JPS63197345U - - Google Patents
Info
- Publication number
- JPS63197345U JPS63197345U JP1987089783U JP8978387U JPS63197345U JP S63197345 U JPS63197345 U JP S63197345U JP 1987089783 U JP1987089783 U JP 1987089783U JP 8978387 U JP8978387 U JP 8978387U JP S63197345 U JPS63197345 U JP S63197345U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- cooling
- conductive member
- heat conductive
- cooling structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- 239000002826 coolant Substances 0.000 claims 1
- 239000003507 refrigerant Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Description
第１図は本考案の一実施例に係る半導体素子冷
却構造の平面図、第２図は第１図のＡ−Ａ矢視断
面図である。 １……プリント基板、２……半導体素子、３…
…熱伝導部材、４……冷却パイプ、５……冷媒流
路。
却構造の平面図、第２図は第１図のＡ−Ａ矢視断
面図である。 １……プリント基板、２……半導体素子、３…
…熱伝導部材、４……冷却パイプ、５……冷媒流
路。
Claims (1)
- 【実用新案登録請求の範囲】 プリント基板に搭載した半導体素子を冷却する
半導体素子冷却構造において、 上記半導体素子に、略断面くの字状に形成され
押圧力により湾曲して半導体素子上に当接する弾
性の熱伝導部材を載置し、かつ該熱伝導部材に、
冷媒流路を形成する冷却パイプを取付けたことを
特徴とする半導体素子冷却構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987089783U JPS63197345U (ja) | 1987-06-11 | 1987-06-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987089783U JPS63197345U (ja) | 1987-06-11 | 1987-06-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63197345U true JPS63197345U (ja) | 1988-12-19 |
Family
ID=30949075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987089783U Pending JPS63197345U (ja) | 1987-06-11 | 1987-06-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63197345U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010238904A (ja) * | 2009-03-31 | 2010-10-21 | Nec Corp | 電子装置、電子装置の冷却方法、電子装置の冷却ユニットおよび電子装置冷却ユニットの製造方法 |
-
1987
- 1987-06-11 JP JP1987089783U patent/JPS63197345U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010238904A (ja) * | 2009-03-31 | 2010-10-21 | Nec Corp | 電子装置、電子装置の冷却方法、電子装置の冷却ユニットおよび電子装置冷却ユニットの製造方法 |