JPH0492660U - - Google Patents

Info

Publication number
JPH0492660U
JPH0492660U JP1990405304U JP40530490U JPH0492660U JP H0492660 U JPH0492660 U JP H0492660U JP 1990405304 U JP1990405304 U JP 1990405304U JP 40530490 U JP40530490 U JP 40530490U JP H0492660 U JPH0492660 U JP H0492660U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990405304U
Other languages
Japanese (ja)
Other versions
JPH0744029Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990405304U priority Critical patent/JPH0744029Y2/ja
Publication of JPH0492660U publication Critical patent/JPH0492660U/ja
Application granted granted Critical
Publication of JPH0744029Y2 publication Critical patent/JPH0744029Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
    • H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
    • H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
    • H01L2224/48478—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball
    • H01L2224/4848—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) the connecting portion being a wedge bond, i.e. wedge on pre-ball outside the semiconductor or solid-state body
JP1990405304U 1990-12-28 1990-12-28 Ｌｅｄモジュール Expired - Fee Related JPH0744029Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990405304U JPH0744029Y2 (ja) 1990-12-28 1990-12-28 Ｌｅｄモジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990405304U JPH0744029Y2 (ja) 1990-12-28 1990-12-28 Ｌｅｄモジュール

Publications (2)

Publication Number Publication Date
JPH0492660U true JPH0492660U (ar) 1992-08-12
JPH0744029Y2 JPH0744029Y2 (ja) 1995-10-09

Family

ID=31882770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990405304U Expired - Fee Related JPH0744029Y2 (ja) 1990-12-28 1990-12-28 Ｌｅｄモジュール

Country Status (1)

Country Link
JP (1) JPH0744029Y2 (ar)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0921568A2 (en) 1997-11-25 1999-06-09 Matsushita Electric Works, Ltd. LED Luminaire
JP2003529792A (ja) * 2000-03-31 2003-10-07 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ コリメーション及び収束用ワンピースレンズアレイ及び該ワンピースレンズアレイを用いるｌｅｄ発光器
JP2005117028A (ja) * 2003-09-16 2005-04-28 Matsushita Electric Ind Co Ltd Ｌｅｄ照明光源
WO2005067066A1 (ja) * 2004-01-07 2005-07-21 Matsushita Electric Industrial Co., Ltd. Ｌｅｄ照明光源
JP2005203748A (ja) * 2003-12-16 2005-07-28 Nichia Chem Ind Ltd 発光装置及びその製造方法
JP2006010745A (ja) * 2004-06-22 2006-01-12 Sony Corp 照明装置
JP2007128735A (ja) * 2005-11-02 2007-05-24 Citizen Electronics Co Ltd 照明用レンズの構造。
JP2007180520A (ja) * 2005-10-25 2007-07-12 Philips Lumileds Lightng Co Llc 異なる補助光学素子を有する複合発光ダイオード
JP2008053571A (ja) * 2006-08-28 2008-03-06 Nichia Chem Ind Ltd 発光装置およびそれを用いた面状発光装置
JP2010109170A (ja) * 2008-10-30 2010-05-13 Stanley Electric Co Ltd 半導体発光装置
JP2010529631A (ja) * 2007-06-14 2010-08-26 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 調節可能なビーム形状を持つｌｅｄベースの照明器具
WO2010098349A1 (ja) * 2009-02-25 2010-09-02 ローム株式会社 Ｌｅｄランプ
JP4720978B2 (ja) * 2005-02-18 2011-07-13 ミネベア株式会社 面状照明装置
WO2013089108A1 (ja) * 2011-12-14 2013-06-20 株式会社小糸製作所 発光モジュール
WO2016052471A1 (ja) * 2014-10-02 2016-04-07 ウシオ電機株式会社 発光モジュール
JP2019208033A (ja) * 2012-05-09 2019-12-05 ローム株式会社 発光装置
CN112703595A (zh) * 2018-09-19 2021-04-23 三星显示有限公司 发光器件及具有该发光器件的显示装置
JP2021090052A (ja) * 2019-12-05 2021-06-10 オプティツ インコーポレイテッド モノリシック多焦点光源デバイス

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018063901A (ja) 2016-10-14 2018-04-19 株式会社小糸製作所 車両用前照灯

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6161703U (ar) * 1984-09-27 1986-04-25
JPS62103273U (ar) * 1985-12-18 1987-07-01
JPS62229987A (ja) * 1986-03-31 1987-10-08 Koito Mfg Co Ltd 照明装置
JPS6332972A (ja) * 1986-07-26 1988-02-12 Mitsubishi Cable Ind Ltd ランプ
JPS6322759U (ar) * 1986-07-26 1988-02-15
JPS6335089U (ar) * 1986-08-25 1988-03-07
JPS6395261U (ar) * 1986-12-11 1988-06-20
JPS63107483U (ar) * 1986-12-29 1988-07-11
JPH0244780A (ja) * 1988-08-04 1990-02-14 Sharp Corp 標示用ランプ
JPH0278102A (ja) * 1987-12-24 1990-03-19 Mitsubishi Cable Ind Ltd 発光ダイオード照明具

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6161703U (ar) * 1984-09-27 1986-04-25
JPS62103273U (ar) * 1985-12-18 1987-07-01
JPS62229987A (ja) * 1986-03-31 1987-10-08 Koito Mfg Co Ltd 照明装置
JPS6332972A (ja) * 1986-07-26 1988-02-12 Mitsubishi Cable Ind Ltd ランプ
JPS6322759U (ar) * 1986-07-26 1988-02-15
JPS6335089U (ar) * 1986-08-25 1988-03-07
JPS6395261U (ar) * 1986-12-11 1988-06-20
JPS63107483U (ar) * 1986-12-29 1988-07-11
JPH0278102A (ja) * 1987-12-24 1990-03-19 Mitsubishi Cable Ind Ltd 発光ダイオード照明具
JPH0244780A (ja) * 1988-08-04 1990-02-14 Sharp Corp 標示用ランプ

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0921568A2 (en) 1997-11-25 1999-06-09 Matsushita Electric Works, Ltd. LED Luminaire
JP2003529792A (ja) * 2000-03-31 2003-10-07 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ コリメーション及び収束用ワンピースレンズアレイ及び該ワンピースレンズアレイを用いるｌｅｄ発光器
JP2005117028A (ja) * 2003-09-16 2005-04-28 Matsushita Electric Ind Co Ltd Ｌｅｄ照明光源
JP2005203748A (ja) * 2003-12-16 2005-07-28 Nichia Chem Ind Ltd 発光装置及びその製造方法
JP4654670B2 (ja) * 2003-12-16 2011-03-23 日亜化学工業株式会社 発光装置及びその製造方法
WO2005067066A1 (ja) * 2004-01-07 2005-07-21 Matsushita Electric Industrial Co., Ltd. Ｌｅｄ照明光源
JPWO2005067066A1 (ja) * 2004-01-07 2007-12-20 松下電器産業株式会社 Ｌｅｄ照明光源
JP2006010745A (ja) * 2004-06-22 2006-01-12 Sony Corp 照明装置
JP4720978B2 (ja) * 2005-02-18 2011-07-13 ミネベア株式会社 面状照明装置
JP2007180520A (ja) * 2005-10-25 2007-07-12 Philips Lumileds Lightng Co Llc 異なる補助光学素子を有する複合発光ダイオード
JP4535504B2 (ja) * 2005-11-02 2010-09-01 シチズン電子株式会社 照明用レンズの構造。
JP2007128735A (ja) * 2005-11-02 2007-05-24 Citizen Electronics Co Ltd 照明用レンズの構造。
JP2008053571A (ja) * 2006-08-28 2008-03-06 Nichia Chem Ind Ltd 発光装置およびそれを用いた面状発光装置
JP2010529631A (ja) * 2007-06-14 2010-08-26 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 調節可能なビーム形状を持つｌｅｄベースの照明器具
JP2010109170A (ja) * 2008-10-30 2010-05-13 Stanley Electric Co Ltd 半導体発光装置
US11608941B2 (en) 2009-02-25 2023-03-21 Rohm Co., Ltd. LED lamp
WO2010098349A1 (ja) * 2009-02-25 2010-09-02 ローム株式会社 Ｌｅｄランプ
JP2010198919A (ja) * 2009-02-25 2010-09-09 Rohm Co Ltd Ｌｅｄランプ
US11629826B2 (en) 2009-02-25 2023-04-18 Rohm Co., Ltd. LED lamp
WO2013089108A1 (ja) * 2011-12-14 2013-06-20 株式会社小糸製作所 発光モジュール
JP2019208033A (ja) * 2012-05-09 2019-12-05 ローム株式会社 発光装置
WO2016052471A1 (ja) * 2014-10-02 2016-04-07 ウシオ電機株式会社 発光モジュール
CN112703595A (zh) * 2018-09-19 2021-04-23 三星显示有限公司 发光器件及具有该发光器件的显示装置
JP2021090052A (ja) * 2019-12-05 2021-06-10 オプティツ インコーポレイテッド モノリシック多焦点光源デバイス

Also Published As

Publication number Publication date
JPH0744029Y2 (ja) 1995-10-09

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