JPH0513524B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to composite parts, and particularly to a capacitor-internal composite laminated ceramic part in which a large capacity capacitor is built into a substrate.

(Prior Art) Conventionally, chip-type capacitors have been mounted on substrates such as alumina to achieve high integration in electronic circuits that utilize large-capacity capacitors. In other words, a hybrid IC is fabricated by forming a wiring pattern of resistors, electrodes, and conductors on an insulating substrate such as ceramic using a printing method, and then mounting chip capacitors, semiconductor ICs, etc. on the same surface. It had been. Recently, composite ceramic parts in which a dielectric material is sandwiched between insulators have been developed, and are being applied to hybrid ICs and the like.

(Problem to be solved by the invention) In recent years, with the rapid technological progress in electronics, various electronic parts are becoming smaller, and making parts lighter, thinner, and smaller is an essential condition for reducing costs. I'm getting used to it.

However, in conventional composite parts such as hybrid ICs, it is necessary to print resistors, electrodes, and wiring patterns at a higher density on a limited ceramic substrate, and to integrate chip capacitors, semiconductor ICs, etc. more highly. There are certain limits to what can be posted.

For example, if a high-density pattern is formed, quality may deteriorate or costs may rise.
In highly integrated designs, problems such as tower mounting space and shape constraints have arisen, especially as the number of mounted components increases.

Therefore, in order to achieve higher density and higher integration, new composite ceramic components with a structure in which resistors and capacitors are housed in the substrate are being developed. However, the dielectric 9 as shown in FIG.
In a composite ceramic component having a structure in which the conductor 7 is formed by sandwiching the conductor 7, it is a composite of insulator material, dielectric material, and other materials with very different properties, so there may be slight differences in shrinkage rate of each material or different properties. Due to mutual diffusion between materials, phenomena such as peeling and cracking tend to occur at the interface between an insulator and a dielectric, making it impossible to obtain a composite component with stable quality and high reliability.

(Means for solving the problem) The present invention provides a composite laminated ceramic component having a structure in which a dielectric material is sandwiched between insulators, in which a dielectric dummy layer and an insulator dummy layer are provided between the dielectric layer and the insulator layer. This is a structure in which a metal layer is formed between different material layers.

(Function) By forming the dielectric dummy layer and the insulator dummy layer between the dielectric layer and the insulator layer, the stress generated from the slightly different shrinkage characteristics of the dielectric and the insulator can be relaxed and absorbed. This has the effect of preventing microcracks and peeling at the interface between the dielectric layer and the insulator layer.

In addition, since the dielectric material and the insulator material have different material strengths after sintering, the stress caused by the strength difference should be reduced to the layer thickness of the insulator dummy layer used as a dummy layer. It can be relaxed by making the layer thickness smaller than .

Furthermore, the metal layer formed between each layer (insulator layer, dielectric dummy layer, insulator dummy layer, dielectric layer)
Since sintering occurs at relatively low temperatures, when the sintering reaction between dielectric and insulating ceramics occurs at high temperatures,
It has the effect of completely separating these interfaces, preventing mutual diffusion between different materials, and completely preventing reactions between ceramics, as well as providing bonding properties with each ceramic (dielectric, insulator). be.

As a result of the above, a highly reliable and high quality composite laminated ceramic part that does not cause cracks or interfacial peeling could be realized.

(Examples) Hereinafter, the present invention will be explained in detail by way of examples. Generally, to obtain ceramic green sheets, oxidized powder raw materials are weighed and mixed or pulverized using a ball mill or the like. Next, the mixed powder raw material is calcined using an electric furnace or the like to produce a preheated powder material. The precalcined powder material obtained by calcining is mixed with an organic solvent and an organic binder to obtain a slurry. The slurry is formed into a green sheet on a polyethylene film using a casting device such as a doctor blade method to obtain a ceramic green sheet.

Using the method described above, an insulator ceramic green sheet, a dielectric ceramic green sheet, and a metal green sheet to which insulator and dielectric ceramic powders were added were each produced, each was cut into an appropriate shape, and each ceramic green sheet was prepared. A sheet piece and a metal green sheet piece were produced.

The insulators used here include alumina-lead borosilicate-based composite materials, cordierite-based ceramics, mullite-based ceramics,
anorthite ceramics, calcilite ceramics, forsterite ceramics,
Materials such as spodumene and unicryptite are suitable. The dielectric constant of these insulators is about 5 to 10.

On the other hand, the dielectric material is a compound with a perogskite structure containing lead, and the sintering temperature is the same as that of the insulating material. The dielectric of this dielectric material varies depending on the composition of the constituent elements, but it is approximately 500~
It is controlled in the range of 20000. Therefore, it is extremely advantageous for forming a large capacity capacitor.

In addition, the metal bodies include Au, Ag, Pd, Pt,
A composition containing one or more of Cu, Ni, etc. is used.

Next, electrode patterns are printed on the dielectric sheet pieces using Ag/Pd internal electrode paste, and for each ceramic green sheet piece that requires through holes, through holes are opened and then the through holes are filled with electrode paste. Form a conductor part. In addition, necessary through holes are formed in the metal sheet piece.

Next, they are stacked so as to have the structure shown in FIG. 1, put into a press mold, and then subjected to thermocompression pressing. After cutting the press-bonded raw laminated ceramic body into a predetermined shape with a knife blade, etc., the binder is removed at around 500℃, and the laminated ceramic body after the binder is removed is heated at about 850℃ to 1000℃ using an electric furnace. By sintering at high temperatures, a composite laminated ceramic component with a built-in capacitor is obtained.

FIG. 1 is an exploded cross-section of a composite laminated ceramic part with a built-in capacitor manufactured based on the example.
There is an internal pattern electrode 1 serving as a capacitor and a dielectric layer 2, an insulator dummy layer 3 on the upper and lower surfaces of the dielectric layer 2, and a dielectric dummy layer 4 on the upper and lower surfaces thereof. Further, it has a composite laminated structure in which an insulating layer 5 is formed on the upper and lower surfaces thereof, and a metal layer 6 is formed at the interface between the ceramic layers made of different materials. The internal pattern electrode 1 formed on the dielectric layer 2 is guided to the upper surface of the insulating layer 5 by a conductor 7 as a capacitor portion, and is formed as a pad electrode 8 on the upper surface of the substrate.

In the laminated ceramic component manufactured as described above, an insulator dummy layer and a dielectric dummy layer are formed between the dielectric layer and the insulator layer, so that a high quality product with no occurrence of microcracks or peeling of the interface, etc. Composite laminated ceramic parts with built-in capacitors of high quality and reliability.

(Effects of the Invention) As described above, according to the present invention, it is possible to provide a highly reliable and high quality composite laminated ceramic component that is less prone to cracking.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of an embodiment of the composite laminated ceramic component of the present invention. Figure 2 is a cross-sectional view of the structure of a conventional composite ceramic component. 1... Internal pattern electrode, 2... Dielectric layer, 3
...Insulator dummy layer, 4...Dielectric dummy layer, 5
...Insulator layer, 6...Metal layer, 7...Conductor, 8
... Pad electrode, 9 ... Dielectric layer, 10, 11 ...
...Insulator layer.

Claims (1)

[Claims] 1 In a composite laminated ceramic component formed by laminating a dielectric layer, an insulator layer, a conductor, and a metal layer, electrode layers are formed on both sides of some of the dielectric layers, and electrode layers are formed between the dielectric layer and the insulator layer. 1. A composite laminated ceramic component characterized by having a structure in which a dummy layer of a dielectric material and an insulating material is formed, and a metal layer is formed between different ceramic layers.