JPH0479422U - - Google Patents

Info

Publication number
JPH0479422U
JPH0479422U JP12344890U JP12344890U JPH0479422U JP H0479422 U JPH0479422 U JP H0479422U JP 12344890 U JP12344890 U JP 12344890U JP 12344890 U JP12344890 U JP 12344890U JP H0479422 U JPH0479422 U JP H0479422U
Authority
JP
Japan
Prior art keywords
film
foreign matter
pure water
enveloping
thawing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12344890U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12344890U priority Critical patent/JPH0479422U/ja
Publication of JPH0479422U publication Critical patent/JPH0479422U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】
第1図はこの発明の一実施例による異物除去装
置を示す構成図、第2図a,b,cは除去原理の
一例を示す図、第3図はその動作を示すシーケン
ス図、第4図及び第5図は従来の異物除去装置の
構成図及び除去原理図である。 図において、3は純水蒸気噴出ノズル、4は気
化CO噴射ノズル、5は温水噴出ノズル、6は
付着異物、7は純水皮膜、8は急冷による凍結膜
、9は温水。なお、図中、同一符号は同一、又は
相当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. ウエハ表面付着異物に対して純水皮膜で包み込
    みその皮膜を急冷凍結、昇温解凍の温度サイクル
    を与えることで異物を除去する機能を備えた半導
    体製造装置。
JP12344890U 1990-11-21 1990-11-21 Pending JPH0479422U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12344890U JPH0479422U (ja) 1990-11-21 1990-11-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12344890U JPH0479422U (ja) 1990-11-21 1990-11-21

Publications (1)

Publication Number Publication Date
JPH0479422U true JPH0479422U (ja) 1992-07-10

Family

ID=31871156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12344890U Pending JPH0479422U (ja) 1990-11-21 1990-11-21

Country Status (1)

Country Link
JP (1) JPH0479422U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008071875A (ja) * 2006-09-13 2008-03-27 Dainippon Screen Mfg Co Ltd 基板処理装置、液膜凍結方法および基板処理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008071875A (ja) * 2006-09-13 2008-03-27 Dainippon Screen Mfg Co Ltd 基板処理装置、液膜凍結方法および基板処理方法

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