Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filedfiledCritical
Priority to JP1987192590UpriorityCriticalpatent/JPH0511Y2/ja
Publication of JPH0195117UpublicationCriticalpatent/JPH0195117U/ja
Application grantedgrantedCritical
Publication of JPH0511Y2publicationCriticalpatent/JPH0511Y2/ja
Integrated circuit lead frame assembly containing voltage bussing and distribution to an integrated circuit die using tape automated bonding with two metal layers