JPH0513039Y2 - - Google Patents
Info
- Publication number
- JPH0513039Y2 JPH0513039Y2 JP1986127912U JP12791286U JPH0513039Y2 JP H0513039 Y2 JPH0513039 Y2 JP H0513039Y2 JP 1986127912 U JP1986127912 U JP 1986127912U JP 12791286 U JP12791286 U JP 12791286U JP H0513039 Y2 JPH0513039 Y2 JP H0513039Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- metal plate
- notch
- ground pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- 238000001125 extrusion Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 210000002105 tongue Anatomy 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986127912U JPH0513039Y2 (US06534493-20030318-C00166.png) | 1986-08-21 | 1986-08-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986127912U JPH0513039Y2 (US06534493-20030318-C00166.png) | 1986-08-21 | 1986-08-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6333699U JPS6333699U (US06534493-20030318-C00166.png) | 1988-03-04 |
| JPH0513039Y2 true JPH0513039Y2 (US06534493-20030318-C00166.png) | 1993-04-06 |
Family
ID=31023112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986127912U Expired - Lifetime JPH0513039Y2 (US06534493-20030318-C00166.png) | 1986-08-21 | 1986-08-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0513039Y2 (US06534493-20030318-C00166.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2510527Y2 (ja) * | 1989-11-02 | 1996-09-11 | 日本ケミコン株式会社 | 基板ケ―ス |
| JP2011103360A (ja) * | 2009-11-10 | 2011-05-26 | Yutaka Denki Seisakusho:Kk | 表面実装型プリント基板を用いたカバー付き表面実装用電子部品 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5727181U (US06534493-20030318-C00166.png) * | 1980-07-22 | 1982-02-12 | ||
| JPS5918488B2 (ja) * | 1980-08-15 | 1984-04-27 | 三井建設株式会社 | 安定液掘削工法におけるスライムの処理方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5918488U (ja) * | 1982-07-26 | 1984-02-04 | アルプス電気株式会社 | 電子機器の基板保持構造 |
-
1986
- 1986-08-21 JP JP1986127912U patent/JPH0513039Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5727181U (US06534493-20030318-C00166.png) * | 1980-07-22 | 1982-02-12 | ||
| JPS5918488B2 (ja) * | 1980-08-15 | 1984-04-27 | 三井建設株式会社 | 安定液掘削工法におけるスライムの処理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6333699U (US06534493-20030318-C00166.png) | 1988-03-04 |
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