JPH0513367B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a composite component, and more particularly to a capacitor-embedded composite laminated ceramic component in which a large-capacity capacitor is built into a substrate.

(Prior Art) Conventionally, chip-type capacitors have been mounted on substrates such as alumina to achieve high integration in electronic circuits that utilize large-capacity capacitors. In other words, a hybrid IC is fabricated by forming a wiring pattern of resistors, electrodes, and conductors on an insulating substrate such as ceramic using a printing method, and then mounting chip capacitors, semiconductor ICs, etc. on the same surface. It had been. Recently, composite ceramic parts in which a dielectric material is sandwiched between insulators have been developed, and are being applied to hybrid ICs and the like.

(Problems to be solved by the invention) In recent years, with the rapid technological advancement of electronics, various electronic parts have been moving towards miniaturization, and making parts lighter, thinner, and smaller is an essential condition from the point of view of cost reduction. I'm getting used to it.

However, in conventional composite parts such as hybrid ICs, it is necessary to print resistors, electrodes, and wiring patterns at a higher density on a limited ceramic substrate, and to mount chip capacitors, semiconductor ICs, etc. in a more highly integrated manner. has certain limits.

For example, if a high-density pattern is formed, quality may deteriorate or costs may rise.
In highly integrated designs, problems such as mounting space and shape constraints have arisen, especially as the number of mounted components increases.

Therefore, in order to achieve higher density and higher integration, new composite ceramic components with a structure in which resistors and capacitors are housed in the substrate are being developed. However, the dielectric 11 as shown in FIG.
In the composite ceramic part having the structure in which the conductor 9 is formed by sandwiching it in step 3, it is a composite of insulator material, dielectric material, and other materials with very different properties, so there is a slight difference in the shrinkage rate of each material. However, it has been impossible to obtain composite parts with stable quality and high reliability because phenomena such as peeling and cracking tend to occur at the interface between an insulator and a dielectric due to interdiffusion between different materials.

(Means for Solving the Problems) The present invention provides a composite laminated ceramic component having a structure in which a dielectric material is sandwiched between insulating materials. , two different metal layers added with insulator material
Formed various metal layers.

(Function) The material forming the metal layer to which dielectric material is added and the metal layer to which insulator material is added undergo sintering at a relatively low temperature, so the dielectric and insulator ceramics sinter at a high temperature. When the sintering reaction occurs, these interfaces are completely separated, preventing interdiffusion between different materials and preventing any reaction between ceramics. This has the effect of preventing microcracks, interfacial peeling, etc. that conventionally occur. In addition, in order to bond with each ceramic (dielectric, insulator), a metal layer made of a metal material added with a dielectric material is provided at the interface on the dielectric side, while a metal layer made of a metal material added with an insulator material is provided on the insulator side. By providing a metal layer made of body material, we have achieved a composite laminated ceramic component with high bonding properties and no peeling.

(Examples) Hereinafter, the present invention will be explained in detail by way of examples. Generally, to obtain ceramic green sheets, oxidized powder raw materials are weighed and mixed or pulverized using a ball mill or the like. Next, the mixed powder raw material is calcined using an electric furnace or the like to produce a prefired powder material. The precalcined powder material obtained by calcining is mixed with an organic solvent and an organic binder to obtain a slurry. The slurry is formed into a green sheet on a polyethylene film using a casting device such as a doctor blade method to obtain a ceramic green sheet.

Using the method described above, an insulating ceramic green sheet, a dielectric ceramic green sheet, a metal green sheet with an insulating material added, and a metal green sheet with a dielectric material added were produced, and each was shaped into an appropriate shape. By cutting, each ceramic green sheet piece and two types of metal green sheet pieces were produced.

Next, electrode patterns are printed on the dielectric sheet pieces using Ag/Pd internal electrode paste, and each ceramic green sheet piece that requires snowholes is
A through hole is opened and then filled with electrode paste to form a via conductor. Further, necessary through holes are formed in the metal sheet pieces, and then they are laminated so as to have the structure shown in FIG. 1, and after being put into a press mold, a thermocompression press is performed. After cutting the press-pressed raw composite laminated ceramic body into a predetermined shape with a knife blade, etc., the binder is removed at around 500℃, and the composite laminate after the binder is removed is heated from 850℃ to 950℃ using an electric furnace. A composite laminated ceramic component with a built-in capacitor can be obtained by sintering at a temperature of about °C.

The insulators used here include alumina oxide, lead silicate-based composite materials, cordierite-based ceramics, mullite-based ceramics,
anorthite ceramics, calcilite ceramics, forsterite ceramics,
Materials such as spodumene and eucryptite are suitable. The dielectric constant of these insulators is about 5 to 10.

On the other hand, the dielectric material is a compound with a perogskite structure containing lead, and the sintering temperature is the same as that of the insulating material. The dielectric constant of this dielectric material varies depending on the composition of the constituent elements, but is approximately 500 to 20,000.
It is controlled within the range of Therefore, it is extremely advantageous for forming a large capacity capacitor.

In addition, examples of metal bodies include Au, Ag, Pd, Pt,
Each metal layer was made by adding an insulator material and a dielectric material to a metal material having a composition containing one or more of Cu, Ni, etc.

FIG. 1 is an exploded cross-sectional view of a composite laminated ceramic component with a built-in capacitor manufactured based on an example. Dielectric frit-containing metal layers 2 and 3 are formed on the upper and lower surfaces of a dielectric layer 1 having an internal electrode pattern that becomes a capacitor layer. Further, metal layers 4 and 5 containing insulating frits are formed on each outer surface of the metal layers 2 and 3, and furthermore, insulator layers 6 and 7 are formed on each side surface of the metal layers 4 and 5. So, dielectric layer 1
The internal electrode pattern 8 formed in the capacitor portion is guided to the upper surface of the insulating layer 6 by a conductive electrode 9, and is formed as a patch electrode 10 on the upper surface of the substrate.

As described above, by forming two types of metal layers at the interface between the insulator layer and the dielectric layer, a metal layer containing an insulator frit containing an insulating material and a metal layer containing a dielectric frit containing a dielectric material. , prevents interfacial reaction between dielectric and insulator compared to those without metal layer,
Moreover, we were able to provide a highly reliable, high-quality composite laminated ceramic component with a built-in capacitor that has good bonding properties.

Although the metal layer was formed by a green sheet method in this example, it was confirmed that the metal layer could also be formed by a method of printing a metal paste such as a screen printing method.

(Effects of the Invention) According to the present invention, it is possible to obtain a highly reliable composite laminated ceramic component in which no cracks occur between layers of different materials.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of an embodiment of a composite laminated ceramic component with a built-in capacitor according to the present invention. Figure 2 is an exploded cross-sectional view of a conventional composite laminated ceramic part. 1... Dielectric layer, 2, 3... Metal layer with dielectric frit, 4, 5... Metal layer with insulator frit, 6, 7... Insulator layer, 8... Internal pattern electrode, 9... Conductor, 10... Electrode pad, 11...
Dielectric layer, 12, 13...Insulator layer.

Claims (1)

[Claims] 1 In a composite laminated ceramic component consisting of a dielectric layer, an insulator layer, and a conductor, two metal layers are formed at the interface between the dielectric layer and the insulator layer, and a dielectric material is formed on the side in contact with the dielectric layer. 1. A composite laminated ceramic component characterized in that it has a structure in which a metal layer to which is added is formed, and a metal layer to which an insulator material is added is formed on the side in contact with the insulator layer.