JPH0518454B2 - - Google Patents

Info

Publication number
JPH0518454B2
JPH0518454B2 JP61168576A JP16857686A JPH0518454B2 JP H0518454 B2 JPH0518454 B2 JP H0518454B2 JP 61168576 A JP61168576 A JP 61168576A JP 16857686 A JP16857686 A JP 16857686A JP H0518454 B2 JPH0518454 B2 JP H0518454B2
Authority
JP
Japan
Prior art keywords
etching
light
optical path
etched
path difference
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61168576A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6323324A (ja
Inventor
Ryohei Kawabata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP16857686A priority Critical patent/JPS6323324A/ja
Publication of JPS6323324A publication Critical patent/JPS6323324A/ja
Publication of JPH0518454B2 publication Critical patent/JPH0518454B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)
JP16857686A 1986-07-16 1986-07-16 ドライエツチング装置 Granted JPS6323324A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16857686A JPS6323324A (ja) 1986-07-16 1986-07-16 ドライエツチング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16857686A JPS6323324A (ja) 1986-07-16 1986-07-16 ドライエツチング装置

Publications (2)

Publication Number Publication Date
JPS6323324A JPS6323324A (ja) 1988-01-30
JPH0518454B2 true JPH0518454B2 (enrdf_load_stackoverflow) 1993-03-12

Family

ID=15870608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16857686A Granted JPS6323324A (ja) 1986-07-16 1986-07-16 ドライエツチング装置

Country Status (1)

Country Link
JP (1) JPS6323324A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6136712A (en) * 1998-09-30 2000-10-24 Lam Research Corporation Method and apparatus for improving accuracy of plasma etching process
EP1349196A3 (en) * 2002-03-25 2006-02-01 Adaptive Plasma Technology Corporation Plasma etching method and apparatus for manufacturing a semiconductor device
US6982175B2 (en) * 2003-02-14 2006-01-03 Unaxis Usa Inc. End point detection in time division multiplexed etch processes
JP2017092116A (ja) * 2015-11-04 2017-05-25 株式会社日立ハイテクノロジーズ プラズマ処理装置及び処理状態検出方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4367044A (en) * 1980-12-31 1983-01-04 International Business Machines Corp. Situ rate and depth monitor for silicon etching
JPS61152017A (ja) * 1984-12-26 1986-07-10 Hitachi Ltd エツチングモニタ装置

Also Published As

Publication number Publication date
JPS6323324A (ja) 1988-01-30

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