JPH0517905Y2 - - Google Patents
Info
- Publication number
- JPH0517905Y2 JPH0517905Y2 JP1987184319U JP18431987U JPH0517905Y2 JP H0517905 Y2 JPH0517905 Y2 JP H0517905Y2 JP 1987184319 U JP1987184319 U JP 1987184319U JP 18431987 U JP18431987 U JP 18431987U JP H0517905 Y2 JPH0517905 Y2 JP H0517905Y2
- Authority
- JP
- Japan
- Prior art keywords
- external connection
- board
- integrated circuit
- connection terminal
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987184319U JPH0517905Y2 (fr) | 1987-12-04 | 1987-12-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987184319U JPH0517905Y2 (fr) | 1987-12-04 | 1987-12-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0189774U JPH0189774U (fr) | 1989-06-13 |
| JPH0517905Y2 true JPH0517905Y2 (fr) | 1993-05-13 |
Family
ID=31475690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987184319U Expired - Lifetime JPH0517905Y2 (fr) | 1987-12-04 | 1987-12-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0517905Y2 (fr) |
-
1987
- 1987-12-04 JP JP1987184319U patent/JPH0517905Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0189774U (fr) | 1989-06-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2539367Y2 (ja) | 積層型電子部品 | |
| JPH0517905Y2 (fr) | ||
| JPS61166149A (ja) | 多層混成集積回路装置 | |
| JPH0349415Y2 (fr) | ||
| JPS63146422A (ja) | チップ型積層コンデンサ | |
| JPH0441619Y2 (fr) | ||
| JPH01102990A (ja) | 小形電子部品実装回路 | |
| JPH0124944Y2 (fr) | ||
| JPS6348068Y2 (fr) | ||
| JPS614267A (ja) | 三次元実装回路モジユ−ル | |
| JPH0115157Y2 (fr) | ||
| JPH0115150Y2 (fr) | ||
| JPH0427155Y2 (fr) | ||
| JPS63118224U (fr) | ||
| JPH0347341Y2 (fr) | ||
| JPH0617339Y2 (ja) | コンデンサ内蔵積層基板 | |
| JPH0750462A (ja) | 電子回路基板 | |
| JPH01217869A (ja) | 混成集積回路装置 | |
| JPH02309601A (ja) | チップ部品の構造及びチップ部品の取付方法 | |
| JPH02229462A (ja) | 積層混成集積回路部品の構造 | |
| JPH0225088A (ja) | 多層厚膜混成集積回路装置 | |
| JPS6272198A (ja) | 積層回路基板の製造方法 | |
| JPS62200788A (ja) | 多層プリント板 | |
| JPH0338921U (fr) | ||
| JPH04131926U (ja) | チツプ部品およびチツプターミナル |