JPH0481859B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a technique that is effective when applied to improving the reliability of semiconductor devices.

[Background technology]

As pellets become more highly integrated, it becomes difficult to stably supply power to the entire circuit formed on the pellet. Therefore, it is considered necessary to form a plurality of power supply sections to the circuit by dispersing them into pellets.

In a semiconductor device in which electrical continuity between the circuit section of the pellet and external terminals is achieved by bonding with wires made of gold or the like and leads arranged around the pellet mounting section, the power supply section is connected to the external terminal of the pellet. This is a bonding pad formed around the circuit formation area.

In such a semiconductor device, when power is supplied from one power lead to power supply pads, which are multiple power supply units formed apart from each other,
It is physically difficult to bond multiple wires to the bonding part of the same lead, and even if bonding is possible, one or more power supply wires must be connected to other leads and bonding parts. Since the wires intersect with the signal wires connecting the wires, there may be a problem of contact between the wires.

In addition, in semiconductor devices that require a constant voltage to be applied to the back side of the pellet, a metallized layer (gold-
A silicon eutectic layer) is utilized, and therefore the pellet attachment portion is formed in connection with a specific lead formed around the pellet.

In this semiconductor device, if multiple bonding pads formed apart from each other need to be at the same potential as the electrode on the back side of the pellet, multiple wires can be bonded to the bonding part of the lead connected to the pellet mounting part. There is a need to. This is because, in order to make an electrical connection with a wire bonder, it is difficult to make an electrical connection unless the bonding pad is a certain distance or more away from the bonding pad.

The inventors have discovered that such a semiconductor device also has the same problem as the case where wire bonding is performed between one power supply lead and a plurality of power supply pads.

[Purpose of the invention]

The purpose of the present invention is to supply stable power at the same potential to multiple power supply bonding pads arranged on a pellet without crossing wires or increasing the number of leads. The aim is to provide effective technology for

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

That is, by extending an arbitrary lead to a position where wire bonding can be performed with a plurality of bonding pads, or by extending a predetermined part of the end of the pellet attachment part, which is the back electrode, to a position where wire bonding can be performed with bonding pads. By making it possible to wire bond the number of wires equivalent to the number of bonding pads at positions that approximately correspond to each bonding pad, it is possible to identify the wires without causing any intersection between the wires and the signal wires. It is possible to electrically connect one lead, which is an electrode, to a plurality of bonding pads.

Embodiment 1 FIG. 1 is a sectional view of a semiconductor device made of a chip carrier type package made of ceramic according to Embodiment 1 of the present invention, taken approximately at the center thereof.

In the semiconductor device of Example 1, a pellet 3 made of silicon single crystal or the like is attached using a brazing material 4 to a pellet attachment part 2 which is metallized with tungsten at the bottom of a cavity formed in a package substrate 1 made of ceramic. The bonding pad 5 of the pellet 3 and the pellet attachment part 2 are bonded together.
After electrically connecting the bonding part 7 of the lead 6 made of tungsten or the like, which is arranged on the same main surface as the pellet attachment part 2 at the periphery, with a wire 8 made of gold or aluminum, a cap 9 made of ceramic is connected. It is hermetically sealed with a low melting point glass 10 interposed therebetween. Note that the lead 6
is partially embedded in the package substrate 1, and the other end extends to the back surface of the substrate, making it possible to establish electrical continuity with the outside.

FIG. 2 is a plan view showing a part of the interior of the cavity in the semiconductor device of Example 1, with bonding wires omitted.

That is, a pellet 3 is attached to a pellet attachment part 2, and a plurality of leads 6 are arranged around the pellet attachment part 2 at approximately predetermined intervals at a substantially constant distance from the end of the pellet attachment part. The power supply lead 6a is formed by extending into a substantially U-shape, which is a part of a comb shape, so as to sandwich the tips of two or more leads 6.

As shown in this figure, the leads 6 are arranged at positions approximately corresponding to each bonding pad, and each lead is connected to a corresponding bonding pad and a wire (not shown) at a bonding part 6a near its tip. It is connected. And power lead 6a
are the bonding parts 7a and 7b,
These are wire bonded to corresponding power supply pads 5a and 5b, respectively.

Therefore, in the semiconductor device of the first embodiment, the wire 7 connecting the other signal pad 5 formed between the power supply pads 5a and 5b which are separated from each other and the corresponding lead 6 is Connect one power lead 6a and multiple power pads 5 without intersecting.
Since wire bonding can be performed between a and 5b, it is possible to stably supply power at the same potential to multiple power supply pads without causing contact between the wires 7, thereby improving reliability. It is something that can be done.

The pellet mounting portion 2 and the lead 6 can be easily formed by a conventional method such as printing tungsten paste, and may be plated with gold or the like if necessary.

Embodiment 2 FIG. 3 is a plan view showing a part of the inside of a cavity of a semiconductor device according to Embodiment 2 of the present invention, with bonding wires omitted.

The semiconductor device of Example 2 is almost the same as the semiconductor device of Example 1, and the inside of the cavity shown in FIG. 3 is also approximately the same part as FIG. 2.

In the semiconductor device of Example 2, the two power supply leads 6a and 6b are extended and formed continuously so as to surround the other lead 6, and a plurality of separately formed By wire bonding the power supply pads 5a and 5b and the bonding portions 7a and 7b of the power supply leads 6a and 6b, respectively, the same effect as in the first embodiment can be obtained.

In addition, since multiple power supplies are formed in series, it is possible to connect multiple power supply pads in cases where a single lead does not have enough current capacity due to the narrow lead width of highly integrated semiconductor devices. It is capable of supplying stable power.

Embodiment 3 FIG. 4 shows a part of the inside of a cavity of a semiconductor device according to Embodiment 3 of the present invention, with bonding wires omitted.

The semiconductor device of Example 3 is almost the same as the semiconductor device shown in Example 1, but since it is necessary to apply voltage to the pellet 3 from the back side,
The pellet mounting portion 2 functions as a back electrode. Therefore, one lead 6c among the leads arranged around the pellet mounting part 2 is connected to the pellet mounting part 2.

In the semiconductor device, when it is desired to supply power to the plurality of power supply pads 5a and 5b formed apart from each other at the same voltage as the back electrode, the purpose can be achieved by wire bonding 5b at the bonding part 7c of 6c. However, if 5a is wire bonded with the same bonding part 7c, 5a and 5b
This will intersect with the wire connecting the signal pad formed in between and the other lead 6.

Therefore, in the semiconductor device of Example 3,
A part of the nearest pellet attachment part of the power supply pad 5a is extended to form a lead-shaped extension part 11 as shown in FIG. By doing so, power can be supplied to a plurality of power supply pads at the same potential as the back electrode without crossing the signal wire.

The pellet mounting portion 2 shown in the third embodiment can be easily formed by the method shown in the first embodiment, similar to the second embodiment.

It should be noted that the semiconductor devices of Examples 1 to 3 can be easily manufactured by conventional methods except for the metallization of the leads 6 or the pellet mounting portion 2.

〔effect〕

(1) In a semiconductor device in which leads are arranged in an array around the pellet mounting part, by extending any lead and forming it, multiple bonding pads formed separately on the pellet can be formed. Since wire bonding can be easily performed between the wire and the lead without crossing wires connecting other bonding pads, wire bonding can be performed with multiple bonding pads without increasing the number of leads. Become.

(2) In (1) above, if the extended lead is a power supply lead, power can be supplied to multiple power supply pads at the same potential, so even if it is a semiconductor device equipped with highly integrated pellets. Also, it is possible to provide a semiconductor device having highly reliable arithmetic performance.

(3) By extending a plurality of leads that are formed separately and forming them so that they are continuous with each other, even if the current capacity of one lead is small, the leads that are formed separately can be extended. It is possible to supply stable power at the same potential to multiple power supply pads.

(4) In a semiconductor device in which leads are formed in an array around a pellet mounting part, and the pellet mounting part is connected to a power supply lead and functions as a back electrode, it corresponds to the power supply lead. A wire bonding pad formed between the two bonding pads is formed by wire bonding the bonding pad and extending the nearest pellet attachment part of another bonding pad formed at a distance from the bonding pad. The extended portion can be wire-bonded to other separately formed bonding pads without intersecting the wires connected to the separately formed bonding pads. Power can be reliably supplied to the bonding pad at the same potential as the back electrode.

Although the invention made by the present inventor has been specifically explained based on Examples above, the present invention is not limited to the Examples described above, and it is understood that various changes can be made without departing from the gist of the invention. Needless to say.

For example, we have only explained the metallization of pellet attachment parts and leads for tungsten;
The material is not limited to this, and a high-melting point metal such as molybdenum may be used, and gold, aluminum, or the like may be vapor-deposited. Furthermore, it goes without saying that the shape of the pellet attachment portion and the formation of the leads are not necessarily limited to those shown in the embodiments.

In the above embodiment, a package made of ceramic was described, but the present invention is not limited to this, and a package made of plastic such as polyimide may be used. In this case, a printed circuit board made of copper or the like may be used as the metallization.

Further, in the embodiment, only the relationship between the power supply lead and the power supply pad was explained, but the present invention is not limited to this, and can also be applied to the case where signals are taken from multiple bonding pads separated from each other to a specific lead. Needless to say.

[Application field]

In the above description, the invention made by the present inventor was mainly applied to a semiconductor device consisting of a chip carrier type package, which is the background field of application, but the present invention is not limited to this, for example, This technique is effective and can be applied to any semiconductor device formed by wire bonding, such as a multi-chip module.

[Brief explanation of drawings]

1 is a cross-sectional view showing a semiconductor device according to a first embodiment of the present invention, FIG. 2 is a schematic partial plan view showing the inside of a cavity in the semiconductor device according to a first embodiment, and FIG. 3 is a cross-sectional view showing a semiconductor device according to a first embodiment of the present invention. FIG. 4 is a schematic plan view showing the inside of a cavity in a semiconductor device according to Example 2. FIG. 4 is a schematic plan view showing the inside of a cavity in a semiconductor device according to Example 3 of the present invention. DESCRIPTION OF SYMBOLS 1... Package board, 2... Pellet attachment part, 3... Pellet, 4... Brazing metal, 5... Bonding pad, 5a, 5b... Power supply pad,
6, 6a, 6b, 6c... lead, 7, 7a, 7
b, 7c, 7d... bonding part, 8... lead, 9... cap, 10... low melting point glass, 1
1...extension part.

Claims (1)

[Scope of Claims] 1 A package substrate, a pellet attaching metallized layer formed on the main surface of the package substrate, and a pellet attaching metallized layer formed on the same main surface as the pellet attaching metallized layer and on the pellet attaching metallized layer. A plurality of lead metallization layers disposed with their ends close to each other, a pellet attached on the pellet attachment metallization layer, and a plurality of bonding pads formed on the pellets at the ends of the lead metallization layer. The bonding pad includes a plurality of bonding pads for signals and a plurality of bonding pads for power supply provided between the bonding pads for signals. The plurality of lead metallized layers include a signal lead metallized layer whose end portion is close to the plurality of signal bonding pads, and the plurality of power supply bonding pads. A plurality of lead portions arranged close to the lead and spaced apart from each other extend so as to traverse between the end portions of the pellet and the signal lead metallization layer and are continuous with each other. a power supply lead metallized layer for power supply formed as shown in FIG. A semiconductor device characterized in that the power lead metallized layer is electrically connected to the wires without crossing each other. 2. The semiconductor device according to claim 1, wherein the package substrate is made of ceramic.