JPH08172303A - Micro device - Google Patents

Abstract

PURPOSE: To prevent the radiation of electromagnetic waves from a microwave circuit such as a converter for mainly transmitting/receiving satellite broadcast. CONSTITUTION: This microwave device is provided with a 1st substrate 1 forming a signal line pattern 1b constituting a microwave circuit and a ground pattern 1d on one face of a 1st dielectric 1a, forming a ground conductor 2b on the other face and arranging circuit constituting parts 3 on the one face and a 2nd substrate 2 forming a ground conductor 2b on one face of a 2nd dielectric and forming a through hole 2c with a required range corresponding to the fixing position of the parts 3, the 1st and 2nd substrates 1, 2 are laminated so that the other face of the 2nd substrate 2 is in contact with the one face of the 1st substrate 1, and after the lamination of both the substrates 1, 2, the parts 3 of the lst substrate 1 is fixed through the through hole 2c formed on the 2nd substrate 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a microwave device,
More specifically, the present invention mainly relates to prevention of electromagnetic wave radiation in a microwave circuit such as a satellite broadcast receiving converter.

[0002]

2. Description of the Related Art FIG. 4 shows a configuration example of a conventional microstrip line substrate. A signal line pattern 11b, a ground pattern 11c (both are conductors) or the like is provided on one surface of the dielectric 11a, and required circuit components 12 such as HEMT and TR are soldered to the other surface. A ground conductor 11d is provided on the. A shield case 13 is provided on this substrate to prevent electromagnetic wave radiation. The shield case 13 is generally made of aluminum die cast, iron plate, or the like, and as its mounting method, it is soldered on the substrate or is fastened together with the substrate to the housing to which the substrate is attached with screws.

[0003]

Therefore, different kinds of components such as the substrate and the shield case are combined, and there is a drawback that the assembly work becomes a separate step at the time of assembly and the assembly work becomes complicated. In addition, it also becomes a factor that prevents miniaturization of the device. The present invention has been made in view of the above-mentioned drawbacks, and a microwave circuit is configured with a triplate line by multilayering a substrate, and a shield case that has been conventionally used is formed by forming a shield case with the multilayer substrate. It is an object of the present invention to provide an unnecessary microwave device.

[0004]

According to the present invention, a signal line pattern and a ground pattern forming a microwave circuit are provided on one surface of a first dielectric, and a ground conductor is provided on the other surface. A first substrate having circuit components mounted on one surface and a ground conductor on one surface of the second dielectric, and having a required range in a portion corresponding to the mounting location of the circuit components. A second substrate having a cutout hole is provided, and the first substrate and the second substrate are provided so that one surface of the first substrate is in contact with the other surface of the second substrate. (EN) A microwave device in which circuit components are mounted on the first substrate through the cutout holes formed in the second substrate after stacking the same.

[0005]

The first substrate constitutes a microstrip line. While stacking the second substrate on the first substrate to form a triplate line, the second substrate serves as a shield case. The airtightness and waterproofness are maintained by filling the opening of the laminated substrate with resin after the circuit parts are attached. Further, by further laminating the third substrate or the metal plate on the second substrate laminated on the first substrate, the shield effect against electromagnetic wave radiation is enhanced.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A microwave device according to the present invention will be described below with reference to the drawings. FIG. 1 is a side sectional view (A) of a main part after substrate lamination showing an embodiment of a microwave device according to the present invention.
FIG. 2 is a cross-sectional side view of the main part of FIG. 1 (A) before stacking, and FIG. 3 shows the case where the open holes are filled with resin.
Alternatively, it is a side cross-sectional view of an essential part for explanation when a substrate or a metal plate is further laminated. In each figure, 1 is a first substrate, 2
Is a second substrate, and 3 is a circuit component. The first substrate 1 is
Signal pattern 1b and ground pattern on one surface of the dielectric 1a
1c, and the ground conductor 1d is provided on the other surface. This first substrate 1 constitutes a microstrip line.

Further, the second substrate 2 is provided with the ground conductor 2b and the cutout hole 2c on one surface of the dielectric 2a. The cut-out hole 2c (open hole) is for allowing the component 3 to be attached to the first substrate 1. The ground pattern 2d is provided on the other surface of the dielectric 2a in order to enhance the shield effect, but it is not always necessary depending on the application. When the ground pattern 2d is provided, the ground pattern 2d is formed so as to overlap the ground pattern 1c of the first substrate 1, and the ground conductor 2b and the ground pattern 2d are connected by a through hole 2e at a required position. To do.

As described above, the independent first substrate 1 and second independent substrate (FIG. 2) are laminated. After the lamination, conductor plating 4 is applied to the ground conductor 2b of the second substrate 2, the inside of the cutout hole 2c (the ground pattern 1c of the first substrate 1), and the peripheral portion (the ground conductor 1d of the first substrate 1). Give. Specifically, it is electroless plating or the like. In addition, during this plating process, a resist, a mask, or the like is provided at a required position so as not to hinder the subsequent mounting of the circuit component 3 and the like. As a result, the second substrate 2 functions as an upper substrate of the triplate line and also functions as a shield case. The circuit component 3 is attached to the first substrate 1 in the conductor-plated laminated substrate through the cutout hole 2c.

There are the following methods as the processing after the parts are attached depending on the application. (1) The cutout hole 2c for mounting parts is filled with the resin 5 of the required material by filling (FIG. 3A). Due to this filling, airtightness and waterproofness are maintained. Since the material of the resin is in the microwave band, a material having good high frequency characteristics (for example, epoxy type) is used. (2) The entire completed substrate is molded with the resin 6 of the required material (FIG. 3B). This mold further enhances the airtightness and waterproofness. The resin material is the same as the previous item.

(3) A third substrate 7 is further laminated on the upper surface of the second substrate 2 (FIG. 3C). Ground conductors 7b and 7c are provided on both surfaces of the dielectric 7a on the third substrate 7, and the ground conductors are connected by through holes 7d. This enhances the shield effect against electromagnetic radiation. (4) The metal plate 8 is laminated on the upper surface of the second substrate 2 (see FIG. 3).
D). This is a method of laminating a metal plate in place of the substrate 7 of the above item 3. This method also enhances the shielding effect against electromagnetic radiation. The material, thickness, size (area), etc. of the metal plate may be appropriately determined according to the application. It should be noted that the signal input / output to / from the completed board is performed by a connector, or the ground conductor surface outside the board (in the case of FIG. 1, the ground conductor 1d of the first board 1 is used.
A surface may be provided with a slot and electromagnetic coupling may be used. Particularly, in the case of using the slot, since the substrate configuration is a triplate line, input / output from the ground conductor 1d surface of the first substrate 1 is possible, and it is also possible to provide a slot on the second substrate side. Has the advantage that

[0011]

As described above, according to the present invention, the second substrate in which the grounding conductor and the cutout holes for enabling the attachment of components are provided in the first substrate constituting the conventional microstrip line. Since the second substrate is laminated, the second substrate serves as an upper substrate of the triplate line, while also serving as a shield case against electromagnetic radiation. Also, the cutout holes allow parts to be attached without problems. Therefore, conventionally, the first substrate is shielded by a shield case such as an aluminum die cast or an iron plate in order to prevent electromagnetic radiation, but the present invention eliminates the need for this shield case. This eliminates the need for man-hours for mounting the shield case and parts such as screws for mounting the same. In addition, when the shield case is attached, since the board and the sheet metal are different parts from each other, they are separate steps in the assembly process, and the assembly work is complicated. It is possible to perform batch processing in the same process. From the above, it is possible to reduce the processing man-hours, the number of parts, and the like, and further downsize by laminating the substrates.

[Brief description of drawings]

FIG. 1 is a side sectional view (A) of a main part after stacking and a top view (B) of the main part showing an embodiment of a microwave device according to the present invention.
Is.

FIG. 2 is a side sectional view of a main part before stacking with respect to FIG.

FIG. 3 is a side sectional view of an essential part for explaining the processing of the laminated substrate after component mounting, where (A) is a case where the cutout hole is filled with resin, (B) is a case where the entire substrate is molded with resin,
(C) is a case where another substrate is laminated on the laminated substrate,
And (D) show a case where a metal plate is laminated on the substrate after lamination.

FIG. 4 is a side sectional view of an essential part showing an example of a conventional microwave device.

[Explanation of symbols]

 1 1st board 1a Dielectric 1b Signal line pattern 1c Grounding pattern 1d Grounding conductor 2 2nd board 2a Dielectric 2b Grounding conductor 2c Cutout hole 2d Grounding pattern 2e Through hole 3 Circuit component 4 Conductor plating 5 Resin 7 3rd Substrate 8 Metal plate

Claims (7)

[Claims] 1. A first dielectric is provided with a signal line pattern and a ground pattern forming a microwave circuit on one surface, and a ground conductor is provided on the other surface, and a circuit component is provided on the one surface. A second substrate comprising a first substrate to be mounted, a ground conductor on one surface of a second dielectric, and a cutout hole in a required range at a portion corresponding to a mounting location of the circuit component. The first substrate and the second substrate are laminated such that one surface of the first substrate is in contact with the other surface of the second substrate, and after the lamination, the first substrate and the second substrate are laminated. A microwave device, wherein circuit components are attached to the first substrate through cutout holes provided in the second substrate. 2. The first surface on the other surface of the second substrate
A grounding pattern is provided so as to overlap with the grounding pattern provided on one surface of the substrate, and the provided ground pattern and the grounding conductor on the one surface of the second substrate are connected by through holes. The microwave device according to claim 1, wherein: 3. The microwave device according to claim 1, wherein after the first substrate and the second substrate are laminated, the conductor portions of the respective substrates are conductor-plated. 4. A circuit component is mounted on the first substrate, and then a cutout hole portion of the second substrate laminated on the first substrate is filled with a required resin. The microwave device according to claim 1. 5. The micro according to claim 1, wherein after the circuit components are attached to the first substrate, the entire laminated first substrate and second substrate are molded with a required resin. Wave device. 6. After mounting circuit components on the first substrate, ground conductors are further provided on the one surface of the second substrate laminated on the first substrate and on both surfaces of the dielectric. The microwave device according to claim 1, further comprising a third substrate formed by laminating both ground conductors with through holes. 7. After mounting circuit components on the first substrate, a metal plate of a required size is further laminated on the one surface of the second substrate laminated on the first substrate. The microwave device according to claim 1, wherein: