JP4055028B2 - Metal-based wiring board and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a metal base wiring board used for a millimeter waveband signal processing circuit and a method of manufacturing the same.
[0002]
[Prior art]
For example, as shown in FIG. 3, the millimeter-wave band signal processing circuit has a groove 2 formed in a metal base 1, and a transistor, a diode, an integrated semiconductor device, or a ceramic wiring board on which these are mounted. A device 3, a wiring board 4 that forms a link mixer, a distributor or a filter that mixes and separates the signals of each device 3, and a line substrate 51 that forms a line connecting these inputs and outputs; Arranged so that these gaps are not left as much as possible, connected by the gold ribbon 6, and further provided with a bias unit on the back surface of the metal base 1 that separates the signal of the equipment that connects the power supplied to the entire circuit It has become.
The device 3, the wiring board 4 and the line substrate 51 are usually covered and shielded by a metal lid 7.
[0003]
[Problems to be solved by the invention]
By the way, in the prior art, a microstrip using a ceramic wiring board is used for the line 5 that inputs and outputs from the device 3 in order to match the input and output impedance of the device 3 and to reduce transmission loss. Tracks are used.
[0004]
This ceramic wiring board has a high relative dielectric constant, and if a thick substrate is used, a higher-order mode is likely to be generated during transmission. Thus, only a thin ceramic wiring board having a thickness of about 0.2 mm can be used.
Therefore, there is a problem that the ceramic wiring board used for the transmission line is thin and easily broken.
For this reason, it is difficult to form all the transmission lines on a single ceramic wiring board. A small piece is partially produced, and is fitted into the groove 2 formed in the metal base 1 and provided in the device 3. Positioning with the input / output terminals of the signal is performed for each connection point, and these are connected by the gold ribbon 6, so it takes a lot of man-hours to install a small piece of a plurality of ceramic wiring boards. There is a problem that the processing circuit is expensive.
[0005]
In addition, when the frequency of the signal to be used is high, the relative permittivity of the ceramic wiring board is high, so the portion where the conductor width on the ceramic wiring board must be accurately formed is below the processing accuracy, for example, It becomes difficult to accurately form the width of the transformer line and the width of the transmission line for matching the impedance of the device 3 and the impedance of the transmission line. There is also the problem of inconsistencies.
[0006]
SUMMARY OF THE INVENTION An object of the present invention is to provide a metal base wiring board that is easy in impedance matching, excellent in suppressing transmission loss, and economically excellent, and a manufacturing method thereof.
[0007]
[Means for Solving the Problems]
The metal base wiring board of the present invention is a film substrate 53 in which a passive circuit 52 such as a line 5, a link, a mixer, or a filter is formed on an insulating film, a metal base 1 on which electronic components are mounted, a transistor, From a film substrate 53 in which a hole 31 is formed at a place where a device 3 such as a diode, an integrated semiconductor device, or a ceramic wiring board on which the diode is mounted , a device 3, and a metal lid 7 that electromagnetically shields the circuit The metal base 1 is formed by connecting grooves 2 of various depths and shapes according to the circuit to be mounted. Further, a flat antenna is provided on the back surface of the metal base, and the input / output terminals of the flat antenna are provided. the the input and output terminals of the film substrate, electromagnetically coupled via the hole formed in the metal base, the depth and shape corresponding to the circuit mounted in metal lid 7 Wherein the groove 21 is formed by connecting.
[0008]
In this way, the strip 5 is formed by the line 5 formed on the film substrate 53, the metal base 1 in which the groove 2 is formed above and below the line 5, and the metal lid 7 in which the second groove 21 is formed. A track can be formed.
[0009]
Such a metal base wiring board corresponds to the passive circuit 52 connected to the input / output of the device 3 of the metal base 1 formed by connecting the grooves 2 having various depths and shapes according to the circuit to be mounted. The adhesive sheet 8 is provided in the concave portion 22 at the location to be formed so as to be at the height of the surface of the metal base 1, and the film substrate 53 is stacked thereon, laminated and fixed, and fixed at the location of the hole 31 of the film substrate 53. It can be manufactured by fixing the device 3, connecting the device 3 and the passive circuit 52, and aligning and fixing the metal lid 7.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
With this configuration, the metal base 1 can serve as both a ground conductor and a housing for the millimeter waveband signal processing circuit.
Since the wiring pattern such as the line 5 and the passive circuit 52 can be constituted by a single film substrate 53, it is possible to save the labor of installing each of the ceramic wiring boards divided into small pieces as in the prior art, and to reduce the man-hours for producing the signal processing circuit. Can be reduced.
The holes 31 provided in the film substrate 53 make it easy to align the device 3.
[0011]
【Example】
Example 1
As shown in FIG. 1, an aluminum plate having a thickness of 2 mm is used as the metal base 1, and a first recess 22 having a depth of 0.3 mm and a width of 5 mm is provided at the line 5, and a passive circuit such as a filter circuit is provided. A second recess 23 having a depth of 0.2 mm and a width of 12.3 mm × a length of 12.3 mm is provided at 52, and the device 3 is mounted at a depth of 0.1 mm and a width of 2.1 mm × length. A third recess 24 having a thickness of 2.5 mm was connected to form a groove 2, which was provided by cutting with a numerically controlled wire cutting device.
In the first recess 22, two GF-3500 (trade name, manufactured by Hitachi Chemical Co., Ltd.), which is the adhesive sheet 8, each having a thickness of 80 μm and one having a thickness of 50 μm are stacked one on top of the other. A cut piece having the same dimensions as the concave portion 22 was inserted.
Next, unnecessary portions of the rolled copper foil of the flexible wiring board base material in which the rolled copper foil of 18 μm is bonded to the polyimide film of thickness 25 μm as the film substrate 53 are removed by etching, and the line 5 and the link, Alternatively, a passive circuit 52 such as a filter is formed, and a hole 31 having substantially the same size as that of the device 3 is formed in a place where the device 3 is mounted.
A film substrate 53 on which a passive circuit 52 was formed was overlaid on the metal base 1 with the adhesive sheet 8 inserted therein, and was laminated and bonded using a vacuum press under conditions of 4 MPa, 220 ° C., 30 minutes and 10 Torr or less.
After that, after fixing the device 3 to the position of the hole 31 with an adhesive, the input / output terminals of the device 3 and the passive circuit 52 of the film substrate 53 were bonded and connected by the gold ribbon 6.
Thereafter, a second groove 21 having the same dimensions as the groove 2 and having a depth, width, and length necessary to prevent unnecessary radiation of the radio wave from the device 3 to be mounted is provided at an opposite position. A metal lid 7 was prepared, aligned, and fixed to the metal base 1 with screws 9.
Furthermore, a millimeter-wave band planar antenna 10 is provided on the back surface of the metal base 1, a square hole 11 is formed as a waveguide at the input / output terminal, and electromagnetically coupled to the line 5 of the film substrate 53. Thus, a metal-based wiring board in which the millimeter wave antenna and the millimeter wave signal processing circuit are integrated is obtained.
[0012]
Example 2
As shown in FIG. 2, an IC packaged with ceramic is used for the device 3, and the adhesive sheet 8 and the film substrate 53 are preliminarily arranged so that the input / output terminals of the signal provided on the package and the height of the transmission line coincide with each other. After drilling, a metal base wiring board on which the device 3 packaged with ceramic was mounted was produced in the same manner as in Example 1.
[0013]
【The invention's effect】
As described above, according to the present invention, it is possible to provide a metal base wiring board that is easy in impedance matching, excellent in suppressing transmission loss, and economically excellent.
[Brief description of the drawings]
1A is an exploded perspective view showing an embodiment of the present invention, and FIG. 1B is a sectional view thereof.
FIGS. 2A and 2B are perspective views of a main part for explaining another embodiment of the present invention. FIG.
FIG. 3 is a perspective view showing a conventional example.
[Explanation of symbols]
1. 1. Metal base Groove 21. Second groove 22. First recess 23. Second recess 24. Third recess 3. Device 31. Hole 4. Wiring board5. Track 51. Line substrate 52. Passive circuit 53. Film substrate 6. 6. Gold ribbon Metal lid 8. 8. Adhesive sheet Screw 10. Planar antenna 11. Square hole

Claims (2)

The metal base for mounting the electronic component, a passive circuit formed on an insulating film, and the film substrate formed with holes at locations for mounting the device, the device and, a metal lid to shield the circuit electromagnetically becomes, the metal base is a groove of varying depth and shape depending on the circuit to be mounted is formed, the grooves are formed in accordance with the system of the input and output of the circuit, further, the metal base of the back A flat antenna is provided, and the input / output terminals of the planar antenna and the input / output terminals of the film substrate are electromagnetically coupled through a hole provided in the metal base, and the depth corresponding to the circuit mounted on the metal lid is also determined. A metal-based wiring board characterized by having a groove of a shape and shape.   Adhesive sheet is placed at the height of the surface of the metal base in the groove corresponding to the circuit connected to the input / output of the device of the metal base with grooves of various depths and shapes formed according to the circuit to be mounted The film substrate is stacked on top of it, stacked and bonded, fixed, the device is fixed to the hole in the film substrate, the device and the circuit are connected, and the metal lid is aligned and fixed A method for manufacturing a metal-based wiring board, comprising:

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