JPH0513560B2 - - Google Patents
Info
- Publication number
- JPH0513560B2 JPH0513560B2 JP29162686A JP29162686A JPH0513560B2 JP H0513560 B2 JPH0513560 B2 JP H0513560B2 JP 29162686 A JP29162686 A JP 29162686A JP 29162686 A JP29162686 A JP 29162686A JP H0513560 B2 JPH0513560 B2 JP H0513560B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- layer
- ceramic substrate
- polyimide resin
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000919 ceramic Substances 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 26
- 229920001721 polyimide Polymers 0.000 claims description 17
- 239000009719 polyimide resin Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000010409 thin film Substances 0.000 claims description 8
- 239000011810 insulating material Substances 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 43
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29162686A JPS63144599A (ja) | 1986-12-09 | 1986-12-09 | 多層回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29162686A JPS63144599A (ja) | 1986-12-09 | 1986-12-09 | 多層回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63144599A JPS63144599A (ja) | 1988-06-16 |
| JPH0513560B2 true JPH0513560B2 (cs) | 1993-02-22 |
Family
ID=17771391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29162686A Granted JPS63144599A (ja) | 1986-12-09 | 1986-12-09 | 多層回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63144599A (cs) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3087899B2 (ja) * | 1989-06-16 | 2000-09-11 | 株式会社日立製作所 | 厚膜薄膜混成多層配線基板の製造方法 |
| JP2712936B2 (ja) * | 1991-10-02 | 1998-02-16 | 日本電気株式会社 | ポリイミド多層配線基板およびその製造方法 |
| JPH0828580B2 (ja) * | 1993-04-21 | 1996-03-21 | 日本電気株式会社 | 配線基板構造及びその製造方法 |
-
1986
- 1986-12-09 JP JP29162686A patent/JPS63144599A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63144599A (ja) | 1988-06-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |