JPH0520915B2 - - Google Patents
Info
- Publication number
- JPH0520915B2 JPH0520915B2 JP2168488A JP2168488A JPH0520915B2 JP H0520915 B2 JPH0520915 B2 JP H0520915B2 JP 2168488 A JP2168488 A JP 2168488A JP 2168488 A JP2168488 A JP 2168488A JP H0520915 B2 JPH0520915 B2 JP H0520915B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- ceramic substrate
- green sheet
- cavity
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000919 ceramic Substances 0.000 claims description 75
- 239000000758 substrate Substances 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- 239000011230 binding agent Substances 0.000 claims description 14
- 239000000843 powder Substances 0.000 claims description 13
- 238000005245 sintering Methods 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 238000000748 compression moulding Methods 0.000 claims description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2168488A JPH01196191A (ja) | 1988-02-01 | 1988-02-01 | セラミクス基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2168488A JPH01196191A (ja) | 1988-02-01 | 1988-02-01 | セラミクス基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01196191A JPH01196191A (ja) | 1989-08-07 |
| JPH0520915B2 true JPH0520915B2 (Direct) | 1993-03-22 |
Family
ID=12061893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2168488A Granted JPH01196191A (ja) | 1988-02-01 | 1988-02-01 | セラミクス基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01196191A (Direct) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101327307B1 (ko) * | 2006-11-27 | 2013-11-11 | 주식회사 미코 | 다층 기판 제조 방법 및 이를 이용한 정전척 제조 방법 |
| US8974891B2 (en) | 2007-10-26 | 2015-03-10 | Coi Ceramics, Inc. | Thermal protection systems comprising flexible regions of inter-bonded lamina of ceramic matrix composite material and methods of forming the same |
| JP5333308B2 (ja) * | 2009-05-11 | 2013-11-06 | 株式会社デンソー | セラミック積層体の製造方法 |
-
1988
- 1988-02-01 JP JP2168488A patent/JPH01196191A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01196191A (ja) | 1989-08-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |