JPH0513030Y2 - - Google Patents
Info
- Publication number
- JPH0513030Y2 JPH0513030Y2 JP7938785U JP7938785U JPH0513030Y2 JP H0513030 Y2 JPH0513030 Y2 JP H0513030Y2 JP 7938785 U JP7938785 U JP 7938785U JP 7938785 U JP7938785 U JP 7938785U JP H0513030 Y2 JPH0513030 Y2 JP H0513030Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- grounding
- metal fitting
- bendable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 44
- 238000003780 insertion Methods 0.000 claims description 16
- 230000037431 insertion Effects 0.000 claims description 16
- 238000005476 soldering Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 description 13
- 230000004907 flux Effects 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7938785U JPH0513030Y2 (ko) | 1985-05-29 | 1985-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7938785U JPH0513030Y2 (ko) | 1985-05-29 | 1985-05-29 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61196586U JPS61196586U (ko) | 1986-12-08 |
| JPH0513030Y2 true JPH0513030Y2 (ko) | 1993-04-06 |
Family
ID=30624253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7938785U Expired - Lifetime JPH0513030Y2 (ko) | 1985-05-29 | 1985-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0513030Y2 (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2595129Y2 (ja) * | 1991-10-25 | 1999-05-24 | ソニー株式会社 | ディップ対応アース板 |
-
1985
- 1985-05-29 JP JP7938785U patent/JPH0513030Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61196586U (ko) | 1986-12-08 |
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