JPH05191111A - Strip line device and device using method - Google Patents

Abstract

PURPOSE:To obtain the strip line device for easily connecting any other device, which can be connected to a strip line, or a microstrip line. CONSTITUTION:This device is provided with outer conductors 3a and 3b formed on one of the planes of two dielectric substrates 1a and 1b, inner conductor 2 formed on the other plane of one of those dielectric substrates 1a and 1b at least, and terminals P1 and P2, and a strip line 4 is formed by interposing the inner conductor 2 between the dielectric substrates 1a and 1b. An inner conductor revealing part 6 formed by removing one part of the dielectric substrate 1b and a through hole 5 for conducting the outer conductors 3a and 3b are provided near the terminals P1 and P2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION This invention is mainly applied to VHF band, UH
The present invention relates to input / output means of stripline devices used in the F band, microwave band, and millimeter wave band.

[0002]

2. Description of the Related Art FIG. 13 is a schematic diagram showing a conventional strip line device disclosed in Japanese Patent Publication No. 61-29162, in which 1a and 1b are dielectric substrates.
Reference numeral 2 is an inner conductor formed by closely adhering a conductor film to one surface of the dielectric substrate 1a, 3a is an outer conductor formed by adhering a conductor film to the entire other surface of the dielectric substrate 1a, and 3b is a dielectric. An outer conductor formed by closely adhering a conductor film to one surface of the body substrate 1b,
4 is a dielectric substrate 1a, 1b, an inner conductor 2, an outer conductor 3a, 3
Strip lines formed by b and P1 and P2 are terminals. The dielectric substrates 1a and 1b have substantially the same shape, and are superposed on each other so as to sandwich the inner conductor 2 therebetween. The inner conductor 2 is formed by photoetching or the like to form a filter or the like. The inner conductor 2 has its ends extending to the terminals P1 and P2.

Next, the operation will be described. For example, the strip line 4 is configured such that the inner conductor 2 is formed in a shape in which wide portions and narrow portions are alternately connected to form a low-pass filter. The cutoff frequency fc of the low pass filter is
It is set by adjusting the shapes and dimensions of the wide portion and the narrow portion. At this time, the frequency f1 incident from the terminal P1
Of the wave propagates through the strip line 4 and is output from the terminal P2 if f1 <fc due to the function of the low-pass filter, but is reflected and not output to the terminal P2 if f1> fc. Thus, the strip line 4 shown in FIG.
Has a function as a stripline device such as a filter.

FIG. 14 is a diagram in which the stripline device, the FET amplifier and the microstripline in FIG. 13 are mutually connected, and FIG. 15 is a sectional view taken along the line AA in FIG. 14, in which 7 is a package and 8 is a package top. , 9 is a gate lead wire, 10 is a drain lead wire, 11 is a source lead wire, 12 is an FET amplifier including a package 7, a package upper cover 8, a gate lead wire 9, a drain lead wire 10 and a source lead wire 11, 13 Is a strip conductor,
Reference numeral 14 is a dielectric substrate, 15 is a metal base, 16 is a microstrip line composed of the strip conductor 13, the dielectric substrate 14 and the metal base 15, 23 is a connection conductor, 24 is a metal plate, and 25 is a screw. The metal plate 24 is the strip line 4
Is closely attached to the outer conductor 3b. Dielectric substrate 1a, 1
The metal plate 24b and the metal plate 24 are fixed to the metal base 15 by screws 25 so that the outer conductor 3a and the metal base 15 are in close contact with each other.

When the stripline device is connected to the gate side of the packaged FET amplifier 12 as shown in FIG. 14, the inner conductor 2 at the position of the terminal P2 is connected to the gate lead wire 9 of the FET amplifier 12. There is a need.
In the conventional strip line device shown in FIG. 13, the strip line 4 is connected to the inner conductor 2 and the gate lead wire 9 in a state where the dielectric substrates 1a and 1b are separated from each other, and then the dielectric substrate 1a.
And 1b are closely attached to each other.

[0006]

Since the conventional stripline device is constructed as described above, when the stripline 4 is connected to the gate side of the FET amplifier 12, the dielectric substrates 1a and 1b are separated from each other. In this state, it is necessary to connect the inner conductor 2 at the position of the terminal P2 and the gate lead wire 9 and then bring the dielectric substrates 1a and 1b into close contact with each other, so that the connection procedure becomes complicated and the dielectric substrate 1a and There is a problem that it is difficult to accurately align the position of 1b.

Further, since it is difficult to bring the dielectric substrates 1a and 1b into close contact with each other while being separated from the metal base 15, the dielectric substrates 1a and 1b cannot be adhered to each other by a bonding film or the like. Therefore, the dielectric substrate 1a
There is a problem that the strip plate device becomes large in size because the metal plate 24 and the screw 25 for bringing the and 1b into close contact with each other are required.

The present invention has been made to solve the above problems, and an object thereof is to obtain a strip line device which can be easily connected to other devices and other microstrip lines and a method of using the strip line device. To do.

[0009]

A stripline device according to a first aspect of the present invention includes a first and a second outer conductor formed on one surface of each of a first and a second dielectric substrate, and the above dielectric. An inner conductor formed on the other surface of at least one of the body substrates, and a connection terminal (connecting portion) for connecting the inner conductor, the first and second inner conductors being provided.
An inner conductor exposed portion formed by removing a part of one of the first and second dielectric substrates near the terminal to form a strip line by sandwiching the strip line between the dielectric substrates. And a means for connecting between the first and second outer conductors.

A stripline device according to a second aspect of the present invention includes a first and second outer conductor formed on one surface of each of the first and second dielectric substrates and the dielectric substrate. An inner conductor formed on at least one other surface and a terminal (connecting portion) are provided, and the inner conductor is sandwiched between the first and second dielectric substrates to form a strip line. An inner conductor exposed portion formed by removing a part of one of the first and second dielectric substrates and a conduction means between the first and second outer conductors are provided near the terminal. The inner conductor exposed portion is provided with a cover such as a dielectric cover, a metal cover, or a conductor cover that covers the inner conductor.

A stripline device using method according to a third aspect of the present invention is such that first, the stripline device according to the first aspect of the present invention is formed, and then a connecting step for connecting to another device and the stripline device are performed. It has an installation process of installing on a table.

[0012]

In the first aspect of the invention, the inner conductor exposed portion is formed by removing the vicinity of the terminal of either one of the first and second dielectric substrates that form the strip line device,
In addition, a conduction means between the first and second outer conductors is provided near the exposed portion. Therefore, even if the first and second dielectric substrates are adhered to each other with a bonding film or the like in a state where the first and second dielectric substrates are separated from the metal base, the inner conductor of the exposed portion and the lead wire of another device or the microstrip. Easy connection to the track. Therefore, the first
The second dielectric substrate and the second dielectric substrate can be easily and accurately brought into close contact with each other, and a metal plate or a screw for bringing the first and second dielectric substrates into close contact with each other is unnecessary.

Further, in the second invention, the inner conductor exposed portion is formed by removing the vicinity of one of the terminals of the first and second dielectric substrates constituting the strip line device, and the exposed portion is formed. A conductive means between the first and second outer conductors is provided near the portion, and a dielectric cover that covers the inner conductor is provided at the inner conductor exposed portion. Therefore, since the exposed portion of the inner conductor is filled with the dielectric, the width of the inner conductor can be adjusted without changing the characteristic impedance. Further, a metal cover for covering the inner conductor may be provided in the inner conductor exposed portion, and in this case, by changing the distance between the inner conductor and the metal cover, the inner conductor width of the inner conductor can be changed without changing the characteristic impedance. The adjustment can be performed, and the emission of radio waves from the exposed portion of the inner conductor to the space can be suppressed. Further, a conductor cover may be provided, and in this case, it is possible to suppress radio wave emission from the inner conductor exposed portion to the space.

In the third aspect of the invention, the microstop line device is formed first, then connected to other devices and installed on the base. The second dielectric substrate can be easily and accurately brought into close contact with each other, and a metal plate or a screw for bringing the first and second dielectric substrates into close contact with each other is not required, which facilitates connection work and installation work.

[0015]

EXAMPLES Example 1. 1 is a schematic configuration diagram showing an embodiment of the present invention, FIG. 2 is a diagram in which the embodiment of FIG. 1, an FET amplifier and a microstrip line are mutually connected, and FIG. 3 is FIG.
FIG. 1A is a sectional view taken along line AA of FIG.
a, 3b, 4, 7 to 16, P1 and P2 are the same as in the conventional case, 5 is a through hole for conducting the outer conductors 3a and 3b, and 6 is a dielectric substrate 3b near the terminals P1 and P2. It is an inner conductor exposed portion formed by removal. The dielectric substrates 1a and 1b are closely adhered to each other by a bonding film made of the same material as those substrates. The through holes 5 are provided on both sides of the inner conductor 2 near the inner conductor exposed portion 6. In the inner conductor exposed portion 6, the dielectric substrate 3b
The width of the inner conductor 2 is widened in order to correct the change in the characteristic impedance due to the lack of.

Next, the operation will be described. For example, the strip line 4 is configured such that the inner conductor 2 is formed in a shape in which wide portions and narrow portions are alternately connected to form a low-pass filter. The cutoff frequency fc of the low pass filter is
It is set by adjusting the shapes and dimensions of the wide portion and the narrow portion. At this time, the frequency f1 incident from the terminal P1
Of the wave propagates through the strip line 4 and is output from the terminal P2 if f1 <fc due to the function of the low-pass filter, but is reflected and not output to the terminal P2 if f1> fc. In this way, the strip line shown in FIG.
Like the conventional case, it has a function as a stripline device such as a filter.

In the embodiment of FIG. 1, the stripline 4 is converted into a microstripline at the exposed inner conductor portion 6.
In order to prevent reflection at this discontinuous portion, the outer conductor 3b
A current flowing through the outer conductor 3a is caused to flow into the outer conductor 3a through the through hole 5.

As shown in FIGS. 2 and 3, when the stripline device of FIG. 1 is connected to the gate side of the packaged FET amplifier 12, the inner conductor exposed portion 6 exposes the inner conductor 2 at the position of the terminal P2. Therefore, the inner conductor 2 and the gate lead wire 9 of the FET amplifier 12 can be connected in a state where the dielectric substrates 3a and 3b are adhered. Further, since the dielectric substrates 3a and 3b are adhered by a bonding film, when the strip line device of FIG. 1 is fixed to the metal base 15, it is sufficient to adhere them to each other with a conductive adhesive or solder. , The metal plate 24 and the screw 25 are unnecessary.

As described above, in this embodiment, the first dielectric substrate, the second dielectric substrate, and the first and second dielectric substrates are used.
A first and a second outer conductor formed on one surface of each of the dielectric substrates, and at least one of the dielectric substrates.
An inner conductor formed on the other surface of the sheet and a terminal are provided, and the inner conductor is sandwiched between the first and second dielectric substrates to form a strip line, and the strip line is formed near the terminal. An inner conductor exposed portion formed by removing a part of one of the first and second dielectric substrates, and a conduction means between the first and second outer conductors are provided. A stripline device has been described.

Example 2. FIG. 4 is a schematic configuration diagram showing another embodiment of the present invention, in which the dielectric substrate 3b is cut into a semi-cylindrical shape to form a semi-cylindrical inner conductor exposed portion 60.

The strip line device shown in FIG. 4 has the same operating principle and advantages as those of FIG. 1, and since the through hole 5 is provided at the position where the inner conductor exposed portion 60 is sandwiched, the strip line 4 and the inner conductor are provided. This has the effect of reducing the reflection of the discontinuous portion between the exposed portion 60 and the exposed portion 60.

Embodiment 3. FIG. 5 is a schematic configuration diagram showing another embodiment of the present invention, in which a conductor cover 17 for covering the inner conductor exposed portion 60 of FIG. 4 is provided. The conductor cover 17 is adhered to the outer conductor 3b with a conductive adhesive or the like so as to be electrically connected to the outer conductor 3b.

The embodiment of FIG. 5 has the same operating principle and advantages as those of FIGS.
The effect of this is that the emission of radio waves from the exposed inner conductor portion 60 to the space is suppressed, and the loss can be reduced.

Example 4. FIG. 6 is a schematic configuration diagram showing another embodiment of the invention, and FIG. 7 is a diagram for explaining the details of FIG. 6, in which the inner conductor exposed portion 60 has a dielectric cover having substantially the same shape as this exposed portion. This is the case when 21 is inserted. The dielectric cover 21 is composed of a semi-cylindrical dielectric block 18 formed by processing the same material as the dielectric substrate 3b, and a conductor film 19 adhered to the outer conductor 3b side surface of this block. ing. The cut portion 20 of the dielectric block 18 is provided at a position where the connecting lead wire comes into contact when connecting with another device or the like.
Is provided. The dielectric cover 21 is fixed by an adhesive and the conductor cover 17.

The embodiment of FIG. 6 has the same operating principle and advantages as those of FIG. 5, and the characteristic impedance of the exposed inner conductor portion 60 is lowered by the action of the dielectric block 18, so that the width of the inner conductor 2 is reduced. The advantage is that it does not have to be expanded.

As described above, in this embodiment, the first dielectric substrate, the second dielectric substrate, and the first and second dielectric substrates are used.
A first and a second outer conductor formed on one surface of each of the dielectric substrates, and at least one of the dielectric substrates.
An inner conductor formed on the other surface of the sheet and a terminal are provided, and the inner conductor is sandwiched between the first and second dielectric substrates to form a strip line, and the strip line is formed near the terminal. An inner conductor exposed portion formed by removing a part of one of the first and second dielectric substrates, and a conduction means between the first and second outer conductors are provided. The strip line device characterized in that the conductor cover is provided with a dielectric cover for covering the inner conductor is described.

Example 5. FIG. 8 is a schematic configuration diagram showing still another embodiment of the invention, FIG. 9 is a diagram for explaining the details of FIG. 8, and FIG. 10 is a diagram showing the embodiment of FIG. 8 with the FET amplifier 12 and the microstrip line 16. 11 is a cross-sectional view taken along the line AA in FIG. 10 and shows a case where a metal cover 22 for covering the inner conductor 2 is provided on the inner conductor exposed portion 6 in the embodiment of FIG. The outer conductor 3b and the metal cover 22 are connected conductors 23
Connected by. The dielectric substrate 1a at the position where the metal cover 22 contacts is provided with a through hole 5 for electrically connecting the metal cover 22 and the outer conductor 3a. In the connection between the strip line device of FIG. 8 and the FET amplifier 12, first, the inner conductor 2 and the gate lead wire 9 are connected in the same manner as in FIG. 1 without the metal cover 22, and then the metal cover 22 is attached. Good.

The embodiment shown in FIG. 8 has the same operating principle and advantages as those shown in FIG. 1, and the function of the metal cover 22 suppresses the emission of radio waves from the exposed inner conductor portion 6 to the space.
This has the effect of reducing the loss. Further, since the through hole 5 is provided at a position where the inner conductor 2 of the inner conductor exposed portion 6 is sandwiched, there is an effect that reflection at a discontinuous portion between the strip line 4 and the inner conductor exposed portion 6 can be reduced. Furthermore, by changing the distance between the inner conductor 2 and the metal cover 22, there is an advantage that the width of the inner conductor 2 can be adjusted while maintaining a predetermined characteristic impedance value.

As described above, in this embodiment, the first dielectric substrate, the second dielectric substrate, the first and second dielectric substrates are used.
A first and a second outer conductor formed on one surface of each of the dielectric substrates, and at least one of the dielectric substrates.
An inner conductor formed on the other surface of the sheet and a terminal are provided, and the inner conductor is sandwiched between the first and second dielectric substrates to form a strip line, and the strip line is formed near the terminal. An inner conductor exposed portion formed by removing a part of one of the first and second dielectric substrates, and a conduction means between the first and second outer conductors are provided. The stripline device has been described in which the conductor exposed portion is provided with a metal cover that covers the inner conductor.

Example 6. In the above embodiment, the case where the inner conductor has the two terminals P1 and P2 is shown.
It may have two or more terminals as shown in (a). Alternatively, as shown in FIG. 12B, only one terminal P1 may be exposed. In addition, FIG.
As shown in (c), the exposure directions of the terminals P1 and P2 may be different. In addition, FIG.
As shown in (e), it is possible to freely form a strip line in a desired length or a desired direction by connecting the strip line devices according to the present invention to each other.

Example 7. Although the strip line device has been described as the low pass filter in the above embodiment,
It may be another circuit device having a strip line structure, and has the same advantages and effects as those of the above-described embodiment.

[0032]

As described above, according to the first invention, the first
The inner conductor can be connected to the lead wire or the microstrip line of another device even after the dielectric substrate and the second dielectric substrate are adhered to each other, and the first and second dielectric substrates can be easily formed. There is an effect that it is possible to obtain another device that can be brought into close contact with position accuracy and can be connected to a strip line, or a strip line device that can be easily connected to a microstrip line. Further, it becomes possible to bond the first and second dielectric substrates to each other with a bonding film or the like in a state where the first and second dielectric substrates are separated from the metal base, and a metal for bringing the first and second dielectric substrates into close contact with each other. Since no plate or screw is required, there is an effect that the stripline device can be formed in a small size.

According to the second aspect of the invention, since the cover for covering the inner conductor is provided on the exposed inner conductor, a strip line device capable of adjusting the inner conductor width without changing the characteristic impedance is obtained. Alternatively, there is an effect that the radiation of the radio wave from the exposed portion of the inner conductor to the space is suppressed and a stripline device with a small loss is obtained.

Further, according to the third invention, the connection and installation of the strip line device can be completely separated from the formation of the strip line device, so that there is an effect that each work can be accurately and easily executed.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing an embodiment of the present invention.

FIG. 2 is a diagram in which the embodiment of FIG. 1, the FET amplifier and a microstrip line are connected to each other.

FIG. 3 is a sectional view taken along line AA of FIG.

FIG. 4 is a schematic configuration diagram showing another embodiment of the present invention.

FIG. 5 is a schematic configuration diagram showing another embodiment of the present invention.

FIG. 6 is a schematic configuration diagram showing an embodiment of the present invention.

FIG. 7 is a diagram for explaining details of the embodiment in FIG.

FIG. 8 is a schematic configuration diagram showing an embodiment of the present invention.

FIG. 9 is a diagram for explaining details of the embodiment in FIG.

FIG. 10 is a diagram in which the FET amplifier and the microstrip line of the embodiment of FIG. 8 are mutually connected.

11 is a sectional view taken along line AA of FIG.

FIG. 12 is a diagram showing another embodiment of the present invention.

FIG. 13 is a schematic configuration diagram showing a conventional stripline device.

FIG. 14 is a diagram in which a conventional stripline device, a FET amplifier, and a microstripline are connected to each other.

15 is a sectional view taken along line AA of FIG.

[Explanation of symbols]

 1a, 1b Dielectric substrate 2 Inner conductor 3a, 3b Outer conductor 4 Strip line 5 Through hole 6 Inner conductor exposed portion 60 Inner conductor exposed portion 17 Conductor cover 18 Dielectric block 19 Conductive film 20 Cut portion 21 Dielectric cover 22 Metal cover 23 Connection conductor P1 terminal P2 terminal

[Procedure amendment]

[Submission date] June 25, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0009

[Correction method] Change

[Correction content]

[0009]

A stripline device according to a first aspect of the present invention includes a first and a second outer conductor formed on one surface of each of a first and a second dielectric substrate, and the above dielectric. An inner conductor formed on the other surface of at least one of the body substrates, and a connection terminal (connecting portion) for connecting the inner conductor, the first and second inner conductors being provided.
An inner conductor formed by removing a part of one of the first and second dielectric substrates in the vicinity of the terminal by sandwiching the strip line between the dielectric substrates.
An exposed portion is provided, and a conduction means between the first and second outer conductors is provided in the vicinity of the exposed portion of the inner conductor .

[Procedure Amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0010

[Correction method] Change

[Correction content]

A stripline device according to a second aspect of the present invention includes a first and second outer conductor formed on one surface of each of the first and second dielectric substrates and the dielectric substrate. An inner conductor formed on at least one other surface and a terminal (connecting portion) are provided, and the inner conductor is sandwiched between the first and second dielectric substrates to form a strip line. An inner conductor exposed portion formed by removing a part of one of the first and second dielectric substrates is provided near the terminal, and the inner conductor exposed portion is provided close to the inner conductor exposed portion. A conductive means is provided between the first and second outer conductors, and a cover such as a dielectric cover or a metal cover or a conductor cover that covers the inner conductor is provided on the inner conductor exposed portion.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Change

[Correction content]

[0012]

In the first aspect of the invention, the inner conductor exposed portion is formed by removing the vicinity of the terminal of either one of the first and second dielectric substrates forming the strip line device,
Further, a conducting means is provided between the first and second outer conductors in the vicinity of the exposed portion . Therefore, even if the first and second dielectric substrates are adhered to each other with a bonding film or the like in a state where the first and second dielectric substrates are separated from the metal base, the inner conductor of the exposed portion and the lead wire of another device or the microstrip. Easy connection to the track. Therefore, the first and second dielectric substrates can be easily and accurately brought into close contact with each other, and a metal plate or a screw for bringing the first and second dielectric substrates into close contact with each other is unnecessary.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0013

[Correction method] Change

[Correction content]

[0013] In the second invention, to form an inner conductor exposed portions are removed either around one terminal of the first and second dielectric substrate constituting the strip line device, the exposed A means for conducting between the first and second outer conductors is provided in the vicinity of the portion , and a dielectric cover for covering the inner conductor is provided in the exposed portion of the inner conductor. Therefore, since the exposed portion of the inner conductor is filled with the dielectric, the width of the inner conductor can be adjusted without changing the characteristic impedance. Also,
The inner conductor exposed portion may be provided with a metal cover that covers the inner conductor. In this case, the inner conductor width can be adjusted without changing the characteristic impedance by changing the distance between the inner conductor and the metal cover. This makes it possible to suppress the emission of radio waves from the exposed inner conductor portion to the space. Also,
A conductor cover may be provided, and in this case, it is possible to suppress the emission of radio waves from the inner conductor exposed portion to the space.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Name of item to be corrected] 0019

[Correction method] Change

[Correction content]

As described above, in this embodiment, the first dielectric substrate, the second dielectric substrate, and the first and second dielectric substrates are used.
A first and a second outer conductor formed on one surface of each of the dielectric substrates, and at least one of the dielectric substrates.
An inner conductor formed on the other surface of the sheet and a terminal are provided, and the inner conductor is sandwiched between the first and second dielectric substrates to form a strip line, and the strip line is formed near the terminal. The inner conductor exposed portion is formed by removing a part of one of the first and second dielectric substrates,
Proximate to the exposed portion conduction between the first and second outer conductor
A stripline device characterized by the provision of means has been described.

[Procedure correction 6]

[Document name to be amended] Statement

[Correction target item name] 0026

[Correction method] Change

[Correction content]

As described above, in this embodiment, the first dielectric substrate, the second dielectric substrate, and the first and second dielectric substrates are used.
A first and a second outer conductor formed on one surface of each of the dielectric substrates, and at least one of the dielectric substrates.
An inner conductor formed on the other surface of the sheet and a terminal are provided, and the inner conductor is sandwiched between the first and second dielectric substrates to form a strip line, and the strip line is formed near the terminal. The inner conductor exposed portion is formed by removing a part of one of the first and second dielectric substrates,
Proximate to the exposed portion conduction between the first and second outer conductor
The strip line device has been described in which the means is provided and the dielectric cover that covers the inner conductor is provided in the inner conductor exposed portion.

[Procedure Amendment 7]

[Document name to be amended] Statement

[Name of item to be corrected] 0027

[Correction method] Change

[Correction content]

Example 5. FIG. 8 is a schematic configuration diagram showing still another embodiment of the invention, FIG. 9 is a diagram for explaining the details of FIG. 8, and FIG. 10 is a diagram showing the embodiment of FIG. 8 with the FET amplifier 12 and the microstrip line 16. 11 is a cross-sectional view taken along the line AA of FIG. 10, and the inner conductor 2 is covered by the inner conductor exposed portion 6 in the embodiment of FIG.
This is the case where the metal cover 22 having a thickness equal to or less than the thickness of the first or second dielectric substrate is provided. The outer conductor 3b and the metal cover 22 are connected by a connection conductor 23. Through holes 5 for electrically connecting the metal cover 22 and the outer conductor 3a are formed in the dielectric substrate 1a at the position where the metal cover 22 contacts.
Is provided. The stripline device of FIG. 8 and F
In connection with the ET amplifier 12, the inner conductor 2 and the gate lead wire 9 may be first connected in the same manner as in FIG. 1 without the metal cover 22, and then the metal cover 22 may be attached.

[Procedure Amendment 8]

[Document name to be amended] Statement

[Name of item to be corrected] 0029

[Correction method] Change

[Correction content]

As described above, in this embodiment, the first dielectric substrate, the second dielectric substrate, the first and second dielectric substrates are used.
First and second outer conductors formed on one surface of each of the dielectric substrates, and at least one of the dielectric substrates.
An inner conductor formed on the other surface of the sheet and a terminal are provided, and the inner conductor is sandwiched between the first and second dielectric substrates to form a strip line, and the strip line is formed near the terminal. An inner conductor exposed portion formed by removing a part of one of the first and second dielectric substrates is provided.
Proximate to the exposed portion conduction between the first and second outer conductor
Means and cover the exposed inner conductor with the inner conductor.
The distance between the inner conductor and the first or second dielectric
A stripline device has been described which is characterized by the provision of a metal cover which is less than or equal to the thickness of the body substrate .

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Jun Sato 8-1-1 Tsukaguchihonmachi, Amagasaki City Mitsubishi Electric Corporation

Claims (3)

[Claims] 1. A stripline device having the following elements: (a) an inner conductor having a connecting portion for connecting to another, (b) at least the connecting portion being exposed in one direction and sandwiching the inner conductor. First and second dielectrics, (c) first and second outer conductors provided outside the first and second dielectrics, (d) conducting means for electrically connecting the first and second outer conductors .. 2. The above stripline device,
The stripline device according to claim 1, further comprising a cover formed of a predetermined material, the cover covering the exposed connection portion. 3. A method of using a strip line device having the following elements: (a) a strip line forming step of forming a strip line device by exposing a part of an inner conductor; (b) the strip line forming step after the strip line forming step. A connecting step of connecting the exposed inner conductor of the line device to another device, (c) an installation step of installing the strip line device on a base after the strip line forming step.