JPH0518259B2 - - Google Patents
Info
- Publication number
- JPH0518259B2 JPH0518259B2 JP58237358A JP23735883A JPH0518259B2 JP H0518259 B2 JPH0518259 B2 JP H0518259B2 JP 58237358 A JP58237358 A JP 58237358A JP 23735883 A JP23735883 A JP 23735883A JP H0518259 B2 JPH0518259 B2 JP H0518259B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- conductor
- groove
- insulating layer
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
Landscapes
- Electrodes Of Semiconductors (AREA)
- Element Separation (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58237358A JPS60130163A (ja) | 1983-12-16 | 1983-12-16 | 半導体集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58237358A JPS60130163A (ja) | 1983-12-16 | 1983-12-16 | 半導体集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60130163A JPS60130163A (ja) | 1985-07-11 |
| JPH0518259B2 true JPH0518259B2 (enrdf_load_stackoverflow) | 1993-03-11 |
Family
ID=17014206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58237358A Granted JPS60130163A (ja) | 1983-12-16 | 1983-12-16 | 半導体集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60130163A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0691154B2 (ja) * | 1985-10-22 | 1994-11-14 | 日本電気株式会社 | 半導体装置 |
| US4939567A (en) * | 1987-12-21 | 1990-07-03 | Ibm Corporation | Trench interconnect for CMOS diffusion regions |
| US5293512A (en) * | 1991-02-13 | 1994-03-08 | Nec Corporation | Semiconductor device having a groove type isolation region |
| EP0603461A3 (en) * | 1992-10-30 | 1996-09-25 | Ibm | Formation of 3D-structures comprising silicon silicides. |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5681968A (en) * | 1979-12-07 | 1981-07-04 | Toshiba Corp | Manufacture of semiconductor device |
| JPS583261A (ja) * | 1981-06-29 | 1983-01-10 | Fujitsu Ltd | 竪型埋め込みキヤパシタの製造方法 |
-
1983
- 1983-12-16 JP JP58237358A patent/JPS60130163A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60130163A (ja) | 1985-07-11 |
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