JPH0479134B2 - - Google Patents

Info

Publication number
JPH0479134B2
JPH0479134B2 JP60016633A JP1663385A JPH0479134B2 JP H0479134 B2 JPH0479134 B2 JP H0479134B2 JP 60016633 A JP60016633 A JP 60016633A JP 1663385 A JP1663385 A JP 1663385A JP H0479134 B2 JPH0479134 B2 JP H0479134B2
Authority
JP
Japan
Prior art keywords
adhesive
tip
coating agent
pin rod
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60016633A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61177731A (ja
Inventor
Yutaka Maruyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP60016633A priority Critical patent/JPS61177731A/ja
Publication of JPS61177731A publication Critical patent/JPS61177731A/ja
Publication of JPH0479134B2 publication Critical patent/JPH0479134B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Die Bonding (AREA)
JP60016633A 1985-02-01 1985-02-01 半導体装置用塗布剤供給治具 Granted JPS61177731A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60016633A JPS61177731A (ja) 1985-02-01 1985-02-01 半導体装置用塗布剤供給治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60016633A JPS61177731A (ja) 1985-02-01 1985-02-01 半導体装置用塗布剤供給治具

Publications (2)

Publication Number Publication Date
JPS61177731A JPS61177731A (ja) 1986-08-09
JPH0479134B2 true JPH0479134B2 (enExample) 1992-12-15

Family

ID=11921762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60016633A Granted JPS61177731A (ja) 1985-02-01 1985-02-01 半導体装置用塗布剤供給治具

Country Status (1)

Country Link
JP (1) JPS61177731A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2672428B1 (fr) * 1991-02-04 1993-05-28 Schiltz Andre Procede et dispositif d'insertion de puces dans des logements d'un substrat par tete d'encollage.
JP5494119B2 (ja) * 2010-03-30 2014-05-14 富士通株式会社 フラックスピン，フラックス転写装置及びフラックス転写方法
JP7653011B2 (ja) 2020-11-20 2025-03-28 日亜化学工業株式会社 デバイスの製造方法、及び、発光装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58146570U (ja) * 1982-03-29 1983-10-01 株式会社東芝 接着剤塗布装置

Also Published As

Publication number Publication date
JPS61177731A (ja) 1986-08-09

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees