JPH0513539B2 - - Google Patents

Info

Publication number
JPH0513539B2
JPH0513539B2 JP6460487A JP6460487A JPH0513539B2 JP H0513539 B2 JPH0513539 B2 JP H0513539B2 JP 6460487 A JP6460487 A JP 6460487A JP 6460487 A JP6460487 A JP 6460487A JP H0513539 B2 JPH0513539 B2 JP H0513539B2
Authority
JP
Japan
Prior art keywords
metal
tab
electrode
chip
dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP6460487A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63229725A (ja
Inventor
Masafumi Nakano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP6460487A priority Critical patent/JPS63229725A/ja
Publication of JPS63229725A publication Critical patent/JPS63229725A/ja
Publication of JPH0513539B2 publication Critical patent/JPH0513539B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP6460487A 1987-03-18 1987-03-18 半導体装置 Granted JPS63229725A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6460487A JPS63229725A (ja) 1987-03-18 1987-03-18 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6460487A JPS63229725A (ja) 1987-03-18 1987-03-18 半導体装置

Publications (2)

Publication Number Publication Date
JPS63229725A JPS63229725A (ja) 1988-09-26
JPH0513539B2 true JPH0513539B2 (enrdf_load_stackoverflow) 1993-02-22

Family

ID=13263024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6460487A Granted JPS63229725A (ja) 1987-03-18 1987-03-18 半導体装置

Country Status (1)

Country Link
JP (1) JPS63229725A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03263897A (ja) * 1990-03-14 1991-11-25 Fujitsu Ltd 混成集積回路の実装方法
JPH10308478A (ja) * 1997-03-05 1998-11-17 Toshiba Corp 半導体モジュール

Also Published As

Publication number Publication date
JPS63229725A (ja) 1988-09-26

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