の電極パツド間のワイヤボンデイング方法及び半導体装置 - Google Patents

半導体素子等の電極パツド間のワイヤボンデイング方法及び半導体装置

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Publication number
JPH0521498A
JPH0521498A JP3168453A JP16845391A JPH0521498A JP H0521498 A JPH0521498 A JP H0521498A JP 3168453 A JP3168453 A JP 3168453A JP 16845391 A JP16845391 A JP 16845391A JP H0521498 A JPH0521498 A JP H0521498A
Authority
JP
Japan
Prior art keywords
gold
ball
electrode pads
wire
electrode pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3168453A
Other languages
English (en)
Inventor
Kimihiro Tsuruzono
公博 鶴園
Haruhiko Makino
晴彦 牧野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP3168453A priority Critical patent/JPH0521498A/ja
Publication of JPH0521498A publication Critical patent/JPH0521498A/ja
Pending legal-status Critical Current

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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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Abstract

(57)【要約】 （修正有） 【目的】強度及び信頼性が高い電極パッド間のボンドを
構成することを目的とする。 【構成】隣接配置した電極パッド２６Ａに予め金ワイヤ
２７で金ボール２８を形成し、他の電極パッド１６に金
のボンディングワイヤ４の一端を溶融してボールボンデ
ィングし、そのボンディングワイヤ４の他端を、前記予
め形成した金ボール２８にボンディングするようにし
て、いずれの電極パッドにもボールボンドする。 【効果】ボンドの面積が増し、そして電極パッドや、こ
れと金ワイヤとの剥離がなくなる。

Description

【発明の詳細な説明】
【０００１】
【産業上の利用分野】この発明は、例えば、同一の基板
上に隣接配置した複数の半導体素子等の各電極パッド間
のボンディング方法及びボンディング構造に関するもの
である。
【０００２】
【従来の技術】従来技術の、基板上に隣接配置した複数
の半導体素子の各電極パッド間のボンディング方法及び
ボンディング構造について、図５及び図６を用いて説明
する。１は全体として半導体装置を示していて、共通の
基板２上に、例えば半導体素子として、フォトダイオー
ド１０と前置増幅器２０とが隣接配置されている。両者
のシリコンチップ１３及び２３はそれぞれダイパッド１
４及び２４に載置されており、それぞれアウターリード
１５及び２５を備えている。符号３もアウターリード
で、他の電子回路構成要素と接続するものである。シリ
コンチップ１３には、例えば、アルミニュームからなる
電極パッド１６が形成されており、またシリコンチップ
２３には電極パッド２６Ａ及び２６Ｂが形成されてい
る。図６に要部を拡大した断面図を示したが、電極パッ
ド１６と電極パッド２６Ａとはボンディングワイヤ４で
接続されていて、フォトダイオード増幅器系の帶域劣化
を防止するため、フォトダイオード１０の出力信号を直
接前置増幅器２０に入力するようにし、応答性の高い光
検出ができるようにしている。そして、このワイヤボン
ディングにおいて、フォトダイオード１０と前置増幅器
２０とは極めて近接して配置されているため、ボンディ
ングワイヤ４も極めて短く、従って、電極パッド１６に
対してボールボンディングした場合、他方の電極パッド
２６Ａにはボンディングワイヤ４の他端をウェッジボン
ディングで行うことになる。
【０００３】
【発明が解決しようとする課題】従って、電極パッド２
６Ａに対するボンド面積が少ないため、ボンドの強度が
著しく低く、或いは電極パッド２６Ａのアルミニューム
が剥がれてしまうという欠点がある。この発明はこのよ
うな欠点を解決しようとするものである。
【０００４】
【課題を解決するための手段】そのためこの発明は、隣
接配置した複数の半導体素子等の内、一つの電極パッド
に予め金ボールを形成し、他の電極パッドに金のボンデ
ィングワイヤの一端を溶融してボールボンディングし、
そのボンディングワイヤの他端を、前記予め形成した金
ボールにボンディングするようにして、いずれの電極パ
ッドにもボールボンドを行って、前記の課題を解決し
た。
【０００５】
【作用】従って、一方の電極パッドと他方の電極パッド
とに対するボンド面の面積を、そしてボンドの強度をも
同一にすることができ、従って、従来技術の電極パッド
のアルミニュームや、これと金ワイヤとの剥離がなくな
り、半導体装置等の信頼性を向上させることができる。
【０００６】
【実施例】以下、この発明の半導体素子のワイヤボンデ
ィング方法を図１乃至図４を用いて説明する。図１は第
一の工程を示す断面図、図２は第二の工程を示す断面
図、そして図３は第三の工程を示す断面図で、図４はこ
の発明のワイヤボンディング方法で完成した半導体装置
を示す断面図である。なお、図５乃至図６と同一部分に
は同一の符号を付した。
【０００７】この発明では、図１に示すように、先ず、
前置増幅器２０の電極パッド２６Ａに金ボール形成用の
金ワイヤ２７の先端をボールボンディングして、電極パ
ッド２６Ａ上に金ボール２８を形成する。この場合、金
ボール２８には金ワイヤ２７が接続された状態にある。
【０００８】次の工程では、図２に示すように、フォト
ダイオード１０の電極パッド１６に金のボンディングワ
イヤ４の先端を金ボール１７が形成されるようにボール
ボンディングする。
【０００９】次に、図３に示すように、前記ボンディン
グワイヤ４の他端を、前記金ボール２８にウェッジボン
ディングする。このウェッジボンディングは前記従来技
術の項で記したように、一般的にボンディング面積が小
であるが、この発明の場合は、ボンディングワイヤ４が
金であるので金ボール２８と溶融、一体化し、ボンドの
強度は大である。このボンディングに際、金ワイヤ２７
は切断される。
【００１０】このようなワイヤボンディング方法を行え
ば、図４に示したように、電極パッド１６にも、電極パ
ッド２６Ａにも、ボンディングワイヤ４をボールボンデ
ィングできる。そして、図示していないが、このような
実施例の場合、フォトダイオード１０のボールボンド部
には透明樹脂でポッティングし、前置増幅器２０のボー
ルボンド部には不透明樹脂をポッティングして、これら
の部分を保護する。
【００１１】以上のようなワイヤボンディング方法は、
図５に示されているような電極パッド２６Ｂと電子回路
を構成するアウターリード３に設けられた電極パッド間
においても、また、隣接配置された電極パッド間におい
ても応用でき、ボールボンディングができることが容易
に理解されよう。
【００１２】
【発明の効果】以上の説明から明らかなように、この発
明のワイヤボンディング方法によれば、一方の電極パッ
ドと他方の電極パッドとに対するボンド面の面積を、そ
してボンドの強度をも同一にすることができ、従って、
従来技術の電極パッドのアルミニュームや、これと金ワ
イヤとの剥離がなくなり、半導体装置、電子回路の信頼
性、歩留りも向上する等数々の優れた効果が得られる。
【図面の簡単な説明】
【図１】この発明の半導体素子等の電極パッド間のワイ
ヤボンディング方法の第一の工程を示す断面図である。
【図２】同じく第二の工程を示す断面図である。
【図３】同じく第三の工程を示す断面図である。
【図４】この発明のワイヤボンディング方法で完成した
半導体装置を示す断面図である。
【図５】従来技術によるワイヤボンディング方法で電極
パッド間のボンドが行われた半導体装置を示す斜視図で
ある。
【図６】図５の半導体装置の電極パッド間の一部拡大断
面図である。
【符号の説明】
１ 半導体装置 ２ 基板 ３ アウターリード ４ ボンディングワイヤ １０ フォトダイオード １３ シリコンチップ １４ ダイパッド １５ アウターリード １６ 電極パッド １７ 金ボール ２０ 前置増幅器 ２３ シリコンチップ ２４ ダイパッド ２５ アウターリード ２６Ａ 電極パッド ２７ 金ワイヤ ２８ 金ボール

Claims (2)

    【特許請求の範囲】
  1. 【請求項１】隣接配置した複数の電極パッド間の内、一
    つの電極パッドに予め金ボールを形成し、他の電極パッ
    ドに金のボンディングワイヤの一端を溶融してボールボ
    ンディングし、該ボンディングワイヤの他端を、予め形
    成した該金ボールにボンディングすることを特徴とする
    半導体素子等の電極パッド間のワイヤボンディング方
    法。
  2. 【請求項２】隣接配置した複数の半導体素子の複数の電
    極パッド間を、それぞれの電極パッド上に金ボールを形
    成して金ワイヤでボンディングしたことを特徴とする半
    導体装置。
JP3168453A 1991-07-09 1991-07-09 半導体素子等の電極パツド間のワイヤボンデイング方法及び半導体装置 Pending JPH0521498A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3168453A JPH0521498A (ja) 1991-07-09 1991-07-09 半導体素子等の電極パツド間のワイヤボンデイング方法及び半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3168453A JPH0521498A (ja) 1991-07-09 1991-07-09 半導体素子等の電極パツド間のワイヤボンデイング方法及び半導体装置

Publications (1)

Publication Number Publication Date
JPH0521498A true JPH0521498A (ja) 1993-01-29

Family

ID=15868391

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3168453A Pending JPH0521498A (ja) 1991-07-09 1991-07-09 半導体素子等の電極パツド間のワイヤボンデイング方法及び半導体装置

Country Status (1)

Country Link
JP (1) JPH0521498A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7374220B2 (en) 2004-05-14 2008-05-20 Nifco Inc. Drive device for driving two members and shielding system for vehicle

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7374220B2 (en) 2004-05-14 2008-05-20 Nifco Inc. Drive device for driving two members and shielding system for vehicle

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