JPH0518710B2 - - Google Patents

Info

Publication number
JPH0518710B2
JPH0518710B2 JP19003988A JP19003988A JPH0518710B2 JP H0518710 B2 JPH0518710 B2 JP H0518710B2 JP 19003988 A JP19003988 A JP 19003988A JP 19003988 A JP19003988 A JP 19003988A JP H0518710 B2 JPH0518710 B2 JP H0518710B2
Authority
JP
Japan
Prior art keywords
prepreg
resin
laminate
polyester resin
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP19003988A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0239936A (ja
Inventor
Mitsutoshi Kamata
Masaru Ogata
Yukihiro Yamashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP19003988A priority Critical patent/JPH0239936A/ja
Publication of JPH0239936A publication Critical patent/JPH0239936A/ja
Publication of JPH0518710B2 publication Critical patent/JPH0518710B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Laminated Bodies (AREA)
JP19003988A 1988-07-29 1988-07-29 不飽和ポリエステル樹脂積層板の製造法 Granted JPH0239936A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19003988A JPH0239936A (ja) 1988-07-29 1988-07-29 不飽和ポリエステル樹脂積層板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19003988A JPH0239936A (ja) 1988-07-29 1988-07-29 不飽和ポリエステル樹脂積層板の製造法

Publications (2)

Publication Number Publication Date
JPH0239936A JPH0239936A (ja) 1990-02-08
JPH0518710B2 true JPH0518710B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-03-12

Family

ID=16251343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19003988A Granted JPH0239936A (ja) 1988-07-29 1988-07-29 不飽和ポリエステル樹脂積層板の製造法

Country Status (1)

Country Link
JP (1) JPH0239936A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Also Published As

Publication number Publication date
JPH0239936A (ja) 1990-02-08

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