JPH0513516Y2 - - Google Patents
Info
- Publication number
- JPH0513516Y2 JPH0513516Y2 JP7948987U JP7948987U JPH0513516Y2 JP H0513516 Y2 JPH0513516 Y2 JP H0513516Y2 JP 7948987 U JP7948987 U JP 7948987U JP 7948987 U JP7948987 U JP 7948987U JP H0513516 Y2 JPH0513516 Y2 JP H0513516Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- printed wiring
- wiring board
- pores
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011148 porous material Substances 0.000 claims description 26
- 238000003825 pressing Methods 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 3
- 230000000414 obstructive effect Effects 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7948987U JPH0513516Y2 (zh) | 1987-05-26 | 1987-05-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7948987U JPH0513516Y2 (zh) | 1987-05-26 | 1987-05-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63189593U JPS63189593U (zh) | 1988-12-06 |
| JPH0513516Y2 true JPH0513516Y2 (zh) | 1993-04-09 |
Family
ID=30929396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7948987U Expired - Lifetime JPH0513516Y2 (zh) | 1987-05-26 | 1987-05-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0513516Y2 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011145336A1 (ja) * | 2010-05-19 | 2011-11-24 | 日本発條株式会社 | 金属ベース回路基板の連鎖品形成方法及び金属ベース回路基板の連鎖品 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2609214B2 (ja) * | 1993-05-12 | 1997-05-14 | ダイワ電機精工株式会社 | 回路基板分割方法と回路基板分割用金型 |
-
1987
- 1987-05-26 JP JP7948987U patent/JPH0513516Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011145336A1 (ja) * | 2010-05-19 | 2011-11-24 | 日本発條株式会社 | 金属ベース回路基板の連鎖品形成方法及び金属ベース回路基板の連鎖品 |
| JP2011243813A (ja) * | 2010-05-19 | 2011-12-01 | Nhk Spring Co Ltd | 金属ベース回路基板の連鎖品形成方法及び金属ベース回路基板の連鎖品 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63189593U (zh) | 1988-12-06 |
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