JPS63172144U - - Google Patents

Info

Publication number
JPS63172144U
JPS63172144U JP1987064649U JP6464987U JPS63172144U JP S63172144 U JPS63172144 U JP S63172144U JP 1987064649 U JP1987064649 U JP 1987064649U JP 6464987 U JP6464987 U JP 6464987U JP S63172144 U JPS63172144 U JP S63172144U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit element
nozzle
cooling device
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987064649U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987064649U priority Critical patent/JPS63172144U/ja
Publication of JPS63172144U publication Critical patent/JPS63172144U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す図であり、第
２図はノズルの形状例を示す図であり、ａは円筒
形状ノズル、ｂは放射羽状ノズル、第３図は従来
の集積回路素子冷却装置の構成例を示す図である
。 図において、１……コールドプレート、２……
冷媒、３……ノズル、４……伝熱板、５……弾性
熱伝導体、６……集積回路素子、７……基板。

Claims (1)

  1. 【実用新案登録請求の範囲】 基板７上に実装された集積回路素子６と伝熱板
    ４とを直接或いは間接的に接触させて、ノズル３
    より該伝熱板４に対し冷媒２を噴射することによ
    つて、集積回路素子６から熱を奪う集積回路素子
    冷却装置において、 前記ノズル３の先端を断面がテーパー状の形状
    としたことを特徴とする集積回路素子冷却装置。
JP1987064649U 1987-04-28 1987-04-28 Pending JPS63172144U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987064649U JPS63172144U (ja) 1987-04-28 1987-04-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987064649U JPS63172144U (ja) 1987-04-28 1987-04-28

Publications (1)

Publication Number Publication Date
JPS63172144U true JPS63172144U (ja) 1988-11-09

Family

ID=30900996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987064649U Pending JPS63172144U (ja) 1987-04-28 1987-04-28

Country Status (1)

Country Link
JP (1) JPS63172144U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04320053A (ja) * 1991-04-18 1992-11-10 Nec Corp 集積回路の冷却機構
JPH0837261A (ja) * 1994-07-25 1996-02-06 Nec Corp 半導体冷却装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04320053A (ja) * 1991-04-18 1992-11-10 Nec Corp 集積回路の冷却機構
JPH0837261A (ja) * 1994-07-25 1996-02-06 Nec Corp 半導体冷却装置

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