JPH0517883Y2 - - Google Patents

Info

Publication number
JPH0517883Y2
JPH0517883Y2 JP1987055029U JP5502987U JPH0517883Y2 JP H0517883 Y2 JPH0517883 Y2 JP H0517883Y2 JP 1987055029 U JP1987055029 U JP 1987055029U JP 5502987 U JP5502987 U JP 5502987U JP H0517883 Y2 JPH0517883 Y2 JP H0517883Y2
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor
resin
mold
semiconductor lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987055029U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63162532U (en, 2012
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987055029U priority Critical patent/JPH0517883Y2/ja
Publication of JPS63162532U publication Critical patent/JPS63162532U/ja
Application granted granted Critical
Publication of JPH0517883Y2 publication Critical patent/JPH0517883Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1987055029U 1987-04-11 1987-04-11 Expired - Lifetime JPH0517883Y2 (en, 2012)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987055029U JPH0517883Y2 (en, 2012) 1987-04-11 1987-04-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987055029U JPH0517883Y2 (en, 2012) 1987-04-11 1987-04-11

Publications (2)

Publication Number Publication Date
JPS63162532U JPS63162532U (en, 2012) 1988-10-24
JPH0517883Y2 true JPH0517883Y2 (en, 2012) 1993-05-13

Family

ID=30882564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987055029U Expired - Lifetime JPH0517883Y2 (en, 2012) 1987-04-11 1987-04-11

Country Status (1)

Country Link
JP (1) JPH0517883Y2 (en, 2012)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5207298B2 (ja) * 2008-08-08 2013-06-12 株式会社ソディック 複合成形装置及びその複合成形装置の中間成形物の移載装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016429A (ja) * 1983-07-08 1985-01-28 Matsushita Electronics Corp 樹脂封止用ロ−デイング装置

Also Published As

Publication number Publication date
JPS63162532U (en, 2012) 1988-10-24

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