JPH0517887Y2 - - Google Patents
Info
- Publication number
- JPH0517887Y2 JPH0517887Y2 JP1986038399U JP3839986U JPH0517887Y2 JP H0517887 Y2 JPH0517887 Y2 JP H0517887Y2 JP 1986038399 U JP1986038399 U JP 1986038399U JP 3839986 U JP3839986 U JP 3839986U JP H0517887 Y2 JPH0517887 Y2 JP H0517887Y2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic wafer
- snap
- ceramic
- grooves
- snap grooves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 claims description 26
- 235000012431 wafers Nutrition 0.000 description 21
- 238000000034 method Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 230000001788 irregular Effects 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986038399U JPH0517887Y2 (US20030199744A1-20031023-C00003.png) | 1986-03-18 | 1986-03-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986038399U JPH0517887Y2 (US20030199744A1-20031023-C00003.png) | 1986-03-18 | 1986-03-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62151749U JPS62151749U (US20030199744A1-20031023-C00003.png) | 1987-09-26 |
JPH0517887Y2 true JPH0517887Y2 (US20030199744A1-20031023-C00003.png) | 1993-05-13 |
Family
ID=30850605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986038399U Expired - Lifetime JPH0517887Y2 (US20030199744A1-20031023-C00003.png) | 1986-03-18 | 1986-03-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0517887Y2 (US20030199744A1-20031023-C00003.png) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2654677B2 (ja) * | 1988-10-28 | 1997-09-17 | 新電元工業株式会社 | 半導体装置の製造方法 |
JP3856573B2 (ja) * | 1998-08-24 | 2006-12-13 | 日本特殊陶業株式会社 | リードレスパッケージの製造方法 |
US7332414B2 (en) * | 2005-06-22 | 2008-02-19 | Freescale Semiconductor, Inc. | Chemical die singulation technique |
JP6144136B2 (ja) * | 2013-07-17 | 2017-06-07 | Koa株式会社 | チップ抵抗器の製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60183747A (ja) * | 1984-03-01 | 1985-09-19 | Ngk Spark Plug Co Ltd | 面取り付き電解チツプキヤリアの製造法 |
-
1986
- 1986-03-18 JP JP1986038399U patent/JPH0517887Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60183747A (ja) * | 1984-03-01 | 1985-09-19 | Ngk Spark Plug Co Ltd | 面取り付き電解チツプキヤリアの製造法 |
Also Published As
Publication number | Publication date |
---|---|
JPS62151749U (US20030199744A1-20031023-C00003.png) | 1987-09-26 |
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