JPS62152454U - - Google Patents
Info
- Publication number
- JPS62152454U JPS62152454U JP1986041711U JP4171186U JPS62152454U JP S62152454 U JPS62152454 U JP S62152454U JP 1986041711 U JP1986041711 U JP 1986041711U JP 4171186 U JP4171186 U JP 4171186U JP S62152454 U JPS62152454 U JP S62152454U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- heat exchanger
- attached
- flexible elastic
- exchanger plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Description
第１図は本考案による半導体素子用冷却装置の
一実施例を示す要部側断面図、第２図ａ，ｂは従
来の半導体素子冷却装置の構成例を示す要部側断
面図と部分拡大図である。 図中、１は可撓性弾性構造体、２は熱伝導性弾
性体、３は半導体素子、４はハンダ、５は伝熱板
、６はＯリング、７はフランジ、８は冷却水、９
はネジ、１０は冷却機構、２０は基板、Ｇはエア
ギヤツプ、をそれぞれ示す。
一実施例を示す要部側断面図、第２図ａ，ｂは従
来の半導体素子冷却装置の構成例を示す要部側断
面図と部分拡大図である。 図中、１は可撓性弾性構造体、２は熱伝導性弾
性体、３は半導体素子、４はハンダ、５は伝熱板
、６はＯリング、７はフランジ、８は冷却水、９
はネジ、１０は冷却機構、２０は基板、Ｇはエア
ギヤツプ、をそれぞれ示す。
Claims (1)
- 【実用新案登録請求の範囲】 可撓性弾性構造体１を有して成る冷却機構１０
と、基板２０に実装された半導体素子３とを、伝
熱板５を介して結合することによつて、該半導体
素子３の冷却を行う半導体素子用冷却装置の構成
において、 前記伝熱板５と半導体素子３とをハンダ４で接
合して一体構造にするとともに、伝熱板５と冷却
機構１０とを可撓性弾性構造体１の先端部に付設
したフランジ７によつて互いに着脱可能に構成し
たことを特徴とする半導体素子用冷却装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986041711U JPH0539635Y2 (ja) | 1986-03-19 | 1986-03-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986041711U JPH0539635Y2 (ja) | 1986-03-19 | 1986-03-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62152454U true JPS62152454U (ja) | 1987-09-28 |
| JPH0539635Y2 JPH0539635Y2 (ja) | 1993-10-07 |
Family
ID=30856955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986041711U Expired - Lifetime JPH0539635Y2 (ja) | 1986-03-19 | 1986-03-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0539635Y2 (ja) |
-
1986
- 1986-03-19 JP JP1986041711U patent/JPH0539635Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0539635Y2 (ja) | 1993-10-07 |