JPH05173336A - Removing method and removing device for resist - Google Patents

Abstract

PURPOSE:To efficiently execute a removing action in a short period of time and to improve the cleanability of the surface from which a resist is removed by mixing a resist removing liquid and gas or alternately injecting liquid and the gas to the resist. CONSTITUTION:After a base material 2 stuck with the resist to be removed is fixed to a fixing base 3, the removing liquid 1a is introduced into a removing tank 1 at least until the base material 2 is immersed therein. A 1st valve 8 is opened and a pump 7 is operated by a control section 14 to pressurize and circulate the removing liquid through a pipeline 8a from a liquid intake port 5. A 2nd valve 9 is also opened by the control section 14 to introduce the gas through a pipeline 9a from a gas cylinder 10 into the removing tank 1. The removing liquid and the gas are mixed around a coupling part 12 of the pipelines in such a manner and a gas-liquid mixture is injected from an injection nozzle 4 to the resist. Accordingly, the removing liquid is less consumed and the resist is prevented from swelling and dissolving. The development defect and peeling defect in the fine parts of the patterns are thus prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resist removing method and a removing apparatus used in a fine processing method represented by photolithography. The present invention relating to such a resist removing method and removing apparatus is particularly well applied to the manufacture of an inkjet recording head.

[0002]

2. Description of the Related Art In a fine processing method such as photolithography, a resist made of a photosensitive resin or the like for forming a fine pattern (often called "photoresist" because it usually has photosensitivity). Hereinafter referred to as “resist”) is used. For example, in order to manufacture a semiconductor element, a resist is applied to a base material such as a wafer, exposed to light, and then a soluble portion of the resist is removed in a developing step or a subsequent peeling step. ing.

Conventionally, as a method of removing a resist, a resist removing liquid (usually referred to as "developing liquid" or "stripping liquid" in the field of photolithography, but hereinafter referred to as "removing liquid") is used on a substrate. A spray method of spraying the resist to remove the resist from the base material, a dipping method of immersing the base material provided with the resist in a removing liquid to remove the resist on the base material, and the like are adopted. In addition, ultrasonic vibration treatment, heating treatment, stirring treatment,
A treatment for promoting the removal of the resist, such as a pressure circulation treatment, may be used together. After removing the resist in this manner, the substrate is usually washed with a rinse liquid,
The substrate is then dried.

[0004]

The conventional resist removing method as described above has the following problems.

Generally, the finer the pattern to be formed, the longer it takes to remove the resist. However, if a removing solution having a high solubility of the resist is used in order to shorten this time, a portion other than the portion to be removed is removed. In some cases, the resist swelled to cause bridges, meanders, leans, spreads between the adjacent resist patterns, and the like. And, in a severe case, the resist other than the part to be removed may be dissolved and the pattern width may be narrowed, and in any case, it is difficult to obtain a highly accurate resist pattern having a desired size and shape. there were.

On the other hand, if the resist is removed over a relatively long period of time using a removing solution whose solubility is not so high without shortening the removal time, a fine pattern with a certain degree of precision can be formed. However, a considerably large amount of removing liquid is required instead. Further, in particular, in details, insufficient removal such as generation of a resist residue and defective removal such that the once-removed resist reattaches in the form of spots often occur, and in this case, it adversely affects the post-process. It became a thing. Conventionally, these problems could not be sufficiently solved even if the above-mentioned treatment for promoting the removal of the resist was used together.

By the way, as one of the main effective methods for manufacturing an ink jet recording head, USP 4,657,631 and
There is the following method whose manufacturing process is schematically shown in FIGS. 4 (A) to 4 (F), which involves the removal of the resist described in USP 4,775,445 and the like. Although details will be described later, FIG. 4 in which an energy generator 41 that generates energy used to eject ink is provided first.
On the substrate 40 shown in FIG. 4A, for example, a positive photosensitive resin layer 42 serving as a resist is provided as shown in FIG. Next, the photosensitive resin layer 42 is subjected to pattern exposure to form a latent image 43a shown in FIG. 4C corresponding to the ink passage on the photosensitive resin layer 42. After that, the photosensitive resin layer 42 is developed, and FIG.
The photosensitive resin layer 42 is patterned as shown in FIG. Next, as shown in FIG. 4E, a material 44 that forms the wall of the ink passage is provided so as to cover the patterned photosensitive resin layer 43. Then, the patterned photosensitive resin layer 43 is exposed to light and then removed.
An ink passage 46 is formed as shown in FIG. With or after this step, the ink passages 4
A supply port 45 for supplying ink to 6 is formed. Four
Reference numeral 6a is an ejection port that communicates with the ink passage 46 and ejects ink.

An inkjet recording head having a relatively high reliability has been manufactured by the manufacturing method as described above, and an inkjet recording device equipped with this inkjet recording head has been commercialized.

Regarding such an ink jet recording apparatus, it is a social demand to further improve the recording speed and the image quality of a recorded image.
It can be said that one of the ideal inkjet recording heads capable of satisfying such social requirements is basically provided with a large number of ink ejection ports at a high density.

However, in providing an ink jet recording head having such a high density multi ejection port,
The following matters have emerged as issues that need to be resolved. That is, the more densely the ejection openings are arranged, the more the ejection characteristics of the ink from the ejection openings may be affected by the reason that the removal of the resist is likely to occur when manufacturing such an inkjet recording head. The problem is that it tends to deteriorate.

[0011] Such a problem has not been seen as a serious problem in the case of a head in which the number of ejection ports is relatively small and the arrangement density of them is not so high. However, it became difficult to neglect it as a large number of them were arranged in high density. In particular, a large number of, for example, several thousand discharge ports are provided at high density over the entire width of the recording area of the recording member on which recording is performed, and a large number of energy generators are provided corresponding to the many discharge ports and the substrate is densely formed. In a so-called full-line type ink jet recording head disposed in the above, this becomes a remarkable technical problem.
As described above, the above-mentioned various problems relating to the removal of the resist have been more prominent when the removal of the resist is performed to manufacture the inkjet recording head.

[0012]

One of the main objects of the present invention is to solve the above-mentioned various technical problems and to efficiently remove the resist in a short time, and the surface from which the resist has been removed. It is an object of the present invention to provide a resist removing method and a removing apparatus which are excellent in cleanliness.

Another object of the present invention is to solve various problems relating to resist removal, which tend to be manifested particularly with the recent miniaturization of patterns, and to obtain a pattern having high accuracy in size and shape. A method and apparatus for removing a resist that can be used.

Still another object of the present invention is to provide a resist removing method and a resist removing apparatus which consume a relatively small amount of a removing solution and do not adversely affect other components.

The present inventor conducted a detailed investigation and study in order to solve the above-mentioned technical problems and achieve these objects. As a result, even if the above-mentioned spraying method, the above-mentioned dipping method, or these removing methods together with the above-mentioned treatment for promoting the removal of the resist are used, the resist is substantially removed. It has become clear that this is merely an interaction based on the contact relationship between the two and the removing liquid, and that it is impossible to solve the above-mentioned technical problems to a satisfactory level from this state of the art.

This is even more the case when the resist is removed to manufacture an ink jet recording head. And
The more densely arranged the ejection openings are, the higher the accuracy in terms of size and shape with respect to the fine ink passages communicating with the ejection openings is required. It has also been found that sufficient accuracy cannot always be obtained due to manufacturing problems, and that this seems to cause deterioration of the overall ejection characteristics of the ink from the ejection ports. The above-mentioned problems relating to the removal of the resist in the fine passages occur in the developing step of developing and patterning the photosensitive resin layer and the peeling step of removing the patterned photosensitive resin layer from the ink passage and removing it. Was imagined.

As a result of further diligent research based on these points, the present inventor has obtained the following findings. That is, by spraying the gas-liquid mixture of the removing liquid and the gas onto the resist, or by alternately spraying the removing liquid and the gas onto the resist, the action of removing the resist by the resist can be dramatically increased. It is a finding that the uniformity of the resist removing action of the removing liquid can be made extremely high.

The present inventor actually tried to remove the resist based on this finding. As a result, the resist can be removed efficiently in a short time, and moreover, the cleanliness of the surface from which the resist has been removed can be obtained superior to the conventional one. Then, it was possible to form a pattern having extremely high accuracy in size and shape.

Further, the present inventor actually applied the above-mentioned findings to the manufacture of an ink jet recording head. As a result, it was possible to obtain an ink jet recording head having an ink passage with extremely high accuracy in size and shape. Further, the present inventor mounted this ink jet recording head on the apparatus main body and actually ejected ink for recording.
As a result, it was found that the obtained ink jet recording head was excellent in the overall ink ejection characteristics.

Thus, the present invention has been completed.

One of the resist removing methods of the present invention is characterized in that the resist is removed by mixing a resist removing liquid and a gas and spraying the mixture onto the resist.

Another method of removing the resist of the present invention is characterized in that the resist is removed by alternately injecting a resist removing liquid and a gas onto the resist.

One of the resist removing devices of the present invention is a mixing means for mixing a resist removing liquid and a gas, and the resist removing liquid and gas mixed by the mixing means are sprayed onto the resist. And means.

Another one of the resist removing apparatuses of the present invention is a liquid supply means for supplying a resist removing liquid, a gas supply means for supplying a gas, and a switch between the liquid supply means and the gas supply means. It is characterized in that it has a switching means to be operated in accordance with the above, and a means for alternately injecting the resist removing liquid and the gas to the resist by switching the switching means.

The present invention as described above is particularly well applied to the removal of the resist in the manufacture of the ink jet recording head. This is even more so when the inkjet recording head is of the full line type.

[0026]

According to the present invention, the removing action of the resist by the removing liquid can be remarkably increased, and the uniformity of the removing action of the resist by the removing liquid can be made extremely high.

[0027]

The preferred embodiment of the present invention will be described in detail with reference to FIG. FIG. 1 is a schematic diagram showing a resist removing apparatus according to one embodiment of the present invention.

In FIG. 1, reference numeral 1 is a removing tank for storing the resist removing liquid 1a. Inside the removal tank 1, there is provided a fixing table 3 for fixing the base material 2 from which the resist should be removed in the removal liquid 1a. Also, the removal tank 1
Is provided with a liquid inlet 5 for circulating and reusing the removal liquid 1a. Pipe line 8 connected to the liquid intake port 5
In a, a filter 6 for removing foreign matters such as dust from the removal liquid 1a, a pump 7 for circulating the removal liquid 1a and injecting it from the injection nozzle 4, and a communication for blocking and opening the communication of the pipeline 8a. 1 valve 8 is provided.

On the other hand, the gas inlet 10 is attached to the gas cylinder 10.
A second valve 9 for blocking and opening the communication of the pipeline 9a is provided in the pipeline 9a connected via the. Code 1
Reference numeral 4 is a control unit that controls opening and closing of the first valve 8 and the second valve 9.

A resist removing method according to an embodiment of the present invention for removing the resist by using such a resist removing apparatus will be described below. First, the base material 2 with the resist to be removed is fixed to the fixing base 3, and then the removal liquid 1a is introduced into the removal tank 1 at least until the base material 2 is immersed. The control unit 14 opens the first valve 8 to open the pump 7
Is operated to pressurize and circulate the removal liquid from the liquid intake port 5 through the pipe line 8a. At this time, the control unit 14 causes the second
The valve 9 is also opened, and gas is introduced into the removal tank 1 from the gas cylinder 10 through the pipe 9a. In this way, the removing liquid and the gas are mixed around the connecting portion 12 of the pipeline, and are sprayed as a gas-liquid mixture from the spray nozzle 4 to the resist.

In such an embodiment, the resist can be surely removed in a short time in the developing process and the subsequent peeling process, the consumption of the removing liquid is small, and the resist swells or dissolves. Without this, it is possible to prevent development failure and peeling failure in the pattern details, and it is possible to enhance the cleanliness of the surface from which the resist has been removed.

Next, a resist removing method according to another embodiment of the present invention will be described. In this embodiment, the process is performed in the same manner as the above-described embodiment until the removal liquid 1a is introduced into the removal tank 1. After operating the pump 7, the control unit 14
Then, the first valve 8 is opened for a predetermined time, and the removal liquid is pressurized and circulated from the liquid intake port 5 through the pipe line 8a and injected from the injection nozzle 4. After the lapse of a predetermined time, the control unit 14 closes the first valve 8 and opens the second valve 9 to introduce the gas from the gas cylinder 10 into the removal tank 1 through the conduit 9a. After a further predetermined time has elapsed, the control unit 14 closes the second valve 9 and opens the first valve 8 to circulate the removal liquid under pressure and inject it from the injection nozzle 4. In this way, the removal liquid and the gas are alternately injected from the injection nozzle 4 to the resist by switching the first valve 8 and the second valve 9. In order to alternately inject the removing liquid and the gas to the resist, it is preferable that both the first valve 8 and the second valve 9 be electromagnetic valves so that the control unit can perform timer control. In addition, it is practically preferable that the cycle of the alternate injection of the removing liquid and the gas is in the range of 0.1 seconds to 5.0 seconds.

According to such an embodiment, the same excellent effects as those of the previous embodiment can be obtained.

Another embodiment of the present invention will be described with reference to FIG. FIG. 3 is a schematic diagram showing a resist removing apparatus according to another embodiment of the present invention. In this FIG.
The same members as those of the resist removing apparatus of FIG. 1 are designated by the same reference numerals, and the description thereof will be omitted.

This embodiment differs from the resist removing apparatus of FIG. 1 in that the removing tank 1 forms a closed space.
The point is that a vacuum pump 13 connected to the closed space is provided. By operating this vacuum pump 13, the inside of the removal tank 1 can be depressurized.

Although the embodiment described with reference to FIG. 1 has been described as being performed under atmospheric pressure, it is more effective if they are performed under a pressure lower than atmospheric pressure.
That is, by ejecting the removing liquid and gas as a gas-liquid mixture to the resist placed under reduced pressure, or by alternately ejecting the removing liquid and gas to the resist placed under reduced pressure, The effects of the present invention are exhibited at a higher level. The pressure reduction of the resist may be achieved by, for example, immersing the base material provided with the resist to be removed in the removal liquid, and reducing the pressure of the space facing the liquid surface of the removal liquid with a pump. In this way, keeping the resist under reduced pressure means keeping at least the peripheral region of the resist in a reduced pressure state. Here, the decompression refers to a pressure lower than the atmospheric pressure, and includes the case where the pressure is reduced to a substantially vacuum state. The pressure in the depressurized state of the space facing the liquid surface of the removing liquid is appropriately determined according to various conditions such as the type and size of the resist, but is preferably set to 400 mmHg or less in practice.

Further, the embodiment described with reference to FIG.
Not only under continuous constant depressurization, but also by changing the pressure in the depressurized state according to the elapsed time, or by alternately repeating the depressurized state and the atmospheric pressure state at a predetermined time interval. Or, a more remarkable effect can be obtained. This is particularly effective when the resist is structurally difficult to remove, such as when the width of the pattern itself to be formed or the interval between the patterns is small.

In addition, the embodiment described above is particularly well applied in removing the resist in the manufacture of the ink jet recording head. That is, the developing process shown in FIG. 4D for developing and patterning the photosensitive resin layer, and FIG. 4F for removing and removing the patterned photosensitive resin layer from the ink passage are shown. The peeling process is particularly well applied. This is even more so when the inkjet recording head is of the full line type.

Furthermore, the embodiment described above relates to a peeling step particularly in the manufacture of an ink jet recording head in which ink is ejected by utilizing film boiling of the ink due to thermal energy generated by the electrothermal converter. It is very well applied in removing resist. This is because not only the removing liquid but also the gas passes while contacting the ink passage when removing the resist, so that a so-called aging action is applied to the foamed surface of the electrothermal converter, for example, which causes film boiling. It is supposed to be done.

As the resist used in the above-mentioned embodiments, the photosensitive resin usually used in the field of photolithography can be mentioned as a good one. When the above embodiment is applied to the manufacture of an ink jet recording head, a resist as shown in FIG.
It is preferable to use the positive photosensitive resin layer shown in (B). Since the positive photosensitive resin is a resin material whose solubility in a solvent is increased by light irradiation,
This is because it is possible to more easily perform the peeling step of removing by removing from the fine ink passage as shown in FIG. Examples of the positive photosensitive resin include a material containing o-naphthoquinonediamides and an alkali-soluble phenol resin,
A preferable material is a material containing benzenediazonium and an alkali-soluble resin. Among them, “OZATEC R225” (trade name, manufactured by Hoechst Japan Co., Ltd.) and the like in which a positive photosensitive resin is applied to a sheet of polyester or the like is mentioned as a more preferable one in consideration of easy handling. be able to.

As the removing liquid used in the embodiment, those which are usually used in the field of photolithography can be mentioned as preferable ones. For example, an aqueous solution containing an alkali such as sodium hydroxide or potassium hydroxide,
Examples thereof include aqueous solutions containing acids such as hydrochloric acid and nitric acid, organic solvents such as acetone, isopropyl alcohol, trichloroethane and the like.

As the gas used in the embodiment, a gas that does not react with the removing liquid or the resist, or a gas that does not substantially interfere with the removal of the resist even when it reacts is preferably used. As such a gas, for example, an inert gas such as helium, neon, or argon, or nitrogen can be preferably used. Although it is considered that the effect of the present invention can be obtained with a relatively small amount of gas,
It is practically preferable that the volume ratio of the removing liquid to the gas is within the range of 1: 100 to 100: 1. The injection pressure from the injection nozzle is 0.01 kg / cm ^{2 to} 10 kg.
In practice, it is preferably within the range of / cm ² .

When this embodiment is applied to the manufacture of an ink jet recording head, in particular, when performing a developing step for forming a pattern corresponding to a fine ink passage as shown in FIG. 4D, or FIG. When performing the peeling process to remove the resist from the fine ink passage as shown in), remove the resist by installing the head so that the ejection can be smoothly performed from the supply port side of the head to the ejection port side. Is preferably performed.

In the embodiment described above, as a preferable mode, the injection nozzle is shared by the removing liquid and the gas. However, it is possible to provide a separate injection nozzle for each gas-liquid path. Also, the present invention is included as long as the above-described spraying method is performed on the resist. Further, as described above, it is preferable that the removing liquid can be circulated and reused in order to suppress the wasteful consumption of the removing liquid, but the removing liquid path may be in a non-circulating form like the gas path. To further adjust the pressure and flow rate,
Various devices such as valves may be appropriately provided in the liquid or gas pipeline. In addition, the above-mentioned connecting portion of the pipes may be a simple combination of the pipes or an independent gas mixer.

An example of an ink jet recording apparatus equipped with the ink jet recording head manufactured using the above embodiment will be described with reference to FIG. Figure 5
FIG. 3 is a schematic perspective view showing a main part of an example of an inkjet recording device.

In FIG. 5, reference numeral 320 denotes a removable cartridge type of a recording liquid storage unit integrated structure having a plurality of ink ejection ports facing the recording surface of the recording paper (not shown) conveyed on the platen 324. It is an inkjet recording head. Reference numeral 316 denotes a carriage on which the ink jet recording head 320 is placed, which is connected to a part of a drive belt 318 for transmitting the driving force of the drive motor 317, and two guide shafts 329A and 329B arranged in parallel with each other. Is said to be slidable. This allows the inkjet recording head 320 to reciprocate over the entire width of the recording paper.

Reference numeral 326 is an ink jet recording head 320.
It is a recovery device that recovers and prevents defective ink ejection from the ink jet recording head 320, and is provided at a predetermined position in the moving range of the inkjet recording head 320, for example, at a position facing the home position. The recovery device 326 caps the ejection port of the inkjet recording head 320 by the driving force of the motor 322 via the transmission mechanism 323. In connection with the capping operation of the ejection port of the inkjet recording head 320 by the cap 326A of the recovery device 326, ink is sucked from the ejection port by an appropriate suction means (not shown) provided in the recovery device 326, or the inkjet recording head. Ink pressure feeding is performed by an appropriate pressurizing unit (not shown) provided in the ink supply path to the ink. As a result, a recovery process is performed in which ink is forcibly discharged from the ejection port and foreign matter such as thickened ink inside the ejection port is removed.

A blade 330 is provided on the side surface of the recovery device 326 and is made of silicon rubber as a wiping member. This blade 330 is held by the blade holding member 330A in the form of a cantilever, and the recovery device 32
Similar to 6, the motor 322 and the transmission mechanism 323 operate to enable engagement with the ejection port surface of the inkjet recording head 320. Thereby, for example, at an appropriate timing during the recording operation of the inkjet recording head 320, or after the recovery process using the recovery device 326, or the like.
The blade 330 is projected into the moving range of the inkjet recording head 320,
The ink jet recording head 32
It is possible to wipe off foreign matter such as dew condensation, wetness or dust adhering to the discharge port surface of No. 0.

Driving of the recording paper conveying means, carriage and recovery device of the ink jet recording apparatus, and further driving of the recording head are controlled based on commands and signals output from the control means including the CPU of the apparatus main body side. It

FIG. 6 is a schematic perspective view showing an outline of an ink jet recording apparatus equipped with the full line type ink jet recording head 32. In the figure, reference numeral 65 is a conveyor belt for conveying a recording member such as paper. The transport belt 65 transports a recording member (not shown) as the transport roller 64 rotates. The lower surface of the inkjet recording head 32 is the ejection port surface 31 in which a plurality of ejection ports are arranged corresponding to the recording area of the recording target member.

(Example 1) As a resist, a positive photosensitive resin film "OZATEC R225" (: trade name,
Using Hoechst Japan Co., Ltd., it was laminated on a glass substrate at 100 ° C. under a pressure of 3 kg / cm ² . Then, the resist was subjected to pattern exposure of 300 mJ / cm ^{2 with} a high pressure mercury lamp using the photomask 20 shown in FIG. 2 to form a pattern latent image with a line diameter of 20 μm on the resist. Note that FIG. 2 is a schematic top view showing an example of a photomask, and in FIG. 2, reference numeral 21 is a light shielding portion that blocks light. Subsequently, the resist was heat-treated at 110 ° C. for 10 minutes.

Next, the fixing table 3 of the resist removing apparatus shown in FIG.
The base material provided with the resist was fixed. A 3% NaOH aqueous solution was used as a removing solution (developing solution), and the circulation flow rate by the pump 7 was set to 2 liter / min. Nitrogen gas was used as the gas. The removing solution (developing solution) and nitrogen gas were mixed at a volume ratio of 1: 1 and the gas-liquid mixture was sprayed onto the resist at a spraying pressure of 1 kg / cm ² to develop the resist.
Subsequently, it was rinsed with pure water and then naturally dried.

In this example, the above processing was performed on 10 samples. The resist removal condition was examined for each sample, and the overall results (developing time is the average value of 10 samples) are shown in Table 1. As is clear from Table 1, in this example, it was confirmed that the removal time was short, there was no swelling or dissolution of the unexposed portion, and that no stain was generated.

(Example 2) Example 2 was repeated except that the removing solution (developing solution) and the nitrogen gas were alternately sprayed to the resist at a spraying pressure of 1 kg / cm ² at intervals of 1 second to perform development. The same process as 1 was performed.

Also in this example, processing was performed on 10 samples. The resist removal status was examined for each sample, and the overall result (development time was the average value of 10 samples)
Is shown in Table 1. Excellent results were obtained also in this example.

(Example 3) A positive photosensitive resin "OFPR800" (trade name, manufactured by Tokyo Ohka Kogyo Co., Ltd.) was used as a resist, and after coating with a roll coater to a film thickness of 1.3 μm, Prebaking was performed at 90 ° C. for 30 minutes. Then, the resist was subjected to pattern exposure of 5000 mJ / cm ² using the photomask 20 shown in FIG. 2 to form a pattern latent image having a line diameter of 20 μm on the resist.

[NMD-3] (: trade name, Tokyo Ohka Kogyo Co., Ltd.) using a spray developing machine (manufactured by Izumi Seisakusho Co., Ltd.)
Was applied to the resist at a pressure of 0.2 kg / cm ² to develop the resist. Then rinse with pure water,
After that, it was naturally dried. Further, post-baking was performed at 120 ° C. for 30 minutes in order to improve the adhesion of the resist to the substrate.

Next, the fixed base 3 of the resist removing apparatus shown in FIG.
The base material provided with the resist was fixed. As the removing liquid (peeling liquid), "peeling liquid-1165" (trade name, manufactured by Shipley Co., Ltd.) was used, and the circulation flow rate by the pump 7 was set to 2 liters / minute. Nitrogen gas was used as the gas. The removing liquid (stripping liquid) and nitrogen gas are mixed at a volume ratio of 1: 1,
This gas-liquid mixture was applied to the resist at 1.5 kg / cm ²
The peeling was performed by jetting with the jetting pressure of. Subsequently, it was rinsed with pure water and then naturally dried.

Also in this example, the above processing was performed on 10 samples. The resist removal condition was examined for each sample, and the overall results (peeling time is the average value of 10 samples) are shown in Table 2. As is clear from Table 2, in this example, it was confirmed that the removal time was short and no stain was generated.

Example 4 Except that the removing liquid (peeling liquid) and the nitrogen gas are alternately sprayed at an interval of 1 second at a spraying pressure of 1.5 kg / cm ² onto the resist to strip the resist.
The same process as in Example 3 was performed.

Also in this example, processing was performed on 10 samples. The resist removal status was examined for each sample, and the overall result (peeling time was the average value of 10 samples)
Is shown in Table 2. Excellent results were obtained also in this example.

Example 5 As a resist, a positive photosensitive resin film “OZATEC R225” (: trade name,
Using Hoechst Japan Co., Ltd., it was laminated on a glass substrate at 100 ° C. under a pressure of 3 kg / cm ² . Then, the resist was subjected to pattern exposure of 300 mJ / cm ^{2 with} a high pressure mercury lamp using the photomask shown in FIG. 2 to form a pattern latent image with a line diameter of 20 μm on the resist. Subsequently, the resist was heat-treated at 110 ° C. for 10 minutes.

Next, the fixed base 3 of the resist removing apparatus shown in FIG.
The base material provided with the resist was fixed. A 3% NaOH aqueous solution was used as the removing solution (developing solution), and the circulation flow rate by the pump 7 was set to 2 liters / minute. Nitrogen gas was used as the gas. The inside of the removal tank 1 is adjusted to 10
The pressure is reduced to mmHg, and in this state, the removing solution (developing solution) and nitrogen gas are mixed at a volume ratio of 1: 1 and the gas-liquid mixture is sprayed onto the resist at a spraying pressure of 1 kg / cm ² to develop. went. Subsequently, it was rinsed with pure water and then naturally dried.

Also in this example, the above processing was performed on 10 samples. The resist removal condition was examined for each sample, and the overall results (developing time is the average value of 10 samples) are shown in Table 1. As is clear from Table 1, in this example, it was confirmed that the removal time was short, there was no swelling or dissolution of the unexposed portion, and that no stain was generated.

(Example 6) Example 6 was repeated except that the removing solution (developing solution) and the nitrogen gas were alternately sprayed at a 1 second interval at a spraying pressure of 1 kg / cm ^{2 to} the resist for development. The same process as 5 was performed.

Also in this example, processing was performed on 10 samples. The resist removal status was examined for each sample, and the overall result (development time was the average value of 10 samples)
Is shown in Table 1. Excellent results were obtained also in this example.

Example 7 A positive photosensitive resin “OFPR800” (trade name, manufactured by Tokyo Ohka Kogyo Co., Ltd.) was used as a resist, and after coating with a roll coater to a film thickness of 1.3 μm, Prebaking was performed at 90 ° C. for 30 minutes. Then, the resist was subjected to pattern exposure of 5000 mJ / cm ² using the photomask 20 shown in FIG. 2 to form a pattern latent image having a line diameter of 20 μm on the resist.

[NMD-3] (: trade name, Tokyo Ohka Kogyo Co., Ltd.) using a spray developing machine (manufactured by Izumi Seisakusho Co., Ltd.)
Was applied to the resist at a pressure of 0.2 kg / cm ² to develop the resist. Then rinse with pure water,
After that, it was naturally dried. Further, post-baking was performed at 120 ° C. for 30 minutes in order to improve the adhesion of the resist to the substrate.

Next, the fixing table 3 of the resist removing apparatus shown in FIG.
The base material provided with the resist was fixed. As the removing liquid (peeling liquid), "peeling liquid-1165" (trade name, manufactured by Shipley Co., Ltd.) was used, and the circulation flow rate by the pump 7 was set to 2 liters / minute. Nitrogen gas was used as the gas. The inside of the removal tank 1 was depressurized to 10 mmHg by the pump 13, and in this state, the removal liquid (stripping liquid) and nitrogen gas were mixed at a volume ratio of 1: 1, and this gas-liquid mixture was added to the resist at 1.5 kg / Peeling was performed by spraying with a spraying pressure of cm ² . Subsequently, it was rinsed with pure water and then naturally dried.

Also in this example, the above processing was performed for 10 samples. The resist removal condition was examined for each sample, and the overall results (peeling time is the average value of 10 samples) are shown in Table 2. As is clear from Table 2, in this example, it was confirmed that the removal time was short and no stain was generated.

(Example 8) Except that the removing liquid (peeling liquid) and the nitrogen gas are alternately sprayed at an interval of 1 second at a spraying pressure of 1.5 kg / cm ² onto the resist to strip the resist.
The same process as in Example 7 was performed.

Also in this example, processing was performed on 10 samples. The resist removal status was examined for each sample, and the overall result (peeling time was the average value of 10 samples)
Is shown in Table 2. Excellent results were obtained also in this example.

(Embodiment 9) The pressure inside the removing tank 1 in the developing step is set to 1 between 10 mmHg and 50 mmHg.
The same process as in Example 5 was performed except that the temperature was changed continuously in the minute cycle.

Also in this example, processing was performed on 10 samples. When the removal condition of the resist was examined for each sample, more excellent results were obtained.

(Example 10) Removal tank 1 in peeling process
Example 7 except that the pressure inside the is continuously changed in a 1 minute cycle between 10 mmHg and 50 mmHg.
The same process was performed.

Also in this example, processing was performed on 10 samples. When the removal condition of the resist was examined for each sample, more excellent results were obtained.

(Comparative Example 1) The same as Example 1 except that the developing solution was developed by spraying only the removing solution (developing solution) onto the resist at a spraying pressure of 1 kg / cm ² without using gas. Processed.

Also in this example, processing was performed on 10 samples. The resist removal status was examined for each sample, and the overall result (development time was the average value of 10 samples)
Is shown in Table 1.

Comparative Example 2 A removing solution (developing solution) was used at 1 kg / cm ² by using a spray developing machine (manufactured by Izumi Seisakusho Co., Ltd.).
The same process as in Example 1 was performed, except that the resist was sprayed and developed with the injection pressure of 1.

Also in this example, processing was performed on 10 samples. The resist removal status was examined for each sample, and the overall result (development time was the average value of 10 samples)
Is shown in Table 1.

(Comparative Example 3) Example 3 was repeated, except that only the removing liquid (peeling liquid) was sprayed onto the resist at a spraying pressure of 1.5 kg / cm ² without using gas to perform stripping. The same process was performed.

Also in this example, processing was performed on 10 samples. The resist removal status was examined for each sample, and the overall result (peeling time was the average value of 10 samples)
Is shown in Table 2.

(Comparative Example 4) A removing solution (stripping solution) was used at 1.5 kg / c using a spray developing machine (manufactured by Izumi Seisakusho)
The same process as in Example 3 was performed except that the resist was sprayed at a spraying pressure of m ² to remove the resist.

Also in this example, processing was performed on 10 samples. The resist removal status was examined for each sample, and the overall result (peeling time was the average value of 10 samples)
Is shown in Table 2.

[0085]

[Table 1] (Note) * 1: Time until there is no resist in the exposed area

[0086]

[Table 2] (Note) * 2: Time until the pattern (unexposed area) after development disappears

(Application Example 1) An ink jet recording head was manufactured by applying the resist removal according to the present invention in accordance with the manufacturing procedure schematically shown in FIGS. 4 (A) to 4 (F).

First, as shown in FIG. 4A, a glass substrate on which an electrothermal converter that generates thermal energy is formed as an energy generator 41 that generates energy used for ejecting ink. 40 was prepared. Next, as shown in FIG. 4B, a positive photosensitive resin film “OZATEC” is formed as a resist on the glass substrate 40.
A photosensitive resin layer 42 having a thickness of 50 μm and made of R225 ”(trade name, manufactured by Hoechst Japan Ltd.) was laminated at 100 ° C. under a pressure of 3 kg / cm ² .

A photomask (not shown) is superposed on the photosensitive resin layer 42, and a portion other than the portion where the ink passage is to be formed is irradiated with ultraviolet rays of 70 mJ / cm ² , and the latent area shown by the dotted line in FIG. The image 43a was formed on the photosensitive resin layer 42. Next, on the fixed base 3 of the resist removing apparatus of FIG. 1, the ejection port side is slightly turned up so that the gas-liquid mixture ejected from the ejection nozzle 4 smoothly flows from the supply port side to the ejection port side. The substrate 40 was fixed in an inclined state. A 1% NaOH aqueous solution was used as a removing solution (developing solution), and a pump 7 was used.
The circulation flow rate was 2 l / min. Nitrogen gas was used as the gas. The removing solution (developing solution) and nitrogen gas are mixed at a volume ratio of 1: 1 and this gas-liquid mixture is sprayed onto the photosensitive resin layer 42 at a spraying pressure of 1 kg / cm ² to obtain a state shown in FIG. Development was carried out as indicated. Subsequently, it was rinsed with pure water and then naturally dried.

Next, as shown in FIG. 4E, a passage wall forming material 44 for forming a wall of the ink passage so as to cover the patterned photosensitive resin layer 43 which has been developed. As "ARALDITE CY230 / HY
956 "(trade name, manufactured by Ciba-Geigy Co., Ltd.) was applied to a thickness of 100 μm using an applicator. After leaving at 30 ° C. for 12 hours to cure the passage wall forming material 44,
The patterned photosensitive resin layer 43 was solubilized by irradiating ultraviolet rays of 3000 mJ / cm ² from both sides of the substrate.

Next, after the supply port 45 is formed by cutting, the gas-liquid mixture sprayed from the spray nozzle 4 smoothly flows from the supply port side to the discharge port side on the fixed base 3 of the resist removing apparatus of FIG. In this manner, the substrate 40 was fixed in a state in which the ejection port side was directed upwards and tilted slightly obliquely. A 5% NaOH aqueous solution was used as the removing liquid (stripping liquid), and the circulation flow rate by the pump 7 was set to 2 liters / minute. Nitrogen gas was used as the gas. The removing liquid (peeling liquid) and nitrogen gas are mixed at a volume ratio of 1: 1 and the gas-liquid mixture is sprayed onto the patterned photosensitive resin layer 43 at a spraying pressure of 1.5 kg / cm ² to peel it off. I went. Then rinse with pure water,
After that, it was naturally dried. In this way, the inkjet recording head schematically shown in FIG. 4 (F) was obtained. This ink jet recording head has a rectangular ejection port 46a of 50 μm × 50 μm, and although only two ejection ports are shown in the drawing, actually 128 ejection ports and ink passages 46 communicating with them are formed. And a number of electrothermal converters corresponding to.

No residue of the photosensitive resin layer was present in the ink passage of the ink jet recording head, and the shape and size of the ink passage were excellent in accuracy. Further, when this ink jet recording head was mounted on the ink jet recording apparatus shown in FIG. 5 and ink was actually ejected, it was possible to perform stable recording having excellent ejection characteristics comprehensively over a long period of time.

(Application Example 2) The same procedure as in Application Example 1 was performed up to FIG. 4 (C).

Next, the fixed base 3 of the resist removing apparatus of FIG.
Further, the substrate 40 is fixed in a state in which the ejection port side is directed upward and slightly inclined so that the removal liquid and the gas ejected from the ejection nozzle 4 smoothly flow from the supply port side to the ejection port side. did. A 1% NaOH aqueous solution was used as a removing solution (developing solution), and the circulation flow rate by the pump 7 was set to 2 liters / minute.
Nitrogen gas was used as the gas. A removing solution (developing solution) and a nitrogen gas were alternately sprayed at an interval of 1 second at a spraying pressure of 1 kg / cm ² onto the photosensitive resin layer 42, and development was performed as shown in FIG. 4 (D). .. Then rinse with pure water,
After that, it was naturally dried.

Next, as shown in FIG. 4E, a passage wall forming material 44 for forming a wall of the ink passage is formed so as to cover the patterned photosensitive resin layer 43 which has been developed. As "ARALDITE CY230 / HY
956 "(trade name, manufactured by Ciba-Geigy Co., Ltd.) was applied to a thickness of 100 μm using an applicator. After leaving at 30 ° C. for 12 hours to cure the passage wall forming material 44,
The patterned photosensitive resin layer 43 was solubilized by irradiating ultraviolet rays of 3000 mJ / cm ² from both sides of the substrate.

Next, after the supply port 45 is formed by cutting, the removal liquid and the gas sprayed from the spray nozzle 4 are smoothly transferred from the supply port side to the discharge port side on the fixed base 3 of the resist removing apparatus of FIG. The substrate 40 was fixed in a state in which the discharge port side was directed upward and a slight inclination was made so that it would flow in the direction. A 5% NaOH aqueous solution was used as a removing solution (stripping solution), and a pump 7
The circulation flow rate was 2 l / min. Nitrogen gas was used as the gas. Remover (stripping solution) and nitrogen gas 1
The photosensitive resin layer 43 in the form of a pattern was alternately sprayed at intervals of a ^{second at} a spraying pressure of 1.5 kg / cm ² for peeling. Subsequently, it was rinsed with pure water and then naturally dried. In this way, an inkjet recording head schematically shown in FIG. 4 (F) was obtained. This inkjet recording head has a rectangular ejection port 46a of 50 μm × 50 μm, and although only two ejection ports are shown in the drawing, actually 128 ejection ports and the ink passage 4 communicating therewith are provided.
6 and the corresponding number of electrothermal converters.

No residue of the photosensitive resin layer was present in the ink passages of this ink jet recording head, and the shape and size of the ink passages were excellent in accuracy. Further, when this ink jet recording head was mounted on the ink jet recording apparatus shown in FIG. 5 and ink was actually ejected, it was possible to perform stable recording having excellent ejection characteristics comprehensively over a long period of time.

(Application Example 3) The same procedure as in Application Example 1 was performed up to FIG. 4 (C).

Next, the fixing table 3 of the resist removing apparatus shown in FIG.
Further, the substrate 40 was fixed with the discharge port side facing upward and slightly inclined so that the gas-liquid mixture sprayed from the spray nozzle 4 could smoothly flow from the supply port side to the discharge port side. A 1% NaOH aqueous solution was used as a removing solution (developing solution), and the circulation flow rate by the pump 7 was set to 2 liters / minute.
Nitrogen gas was used as the gas. The inside of the removal tank 1 was decompressed to 10 mmHg by the pump 13, and the removal solution (developing solution) and nitrogen gas were mixed at a volume ratio of 1: 1 in this state, and this gas-liquid mixture was applied to the photosensitive resin layer 42. 1 kg
Spraying was performed at a spraying pressure of / cm ² , and development was performed as shown in FIG. Subsequently, it was rinsed with pure water and then naturally dried.

Next, as shown in FIG. 4E, a passage wall forming material 44 for forming a wall of the ink passage is formed so as to cover the patterned photosensitive resin layer 43 which has been developed. As "ARALDITE CY230 / HY
956 "(trade name, manufactured by Ciba-Geigy Co., Ltd.) was applied to a thickness of 100 μm using an applicator. After leaving at 30 ° C. for 12 hours to cure the passage wall forming material 44,
The patterned photosensitive resin layer 43 was solubilized by irradiating ultraviolet rays of 3000 mJ / cm ² from both sides of the substrate.

Next, after the supply port 45 is formed by cutting, the gas-liquid mixture sprayed from the spray nozzle 4 smoothly flows from the supply port side to the discharge port side on the fixed base 3 of the resist removing apparatus of FIG. In this manner, the substrate 40 was fixed in a state in which the ejection port side was directed upwards and tilted slightly obliquely. A 5% NaOH aqueous solution was used as the removing liquid (stripping liquid), and the circulation flow rate by the pump 7 was set to 2 liters / minute. Nitrogen gas was used as the gas. The inside of the removal tank 1 is adjusted to 10
The pressure is reduced to mmHg, and in this state, the removing solution (stripping solution) and nitrogen gas are mixed at a volume ratio of 1: 1 and the gas-liquid mixture is applied to the patterned photosensitive resin layer 43 at 1.5 kg / c.
Peeling was performed by spraying at a spraying pressure of m ² . Subsequently, it was rinsed with pure water and then naturally dried. In this way, the inkjet recording head schematically shown in FIG. 4 (F) was obtained. This inkjet recording head is 50μ
Although it has a rectangular ejection port 46a of m × 50 μm and only two ejection ports are shown in the drawing, actually 128 ejection ports and ink passages 46 communicating therewith and a number corresponding to them. And an electrothermal converter.

No residue of the photosensitive resin layer was present in the ink passages of this ink jet recording head, and the accuracy of the shape and dimensions of the ink passages was excellent. Further, when this ink jet recording head was mounted on the ink jet recording apparatus shown in FIG. 5 and ink was actually ejected, it was possible to perform stable recording having excellent ejection characteristics comprehensively over a long period of time.

(Application Example 4) Up to FIG. 4C, the same operation as in Application Example 1 was performed.

Next, the fixed base 3 of the resist removing apparatus shown in FIG.
Then, the substrate 40 was fixed in a state in which the removing liquid and the gas jetted from the jet nozzle 4 smoothly slanted toward the discharge port side so that the removal liquid and the gas could smoothly flow from the supply port side to the discharge port side. A 1% NaOH aqueous solution was used as a removing solution (developing solution), and the circulation flow rate by the pump 7 was set to 2 liters / minute.
Nitrogen gas was used as the gas. The inside of the removal tank 1 was decompressed to 10 mmHg by the pump 13, and in this state, the removal solution (developing solution) and the nitrogen gas were alternately applied to the photosensitive resin layer 42 at an injection pressure of 1 kg / cm ² at intervals of 1 second. It was jetted and developed as shown in FIG. Subsequently, it was rinsed with pure water and then naturally dried.

Next, as shown in FIG. 4E, a passage wall forming material 44 for forming the ink passage wall so as to cover the patterned photosensitive resin layer 43 which has been developed. As "ARALDITE CY230 / HY
956 "(trade name, manufactured by Ciba-Geigy Co., Ltd.) was applied to a thickness of 100 μm using an applicator. After leaving at 30 ° C. for 12 hours to cure the passage wall forming material 44,
The patterned photosensitive resin layer 43 was solubilized by irradiating ultraviolet rays of 3000 mJ / cm ² from both sides of the substrate.

Next, after the supply port 45 is formed by cutting, the removal liquid and the gas sprayed from the spray nozzle 4 are smoothly transferred from the supply port side to the discharge port side on the fixed base 3 of the resist removing apparatus of FIG. The substrate 40 was fixed in a state in which the discharge port side was directed upward and a slight inclination was made so that it would flow in the direction. A 5% NaOH aqueous solution was used as a removing solution (stripping solution), and a pump 7
The circulation flow rate was 2 l / min. Nitrogen gas was used as the gas. The inside of the removal tank 1 was decompressed to 10 mmHg by the pump 13, and in this state, the removal solution (stripping solution) and the nitrogen gas were alternately applied at intervals of 1 second to the patterned photosensitive resin layer 43 at 1.5 kg / cm. Peeling was performed by spraying at a spraying pressure of ² . Then rinse with pure water,
After that, it was naturally dried. In this way, the inkjet recording head schematically shown in FIG. 4 (F) was obtained. This ink jet recording head has a rectangular ejection port 46a of 50 μm × 50 μm, and although only two ejection ports are shown in the drawing, actually 128 ejection ports and ink passages 46 communicating with them are formed. And a number of electrothermal converters corresponding to.

No residue of the photosensitive resin layer was present in the ink passages of this ink jet recording head, and the accuracy of the shape and dimensions of the ink passages was excellent. Further, when this ink jet recording head was mounted on the ink jet recording apparatus shown in FIG. 5 and ink was actually ejected, it was possible to perform stable recording having excellent ejection characteristics comprehensively over a long period of time.

(Application Example 5) The pressure inside the removal tank 1 in the developing step is set to 1 between 10 mmHg and 50 mmHg.
The same process as in Application Example 3 was performed except that it was continuously changed in a minute cycle.

No residue of the photosensitive resin layer was present even in the ink passages of this ink jet recording head, and the precision of the shape and dimensions of the ink passages was further excellent. Further, when this ink jet recording head was mounted on the ink jet recording apparatus shown in FIG. 5 and ink was actually ejected, it was possible to carry out stable recording having a more excellent ejection characteristic comprehensively for a long period of time.

(Application Example 6) The pressure inside the removal tank 1 in the peeling step is set to 1 between 10 mmHg and 50 mmHg.
The same process as in Application Example 4 was performed, except that it was continuously changed in a minute cycle.

No residue of the photosensitive resin layer was present even in the ink passages of this ink jet recording head, and the precision of the shape and dimensions of the ink passages was further excellent. Further, when this ink jet recording head was mounted on the ink jet recording apparatus shown in FIG. 5 and ink was actually ejected, it was possible to carry out stable recording having a more excellent ejection characteristic comprehensively for a long period of time.

[0112]

As described above in detail, according to the present invention, the removing action of the resist by the removing liquid is remarkably increased, and the uniformity of the removing action of the resist by the removing liquid is extremely high. You can

[Brief description of drawings]

FIG. 1 is a schematic view showing a resist removing apparatus according to one embodiment of the present invention.

FIG. 2 is a schematic top view showing an example of a photomask.

FIG. 3 is a schematic view showing a resist removing apparatus according to another embodiment of the present invention.

FIG. 4 is a schematic perspective process diagram for explaining an application example of manufacturing an inkjet recording head by applying the resist removal according to the present invention.

FIG. 5 is a schematic perspective view showing a main part of an example of an inkjet recording apparatus.

FIG. 6 is a schematic perspective view showing an outline of an inkjet recording apparatus equipped with a full-line type inkjet recording head.

[Explanation of symbols]

 1 Removal Tank 2 Base Material 3 Fixing Table 4 Injection Nozzle 5 Liquid Intake Port 6 Filter 7 Pump 8 First Valve 9 Second Valve 10 Gas Cylinder 11 Gas Intake Port 12 Mixing Section 13 Pump 14 Control Section 20 Photomask 21 Light-Shielding Section 40 Substrate 41 Energy Generator 42 Photosensitive Resin Layer 43 Solid Layer 44 Passage Wall Forming Member 45 Supply Port 46 Passage 46a Discharge Port

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification number Office reference number FI technical display location H01L 21/027 21/304 S 8831-4M G 8831-4M

Claims (29)

[Claims] 1. A method of removing a resist, characterized in that the resist is removed by mixing a resist removing liquid and a gas and spraying the mixture onto the resist. 2. The method of removing a resist according to claim 1, wherein the removal of the resist is performed under reduced pressure lower than atmospheric pressure. 3. The method of removing a resist according to claim 2, wherein the reduced pressure state is a state between a substantially vacuum state and a pressure state of 400 mmHg. 4. The resist removing method according to claim 2, wherein the pressure in the reduced pressure state is changed according to the elapsed time. 5. The resist removing method according to claim 1, wherein the mixing is performed with a volume ratio of the resist removing liquid and the gas being within a range of 1: 100 to 100: 1. 6. The pressure for spraying the resist is 0.01
resist removal method of claim 1 in the range of ^{kg / cm 2 ~10kg / cm 2} . 7. The method of removing a resist according to claim 1, wherein the gas is an inert gas. 8. The method of removing a resist according to claim 7, wherein the inert gas is at least one selected from helium, neon, and argon. 9. The method of removing a resist according to claim 1, wherein the gas is nitrogen. 10. The method of removing a resist according to claim 1, wherein the removed resist corresponds to an ink passage of an ink jet recording head. 11. The method of removing a resist according to claim 10, wherein the resist to be removed is a positive photosensitive resin. 12. The method for removing a resist according to claim 10, wherein the jetting direction is a direction from the supply port side to the ejection port side of the inkjet recording head. 13. The method of removing a resist according to claim 10, wherein an electrothermal converter that generates thermal energy used to eject ink is provided corresponding to the passage. 14. A method of removing a resist, characterized in that the resist is removed by alternately injecting a resist removing liquid and a gas onto the resist. 15. The method of removing a resist according to claim 14, wherein the removal of the resist is performed under reduced pressure lower than atmospheric pressure. 16. The method of removing a resist according to claim 15, wherein the reduced pressure state is a state between a substantially vacuum state and a pressure state of 400 mmHg. 17. The method of removing a resist according to claim 15, wherein the pressure in the reduced pressure state is changed according to the elapsed time. 18. The resist removing method according to claim 14, wherein the mixing is performed with the volume ratio of the resist removing liquid and the gas being within a range of 1: 100 to 100: 1. 19. The pressure for spraying the resist is 0.0.
Resist removing method of claim 14 which is within the range of ^{1kg / cm 2 ~10kg / cm 2} . 20. The gas is an inert gas.
4. The method for removing a resist according to 4. 21. The method of removing a resist according to claim 20, wherein the inert gas is at least one selected from helium, neon, and argon. 22. The method of removing a resist according to claim 14, wherein the gas is nitrogen. 23. The resist removing method according to claim 14, wherein the resist to be removed corresponds to an ink passage of an ink jet recording head. 24. The method of removing a resist according to claim 23, wherein the resist to be removed is a positive photosensitive resin. 25. The resist removing method according to claim 23, wherein the ejection direction is a direction from the supply port side to the ejection port side of the inkjet recording head. 26. The resist removing method according to claim 14, wherein a cycle of alternately injecting the resist removing liquid and the gas is within a range of 0.1 seconds to 5.0 seconds. 27. The method of removing a resist according to claim 23, wherein an electrothermal converter that generates thermal energy used for ejecting ink is provided corresponding to the passage. 28. A mixing means for mixing the resist removing liquid and the gas, and a means for injecting the resist removing liquid and the gas mixed by the mixing means onto the resist. Resist removal device. 29. A liquid supply means for supplying a resist removing liquid, a gas supply means for supplying a gas, a switching means for switching between the liquid supply means and the gas supply means, and switching of the switching means. And a means for alternately injecting the resist removing liquid and the gas onto the resist.