JPH09107192A - Printed board and printed board serving also as case and portable communication appliance - Google Patents
Printed board and printed board serving also as case and portable communication applianceInfo
- Publication number
- JPH09107192A JPH09107192A JP7261695A JP26169595A JPH09107192A JP H09107192 A JPH09107192 A JP H09107192A JP 7261695 A JP7261695 A JP 7261695A JP 26169595 A JP26169595 A JP 26169595A JP H09107192 A JPH09107192 A JP H09107192A
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic wave
- circuit
- wave shield
- shield layer
- case
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント基板およ
びケース兼用プリント基板ならびに携帯型通信機器に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed board, a printed board that also serves as a case, and a portable communication device.
【０００２】[0002]
【従来の技術及び発明が解決しようとする課題】近頃で
は、例えば携帯電話やポケットベル等のような携帯型通
信機器が盛んに用いられている。ところが、このような
携帯型通信機器は、電磁波ノイズが多い場所で使用され
ることがあり、機器の内部に設けられている電子回路が
電磁波ノイズによって誤動作を起こす虞があった。2. Description of the Related Art Recently, portable communication devices such as mobile phones and pagers have been widely used. However, such a portable communication device may be used in a place where there is a lot of electromagnetic noise, and an electronic circuit provided inside the device may malfunction due to the electromagnetic noise.
【０００３】本発明は、前記課題を解決するためになさ
れ、電子機器の内部に設けられている電子回路を電磁波
ノイズから保護し、電子回路の誤動作を防止することの
できるプリント基板およびケース兼用プリント基板およ
び携帯型通信機器を提供することを目的とする。The present invention has been made to solve the above problems, and protects an electronic circuit provided inside an electronic device from electromagnetic noise and prevents malfunction of the electronic circuit. An object is to provide a substrate and a portable communication device.
【０００４】[0004]
【課題を解決するための手段及び発明の効果】前記目的
を達成するための請求項１の発明は、電気絶縁性の基板
の上に回路を形成したプリント基板において、該基板に
導電層からなる電磁波シールド層を設けたことを特徴と
する。In order to achieve the above object, the invention of claim 1 is a printed circuit board in which a circuit is formed on an electrically insulating substrate, and the substrate is made of a conductive layer. It is characterized in that an electromagnetic wave shield layer is provided.
【０００５】前記構成を有するプリント基板において
は、導電性の回路上に例えばＩＣや抵抗等の電子部品を
はんだ付けして電子回路を形成し、このプリント基板
を、電子機器の外装ケースの内部に取り付けて使用す
る。このように使用した場合、基板に電磁波シールド層
が設けられているので、電子機器の外部から侵入する電
磁波ノイズが電磁波シールド層によって反射あるいは吸
収される。よって、電磁波ノイズによる電子回路の誤動
作を防止することができ、機器の動作の信頼性が高ま
る。In the printed circuit board having the above structure, an electronic circuit such as an IC or a resistor is soldered on a conductive circuit to form an electronic circuit, and the printed circuit board is placed inside an outer case of an electronic device. Attach and use. When used in this manner, since the electromagnetic wave shield layer is provided on the substrate, electromagnetic wave noise that enters from the outside of the electronic device is reflected or absorbed by the electromagnetic wave shield layer. Therefore, malfunction of the electronic circuit due to electromagnetic noise can be prevented, and the reliability of operation of the device is enhanced.
【０００６】ここで、請求項１のプリント基板は、電子
機器の外装ケースとは別体に設けられるので、その分だ
け外装ケースが大型化してしまう。そこで、外装ケース
を小型化して電子機器をコンパクト化するためには、請
求項２に記載のような構成を採用することが望ましい。
即ち、請求項２の発明は、電子機器等に用いられる電気
絶縁性の外装ケースの内面上に回路を形成したケース兼
用プリント基板において、該外装ケースに導電層からな
る電磁波シールド層を設けたことを特徴とする。Since the printed circuit board according to the first aspect is provided separately from the outer case of the electronic device, the outer case becomes large accordingly. Therefore, in order to reduce the size of the outer case to make the electronic device compact, it is desirable to adopt the configuration as described in claim 2.
That is, the invention according to claim 2 is a case-use printed circuit board in which a circuit is formed on the inner surface of an electrically insulating outer case used for an electronic device or the like, wherein the outer case is provided with an electromagnetic wave shield layer made of a conductive layer. Is characterized by.
【０００７】前記構成を有する請求項２によれば、外装
ケースに電磁波シールド層が設けられているので、外部
からの電磁波ノイズが電磁波シールド層によって反射あ
るいは吸収され、請求項１と同様に、電磁波ノイズによ
る電子回路が誤動作を防止できる。そして、特に請求項
２の発明においては、外装ケースの内面上に回路が形成
されており、この回路に電子部品を実装して電子回路を
形成できるので、外装ケースの中に別途プリント基板を
取り付ける必要が無い。従って、外装ケースを小型化し
て、電子機器のコンパクト化を図ることができる。According to claim 2 having the above structure, since the electromagnetic wave shield layer is provided in the outer case, electromagnetic wave noise from the outside is reflected or absorbed by the electromagnetic wave shield layer, and the electromagnetic wave is the same as in claim 1. The electronic circuit due to noise can be prevented from malfunctioning. In particular, according to the invention of claim 2, a circuit is formed on the inner surface of the outer case, and an electronic circuit can be formed by mounting an electronic component on this circuit. Therefore, a separate printed circuit board is mounted in the outer case. There is no need. Therefore, the outer case can be downsized, and the electronic device can be made compact.
【０００８】ところで、前記請求項２の発明において
は、電磁波シールド層を外装ケースの内面上に設けても
よいし、あるいは外面上に設けてもよい。しかしなが
ら、外面上に設けた場合、電磁波シールド層が外部に露
出しているので、電子機器を取り扱っているうちに電磁
波シールド層に傷が付き、シールド層が破れてシールド
効果が低下してしまう場合がある。また、このような事
態を避けるために、電磁波シールド層を厚くすることも
考えられるが、電磁波シールド層を必要以上に厚くする
ことは、機器の軽量化やコスト等の面から好ましくな
い。よって、電磁波シールド層は、外装ケースの内面上
に設けることが好ましい。By the way, in the invention of claim 2, the electromagnetic wave shield layer may be provided on the inner surface of the outer case or on the outer surface thereof. However, when it is provided on the outer surface, the electromagnetic wave shield layer is exposed to the outside, so that the electromagnetic wave shield layer is damaged while the electronic device is being handled, and the shield layer is broken and the shield effect is reduced. There is. Further, in order to avoid such a situation, it is possible to make the electromagnetic wave shield layer thick, but it is not preferable to make the electromagnetic wave shield layer thicker than necessary in terms of weight reduction and cost of the device. Therefore, the electromagnetic wave shield layer is preferably provided on the inner surface of the outer case.
【０００９】そして、電磁波シールド層を外装ケースの
内面上に設けた場合、この電磁波シールド層の上に回路
を設けなければならないのであるが、回路を設ける方法
としては、例えば電磁波シールド層の全面を絶縁性のフ
ィルムで被覆したり、あるいはシールド層の上に絶縁性
の塗料を塗布する等して電気絶縁層を形成し、その上
に、エッチングやメッキ等の周知の方法によって導電性
の回路を形成することが考えられる。しかしながら、こ
のような場合、電気絶縁層を形成するための工程と、回
路を形成するための工程とを別々に行う必要があり、製
造がやや面倒になる。そこで、請求項２のプリント基板
をより簡便に製造するためには、請求項３に記載のよう
な構成を採用することが望ましい。即ち、請求項３の発
明は、請求項２に記載のケース兼用プリント基板であっ
て、前記外装ケースの内面上に前記電磁波シールド層を
設け、該電磁波シールド層の上に、絶縁性の接着層を有
する転写用箔を用いて前記回路を直接印刷したことを特
徴とする。When the electromagnetic wave shield layer is provided on the inner surface of the outer case, the circuit must be provided on the electromagnetic wave shield layer. As a method of providing the circuit, for example, the entire surface of the electromagnetic wave shield layer is provided. An electrically insulating layer is formed by coating it with an insulating film or by coating an insulating paint on the shield layer, and then forming a conductive circuit by a well-known method such as etching or plating. It is possible to form. However, in such a case, it is necessary to separately perform the step of forming the electric insulating layer and the step of forming the circuit, which makes the manufacturing a little complicated. Therefore, in order to more easily manufacture the printed circuit board according to the second aspect, it is desirable to adopt the configuration as described in the third aspect. That is, the invention of claim 3 is the case-use printed board according to claim 2, wherein the electromagnetic wave shield layer is provided on an inner surface of the outer case, and an insulating adhesive layer is provided on the electromagnetic wave shield layer. The circuit is directly printed using a transfer foil having
【００１０】請求項３のケース兼用プリント基板を製造
する場合、転写用箔を電磁波シールド層の上にセット
し、例えばステロ版等を用いて、転写用箔を加圧または
加熱して電磁波シールド層に押し付けることにより、電
磁波シールド層の上に、接着層を介して回路を接着させ
る。よって、電磁波シールド層の上に、電気絶縁層およ
び回路の両方を一度に形成することができるので、少な
い工程で簡便に回路を形成できるという利点がある。In the case of manufacturing the case-use printed circuit board according to claim 3, the transfer foil is set on the electromagnetic wave shield layer, and the transfer foil is pressed or heated by using, for example, a stero plate or the like to press the electromagnetic wave shield layer. The circuit is adhered onto the electromagnetic wave shield layer via the adhesive layer by pressing the circuit to the electromagnetic wave shield layer. Therefore, both the electric insulating layer and the circuit can be formed at once on the electromagnetic wave shield layer, which has an advantage that the circuit can be easily formed with a small number of steps.
【００１１】また、前記課題を解決するための請求項４
の発明は、外装ケースの内部に回路が設けられた携帯型
通信機器であって、該外装ケースの内面上の全面に電磁
波シールド層を設け、該電磁波シールド層の上に、絶縁
性の接着層を有する転写用箔を用いて前記回路を直接印
刷したことを特徴とする。A fourth aspect of the present invention for solving the above problems.
The invention is a portable communication device in which a circuit is provided inside an outer case, wherein an electromagnetic wave shield layer is provided on the entire inner surface of the outer case, and an insulating adhesive layer is provided on the electromagnetic wave shield layer. The circuit is directly printed using a transfer foil having
【００１２】前記構成を有する携帯型通信機器によれ
ば、外装ケースの内面上の全面に電磁波シールド層を設
けているので、外部からの電磁波ノイズが電磁波シール
ド層によって反射あるいは吸収され、電磁波ノイズによ
る電子回路の誤動作を防止できる。また、内装ケース内
側の電磁波シールド層の上に回路を直接印刷しているの
で、外装ケースを小型化して、携帯型通信機器をコンパ
クトにすることができる。しかも、電磁波シールド層の
上に、絶縁性の接着層を有する転写用箔を用いて回路を
直接印刷しているので、請求項３の場合と同様に、少な
い工程で簡便に回路を形成できるという利点がある。更
に、電磁波シールド層を受信回路に電気的に接続すれ
ば、電磁波シールド層をアンテナとして使用することも
できる。このようにすれば、外装ケースに別途アンテナ
を設ける必要が無くなるので、より一層携帯型通信機器
のコンパクト化を達成することができる。According to the portable communication device having the above structure, since the electromagnetic wave shield layer is provided on the entire inner surface of the outer case, the electromagnetic wave noise from the outside is reflected or absorbed by the electromagnetic wave shield layer, which causes the electromagnetic wave noise. The malfunction of the electronic circuit can be prevented. Further, since the circuit is directly printed on the electromagnetic wave shield layer inside the inner case, the outer case can be downsized and the portable communication device can be made compact. Moreover, since the circuit is directly printed on the electromagnetic wave shield layer by using the transfer foil having the insulating adhesive layer, the circuit can be simply formed with a small number of steps as in the case of claim 3. There are advantages. Furthermore, if the electromagnetic wave shield layer is electrically connected to the receiving circuit, the electromagnetic wave shield layer can be used as an antenna. By doing so, it is not necessary to separately provide an antenna in the outer case, and thus the portable communication device can be made more compact.
【００１３】[0013]
【発明の実施の形態】以下、本発明の実施の形態を一実
施例に基づいて説明する。ここで、図１は、本実施例の
携帯電話機１の概略構成を示す断面図である。本実施例
の携帯電話機１は、絶縁性の合成樹脂よりなる外装ケー
ス３の内部に、従来の携帯電話機と同様に、スピーカ５
と、マイクロフォン６と、プッシュスイッチ７等の部品
が集約されたプリント板ユニット８と、送受信回路９と
が設けられたものである。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to an embodiment. Here, FIG. 1 is a cross-sectional view showing a schematic configuration of the mobile phone 1 of the present embodiment. The mobile phone 1 of this embodiment has a speaker 5 inside an outer case 3 made of an insulating synthetic resin, similar to a conventional mobile phone.
1, a microphone 6, a printed board unit 8 in which components such as a push switch 7 are integrated, and a transmission / reception circuit 9 are provided.
【００１４】外装ケース３は、上ケース１１と、この上
ケース１１に対して着脱可能に取り付けられる裏蓋１２
とからなるものであり、この上ケース１１および裏蓋１
２の内面全体にわたって導電性塗料を塗布することによ
って、電磁波シールド層１３，１４が形成されている。
なお、裏蓋１２を上ケース１１に取り付けた場合、電磁
波シールド層１３、１４同士が電気的に接続されるよう
に構成されており、電磁波を確実にシールドできるよう
なっている。また、電磁波シールド層１３，１４は、送
受信回路９の受信装置（図示略）に電気的に接続されて
いる。これにより、両電磁波シールド層１３，１４はア
ンテナとして機能する。よって、別途アンテナを設ける
必要が無くなるので、携帯電話機１がコンパクトにな
る。The exterior case 3 includes an upper case 11 and a back cover 12 detachably attached to the upper case 11.
And the upper case 11 and the back cover 1
Electromagnetic wave shield layers 13 and 14 are formed by applying a conductive paint over the entire inner surface of 2.
When the back cover 12 is attached to the upper case 11, the electromagnetic wave shield layers 13 and 14 are configured to be electrically connected to each other, so that electromagnetic waves can be reliably shielded. The electromagnetic wave shield layers 13 and 14 are electrically connected to a receiver (not shown) of the transmitter / receiver circuit 9. Thereby, both electromagnetic wave shield layers 13 and 14 function as an antenna. Therefore, it is not necessary to separately provide an antenna, and the mobile phone 1 becomes compact.
【００１５】ここで、図２に示すように、裏蓋１２の電
磁波シールド層１４の上には、送受信回路９を形成する
ための回路１６が直接印刷されている。図３のＡ−Ａ断
面図に示すように、回路１６は、厚さ数十μｍ程度の銅
よりなる導電層２０の上に、はんだ用フラックスよりな
る保護層２２が形成されたものであり、電気絶縁性の接
着層１８を介して電磁波シールド層１４の上に接着され
ている。Here, as shown in FIG. 2, a circuit 16 for forming the transmitting / receiving circuit 9 is directly printed on the electromagnetic wave shielding layer 14 of the back cover 12. As shown in the AA cross-sectional view of FIG. 3, the circuit 16 has a protective layer 22 made of a soldering flux formed on a conductive layer 20 made of copper and having a thickness of about several tens of μm. It is adhered on the electromagnetic wave shield layer 14 via an electrically insulating adhesive layer 18.
【００１６】回路１６は、図４に示すような転写用箔Ｈ
を用いて形成される。この転写用箔Ｈは、下から順に、
接着層１８，導電層２０，保護層２２，分離層２４，ポ
リエステル製の担体テープ２６を重ねたものである。こ
こで、導電層２０は、プレスまたはステロ版により賦活
された領域が未賦活領域からシャープに剥離するに十分
な弱い剪断強度を持つ。また、接着層１８は、ステロ版
によって加圧、加熱された場合に接着作用が生じるよう
な溶融接着剤よりなるものである。また、分離層２４
は、機能層２０を担体テープ２６に接着するのに十分な
接着性を有するが、ステロ版によってプレスされた領域
ではその接着性を失うものである。なお、このような転
写用箔Ｈとしては、例えば特公平２−２５２７４号公報
に開示されるものを利用することができる。The circuit 16 is a transfer foil H as shown in FIG.
It is formed by using. This transfer foil H is
The adhesive layer 18, the conductive layer 20, the protective layer 22, the separation layer 24, and the polyester carrier tape 26 are stacked. Here, the conductive layer 20 has a sufficiently weak shear strength that a region activated by a press or a stero plate is peeled off sharply from an unactivated region. The adhesive layer 18 is made of a molten adhesive that causes an adhesive action when pressed and heated by a stero plate. In addition, the separation layer 24
Has sufficient adhesiveness to adhere the functional layer 20 to the carrier tape 26, but loses its adhesiveness in the area pressed by the stero plate. As such a transfer foil H, for example, one disclosed in Japanese Patent Publication No. 25274/1990 can be used.
【００１７】回路１６は、以下のような手順で形成され
る。まず、図４（Ａ）に示すように、転写用箔Ｈを、裏
蓋１２の電磁波シールド層１４の上に敷く。次に、担体
テープ２６の上から、加熱プレス型に固着したステロ版
３０を押し当てる。すると、接着層１８の内、ステロ版
３０によって加圧、加熱されている部分１８ａ、即ち回
路を形成する部分が賦活されて接着作用が生じる。これ
により、接着層１８を介して、導電層２０が電磁波シー
ルド層１４上に接着される。一方、分離層２４の内、ス
テロ版３０によって加圧、加熱されている部分２４ａ
は、担体テープ２６から導電層２０および保護層２２を
分離することができるように賦活される。そして、図４
（Ｂ）に示すように、ステロ版３０を引き上げ、担体テ
ープ２６を転写用箔の残余未賦活部分と一緒に電磁波シ
ールド層１４から除去すると、導電層２０の内、ステロ
版３０によって加圧されていた部分が、保護層２２と分
離層２４の一部を伴って、電磁波シールド層１４の上に
強固に接着され、回路１６が形成される。The circuit 16 is formed by the following procedure. First, as shown in FIG. 4A, the transfer foil H is laid on the electromagnetic wave shield layer 14 of the back cover 12. Next, the stero plate 30 fixed to the heating press die is pressed against the carrier tape 26. Then, of the adhesive layer 18, the portion 18a which is pressurized and heated by the stero plate 30 is activated, that is, the portion forming a circuit is activated, and an adhesive action is generated. As a result, the conductive layer 20 is adhered onto the electromagnetic wave shield layer 14 via the adhesive layer 18. On the other hand, of the separation layer 24, a portion 24a that is pressed and heated by the stero plate 30.
Are activated so that the conductive layer 20 and the protective layer 22 can be separated from the carrier tape 26. And FIG.
As shown in (B), when the stele plate 30 is pulled up and the carrier tape 26 is removed from the electromagnetic wave shield layer 14 together with the remaining unactivated portion of the transfer foil, the stele plate 30 in the conductive layer 20 is pressed. That part is firmly adhered onto the electromagnetic wave shield layer 14 together with the protective layer 22 and a part of the separation layer 24 to form the circuit 16.
【００１８】そして、回路１６上に例えばＩＣや抵抗等
の電子部品をはんだ付けして、導電層２０と電子部品と
を電気的に接続することにより、送受信回路９を形成す
ることができる。以上詳述したように、本実施例の携帯
電話機１においては、外装ケース１０の内面上の全面に
電磁波シールド層１３，１４が設けられているので、外
装ケース１０の外部から侵入する電磁波ノイズが、電磁
波シールド層１３，１４によって反射あるいは吸収さ
れ、裏蓋１２の内側に形成された送受信回路９が電磁波
ノイズから保護される。よって、電磁波ノイズによる電
子回路の誤動作を防止できるという効果がある。しか
も、外装ケース１０の裏蓋１２の内面上に回路１６を形
成しているので、外装ケース１０の中に別途プリント基
板を取り付ける必要が無く、機器のコンパクト化を図る
ことができるという効果がある。Then, the transmission / reception circuit 9 can be formed by soldering an electronic component such as an IC or a resistor on the circuit 16 to electrically connect the conductive layer 20 and the electronic component. As described above in detail, in the mobile phone 1 of the present embodiment, since the electromagnetic wave shield layers 13 and 14 are provided on the entire inner surface of the outer case 10, electromagnetic wave noise that enters from the outside of the outer case 10 is generated. The transmission / reception circuit 9 formed inside the case back 12 is protected from electromagnetic noise by being reflected or absorbed by the electromagnetic wave shielding layers 13 and 14. Therefore, there is an effect that a malfunction of the electronic circuit due to electromagnetic noise can be prevented. In addition, since the circuit 16 is formed on the inner surface of the case back 12 of the outer case 10, there is no need to separately install a printed circuit board in the outer case 10, and the device can be made compact. .
【００１９】また、本実施例においては、外装ケース１
０の内面上に電磁波シールド層１３，１４を設けている
ので、電磁波シールド層１３，１４に傷が付いて破れる
ことがなく、シールド効果が低下するおそれもない。よ
って、電磁波シールド層１３，１４を必要以上に厚く形
成する必要もなく、機器の軽量化やコストダウンを図る
ことができる。Further, in this embodiment, the outer case 1
Since the electromagnetic wave shield layers 13 and 14 are provided on the inner surface of No. 0, the electromagnetic wave shield layers 13 and 14 are not scratched and broken, and the shield effect is not likely to deteriorate. Therefore, it is not necessary to form the electromagnetic wave shield layers 13 and 14 to be thicker than necessary, and it is possible to reduce the weight and cost of the device.
【００２０】しかも、本実施例においては、絶縁性の接
着層１８を有する転写用箔Ｈを用いて、電磁波シールド
層１４の上に回路１６を直接印刷している。よって、電
磁波シールド層１４の上に、回路１６と、この回路１６
を電磁波シールド層１４から電気的に絶縁するための接
着層１８とを一度に形成することができるので、回路１
６を少ない工程で簡便に製造できるという利点がある。Moreover, in this embodiment, the circuit 16 is directly printed on the electromagnetic wave shield layer 14 by using the transfer foil H having the insulating adhesive layer 18. Therefore, the circuit 16 and the circuit 16 are provided on the electromagnetic wave shield layer 14.
Since the adhesive layer 18 for electrically insulating the electromagnetic wave shielding layer 14 from the electromagnetic wave shielding layer 14 can be formed at one time, the circuit 1
6 has an advantage that it can be easily manufactured in a small number of steps.
【００２１】以上実施例について説明したが、本発明は
上記実施例に限定されるものではなく、種々の態様で実
施し得る。例えば、本実施例では、導電性塗料を塗布す
ることによって電磁波シールド層１４を形成している
が、本発明はこれに限らず、例えば銅等の金属メッキを
施したり、あるいは銅やアルミニウム等の金属箔を接着
してもよい。Although the embodiments have been described above, the present invention is not limited to the above embodiments and can be implemented in various modes. For example, in the present embodiment, the electromagnetic wave shield layer 14 is formed by applying a conductive paint, but the present invention is not limited to this, and for example, metal plating such as copper is applied, or copper or aluminum is applied. You may adhere a metal foil.
【００２２】また、電磁波シールド層を設ける部位は、
外装ケース１０の内面上に限らず、例えば図４（Ａ）に
１点鎖線で示すように、裏蓋１２の外面上に電磁波シー
ルド層３２を設けることもできる。あるいは、２点鎖線
で示すように、裏蓋１２の内部に電磁波シールド層３４
を設けることもできる。The portion where the electromagnetic wave shield layer is provided is
The electromagnetic wave shield layer 32 can be provided not only on the inner surface of the outer case 10 but also on the outer surface of the back cover 12 as shown by a chain line in FIG. Alternatively, as shown by the chain double-dashed line, the electromagnetic wave shield layer 34 is provided inside the case back 12.
Can also be provided.
【００２３】なお、本実施例のような外装ケースは、携
帯電話機に限らず、例えばポケットベル、トランシーバ
ー等の各種の携帯型通信機器の外装ケースに適用するこ
ともできる。The outer case as in this embodiment is not limited to a mobile phone, but can be applied to an outer case of various portable communication devices such as pagers and transceivers.
【図１】実施例の携帯電話機の概略構成を示す断面図で
ある。FIG. 1 is a sectional view showing a schematic configuration of a mobile phone of an embodiment.
【図２】外装ケースの裏蓋を示す斜視図である。FIG. 2 is a perspective view showing a back cover of the outer case.
【図３】図２におけるＡ−Ａ断面図である。FIG. 3 is a sectional view taken along line AA in FIG. 2;
【図４】実施例の回路の製造方法を示す説明図である。FIG. 4 is an explanatory diagram showing the method of manufacturing the circuit of the example.
１０…外装ケース １１…上ケー
ス １２…裏蓋 １３，１４…
電磁波シールド層 １６…回路 １８…接着層 ２０…導電層 ２２…保護層 ３０…ステロ版10 ... Exterior case 11 ... Upper case 12 ... Back cover 13, 14 ...
Electromagnetic wave shield layer 16 ... Circuit 18 ... Adhesive layer 20 ... Conductive layer 22 ... Protective layer 30 ... Stero plate
Claims (4)
プリント基板において、 該基板に導電層からなる電磁波シールド層を設けたこと
を特徴とするプリント基板。1. A printed circuit board having a circuit formed on an electrically insulating substrate, wherein the substrate is provided with an electromagnetic wave shield layer made of a conductive layer.
装ケースの内面上に回路を形成したケース兼用プリント
基板において、 該外装ケースに導電層からなる電磁波シールド層を設け
たことを特徴とするケース兼用プリント基板。2. A case-cum-printed circuit board having a circuit formed on the inner surface of an electrically insulating outer case used for electronic equipment or the like, wherein an electromagnetic wave shield layer made of a conductive layer is provided on the outer case. Printed circuit board that also serves as a case.
板であって、前記外装ケースの内面上に前記電磁波シー
ルド層を設け、該電磁波シールド層の上に、絶縁性の接
着層を有する転写用箔を用いて前記回路を直接印刷した
ことを特徴とするケース兼用プリント基板。3. The printed circuit board which also serves as a case according to claim 2, wherein the electromagnetic wave shield layer is provided on an inner surface of the outer case, and an insulating adhesive layer is provided on the electromagnetic wave shield layer. A printed circuit board which also serves as a case, wherein the circuit is directly printed using a foil.
帯型通信機器であって、該外装ケースの内面上の全面に
電磁波シールド層を設け、該電磁波シールド層の上に、
絶縁性の接着層を有する転写用箔を用いて前記回路を直
接印刷したことを特徴とする携帯型通信機器。4. A portable communication device having a circuit provided inside an outer case, wherein an electromagnetic wave shield layer is provided on an entire inner surface of the outer case, and the electromagnetic wave shield layer is provided on the electromagnetic wave shield layer.
A portable communication device, wherein the circuit is directly printed using a transfer foil having an insulating adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7261695A JPH09107192A (en) | 1995-10-09 | 1995-10-09 | Printed board and printed board serving also as case and portable communication appliance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7261695A JPH09107192A (en) | 1995-10-09 | 1995-10-09 | Printed board and printed board serving also as case and portable communication appliance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09107192A true JPH09107192A (en) | 1997-04-22 |
Family
ID=17365433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7261695A Pending JPH09107192A (en) | 1995-10-09 | 1995-10-09 | Printed board and printed board serving also as case and portable communication appliance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09107192A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1122977A2 (en) * | 2000-02-02 | 2001-08-08 | paragon AG | Microphone |
| US6288910B1 (en) | 1999-03-15 | 2001-09-11 | Alps Electric Co., Ltd. | Transmit-receive unit |
| US7242089B2 (en) | 2000-11-28 | 2007-07-10 | Knowles Electronics, Llc | Miniature silicon condenser microphone |
| EP1821570A1 (en) * | 2000-11-28 | 2007-08-22 | Knowles Electronics, LLC | Miniature silicon condenser microphone and method for producing same |
| US7382048B2 (en) | 2003-02-28 | 2008-06-03 | Knowles Electronics, Llc | Acoustic transducer module |
| US7381589B2 (en) | 2000-11-28 | 2008-06-03 | Knowles Electronics, Llc | Silicon condenser microphone and manufacturing method |
| US7439616B2 (en) | 2000-11-28 | 2008-10-21 | Knowles Electronics, Llc | Miniature silicon condenser microphone |
| US7501703B2 (en) | 2003-02-28 | 2009-03-10 | Knowles Electronics, Llc | Acoustic transducer module |
| JP2015080226A (en) * | 2012-09-26 | 2015-04-23 | 株式会社村田製作所 | Electronic apparatus |
| US9040360B1 (en) | 2000-11-28 | 2015-05-26 | Knowles Electronics, Llc | Methods of manufacture of bottom port multi-part surface mount MEMS microphones |
| US9078063B2 (en) | 2012-08-10 | 2015-07-07 | Knowles Electronics, Llc | Microphone assembly with barrier to prevent contaminant infiltration |
| US9374643B2 (en) | 2011-11-04 | 2016-06-21 | Knowles Electronics, Llc | Embedded dielectric as a barrier in an acoustic device and method of manufacture |
| US9794661B2 (en) | 2015-08-07 | 2017-10-17 | Knowles Electronics, Llc | Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package |
-
1995
- 1995-10-09 JP JP7261695A patent/JPH09107192A/en active Pending
Cited By (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6288910B1 (en) | 1999-03-15 | 2001-09-11 | Alps Electric Co., Ltd. | Transmit-receive unit |
| EP1122977A2 (en) * | 2000-02-02 | 2001-08-08 | paragon AG | Microphone |
| EP1122977A3 (en) * | 2000-02-02 | 2005-05-11 | paragon AG | Microphone |
| US9024432B1 (en) | 2000-11-28 | 2015-05-05 | Knowles Electronics, Llc | Bottom port multi-part surface mount MEMS microphone |
| US9338560B1 (en) | 2000-11-28 | 2016-05-10 | Knowles Electronics, Llc | Top port multi-part surface mount silicon condenser microphone |
| US9051171B1 (en) | 2000-11-28 | 2015-06-09 | Knowles Electronics, Llc | Bottom port surface mount MEMS microphone |
| US7381589B2 (en) | 2000-11-28 | 2008-06-03 | Knowles Electronics, Llc | Silicon condenser microphone and manufacturing method |
| US7434305B2 (en) | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
| US7439616B2 (en) | 2000-11-28 | 2008-10-21 | Knowles Electronics, Llc | Miniature silicon condenser microphone |
| US9040360B1 (en) | 2000-11-28 | 2015-05-26 | Knowles Electronics, Llc | Methods of manufacture of bottom port multi-part surface mount MEMS microphones |
| US7537964B2 (en) | 2000-11-28 | 2009-05-26 | Knowles Electronics, Llc | Method of fabricating a miniature silicon condenser microphone |
| EP1821570A1 (en) * | 2000-11-28 | 2007-08-22 | Knowles Electronics, LLC | Miniature silicon condenser microphone and method for producing same |
| US8018049B2 (en) | 2000-11-28 | 2011-09-13 | Knowles Electronics Llc | Silicon condenser microphone and manufacturing method |
| US9006880B1 (en) | 2000-11-28 | 2015-04-14 | Knowles Electronics, Llc | Top port multi-part surface mount silicon condenser microphone |
| US9139422B1 (en) | 2000-11-28 | 2015-09-22 | Knowles Electronics, Llc | Bottom port surface mount MEMS microphone |
| US9023689B1 (en) | 2000-11-28 | 2015-05-05 | Knowles Electronics, Llc | Top port multi-part surface mount MEMS microphone |
| US7242089B2 (en) | 2000-11-28 | 2007-07-10 | Knowles Electronics, Llc | Miniature silicon condenser microphone |
| US9156684B1 (en) | 2000-11-28 | 2015-10-13 | Knowles Electronics, Llc | Methods of manufacture of top port surface mount MEMS microphones |
| US9150409B1 (en) | 2000-11-28 | 2015-10-06 | Knowles Electronics, Llc | Methods of manufacture of bottom port surface mount MEMS microphones |
| US9061893B1 (en) | 2000-11-28 | 2015-06-23 | Knowles Electronics, Llc | Methods of manufacture of top port multi-part surface mount silicon condenser microphones |
| US9067780B1 (en) | 2000-11-28 | 2015-06-30 | Knowles Electronics, Llc | Methods of manufacture of top port surface mount MEMS microphones |
| US9148731B1 (en) | 2000-11-28 | 2015-09-29 | Knowles Electronics, Llc | Top port surface mount MEMS microphone |
| US9096423B1 (en) | 2000-11-28 | 2015-08-04 | Knowles Electronics, Llc | Methods of manufacture of top port multi-part surface mount MEMS microphones |
| US9133020B1 (en) | 2000-11-28 | 2015-09-15 | Knowles Electronics, Llc | Methods of manufacture of bottom port surface mount MEMS microphones |
| US9139421B1 (en) | 2000-11-28 | 2015-09-22 | Knowles Electronics, Llc | Top port surface mount MEMS microphone |
| US7633156B2 (en) | 2003-02-28 | 2009-12-15 | Knowles Electronics, Llc | Acoustic transducer module |
| US7382048B2 (en) | 2003-02-28 | 2008-06-03 | Knowles Electronics, Llc | Acoustic transducer module |
| US7501703B2 (en) | 2003-02-28 | 2009-03-10 | Knowles Electronics, Llc | Acoustic transducer module |
| US9374643B2 (en) | 2011-11-04 | 2016-06-21 | Knowles Electronics, Llc | Embedded dielectric as a barrier in an acoustic device and method of manufacture |
| US9078063B2 (en) | 2012-08-10 | 2015-07-07 | Knowles Electronics, Llc | Microphone assembly with barrier to prevent contaminant infiltration |
| JP2015080226A (en) * | 2012-09-26 | 2015-04-23 | 株式会社村田製作所 | Electronic apparatus |
| US9466871B2 (en) | 2012-09-26 | 2016-10-11 | Murata Manufacturing Co., Ltd. | Antenna device and electronic apparatus including antenna device |
| US9794661B2 (en) | 2015-08-07 | 2017-10-17 | Knowles Electronics, Llc | Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2825670B2 (en) | High frequency circuit device shield structure | |
| US6902949B2 (en) | Multi-layer wiring circuit board and method for producing the same | |
| JPH09107192A (en) | Printed board and printed board serving also as case and portable communication appliance | |
| US20180146302A1 (en) | Mems microphone package structure and method for manufacturing the mems microphone package structures | |
| US5483101A (en) | Multilayer printed circuit board | |
| JPH09289378A (en) | Printed wiring board and manufacture thereof | |
| WO2000052982A3 (en) | Multifonctional laminate structure and process | |
| JP4567281B2 (en) | Flexible circuit board with electromagnetic shield | |
| KR101888592B1 (en) | Flexible Printed Circuit and Method for Manufacturing The Same | |
| JP2001267710A (en) | Electronic circuit device and multilayer printed wiring board | |
| JP2002033556A (en) | Flexible circuit board | |
| JPH1168313A (en) | Printed wiring board | |
| JP2007150101A (en) | Module board and imaging device | |
| US20070119620A1 (en) | Flexible circuit shields | |
| JPH10163669A (en) | Shielding member | |
| JP2708980B2 (en) | Multi-layer flexible printed wiring board | |
| JP2003332517A (en) | Microwave integrated circuit, its manufacturing method and radio equipment | |
| JPH01135099A (en) | Electronic circuit package | |
| JPH08172303A (en) | Micro device | |
| US6396144B1 (en) | Mounting structure of semiconductor device, and communication apparatus using the same | |
| JP2001185888A (en) | Shield case | |
| JPH07307779A (en) | Shield structure for portable telephone set | |
| JP2002176231A (en) | Double-sided flexible circuit board | |
| JPH09172287A (en) | Electronic equipment case and electronic component having it | |
| KR102591392B1 (en) | Flexible printed circuit board with emi shielding sheet and method of fabricating thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Effective date: 20040520 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20040608 |
|
| A02 | Decision of refusal |
Effective date: 20041102 Free format text: JAPANESE INTERMEDIATE CODE: A02 |