JPH0479134B2 - - Google Patents
Info
- Publication number
- JPH0479134B2 JPH0479134B2 JP60016633A JP1663385A JPH0479134B2 JP H0479134 B2 JPH0479134 B2 JP H0479134B2 JP 60016633 A JP60016633 A JP 60016633A JP 1663385 A JP1663385 A JP 1663385A JP H0479134 B2 JPH0479134 B2 JP H0479134B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- pin rod
- tip
- frame
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000011248 coating agent Substances 0.000 claims description 20
- 239000004809 Teflon Substances 0.000 claims description 4
- 229920006362 Teflon® Polymers 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims 4
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 42
- 230000001070 adhesive effect Effects 0.000 abstract description 42
- 239000002184 metal Substances 0.000 abstract description 7
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 5
- 238000000151 deposition Methods 0.000 abstract 2
- 238000013518 transcription Methods 0.000 abstract 2
- 230000035897 transcription Effects 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 1
- 150000002505 iron Chemical class 0.000 abstract 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83194—Lateral distribution of the layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は半導体製品の組立て、例えばダイボン
デイングの際の接着剤の如き塗布剤の転写に用い
られる供給治具に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a supply jig used for assembling semiconductor products, for example, for transferring a coating agent such as an adhesive during die bonding.
従来のダイボンデイング装置の接着剤転写用の
供給治具を第４図及び第５図を用いて説明する。
A conventional supply jig for adhesive transfer in a die bonding apparatus will be explained with reference to FIGS. 4 and 5.
この供給治具１は無空円柱形状のいわゆる単純
なピン棒であり、鉄系金属あるいはステンレス金
属により形成されており、その先端部１1底面は
平面形状を成している。 This supply jig 1 is a so-called simple pin rod in the shape of a blank cylinder, and is made of iron-based metal or stainless steel metal, and its tip 11 has a flat bottom surface.
このピン棒１を図示しないペースト状の接着剤
槽に浸し引き上げると第５図ａのように接着剤２
はピン棒１の先端部１1に付着する。そして同図
ｂに示されるようにこのピン棒１はリード用フレ
ーム３上に接着剤２を押し付け転写する。 When this pin rod 1 is immersed in a paste adhesive tank (not shown) and pulled up, adhesive 2 is applied as shown in Fig. 5a.
is attached to the tip 11 of the pin rod 1. As shown in FIG. 1B, the pin rod 1 presses and transfers the adhesive 2 onto the lead frame 3.
転写が終了したら同図ｃに示されるようにフレ
ーム３上に転写部された接着剤２上ヘ半導体素子
５が付着されダイボンデイングを完了する。 When the transfer is completed, the semiconductor element 5 is attached to the adhesive 2 transferred onto the frame 3, as shown in FIG. 3C, thereby completing the die bonding.
しかしながら、この従来のピン棒１は接着剤２
を付着する先端部１1底面が平面形状でありこの
底面への接着剤２の付着量が一定とならない。加
えて転写の際、接着剤２が部分的に付着したまま
ピン棒１が離れると接着剤２が尾を引くような形
状となるなどして一定量の接着剤２を安定して供
給することができない。 However, this conventional pin rod 1 has adhesive 2
The bottom surface of the tip 1 to which the adhesive is attached is flat, and the amount of adhesive 2 that adheres to the bottom surface is not constant. In addition, during transfer, if the pin rod 1 is separated while the adhesive 2 is partially attached, the adhesive 2 will form a trailing shape, so that a certain amount of the adhesive 2 can be stably supplied. I can't.
またこのピン棒１の材質は接着剤２を転送する
ことができるようこの接着剤２となじみのよい鉄
系金属あるいはステンレス系金属であるため、こ
のピン棒１の先端部側周璧を接着剤２が這い上
り、接着剤２の必要量を十分にフレーム３に転写
することができないことがある。 In addition, the material of this pin rod 1 is iron-based metal or stainless steel metal that is compatible with the adhesive 2 so that the adhesive 2 can be transferred. 2 may creep up and the required amount of adhesive 2 may not be sufficiently transferred to the frame 3.
以上のように一定量の接着剤２を安定して転写
できないためフレーム３と半導体素子５との接着
強度が安定して得られないという問題がある。 As described above, since a fixed amount of the adhesive 2 cannot be stably transferred, there is a problem that the adhesive strength between the frame 3 and the semiconductor element 5 cannot be stably obtained.
本発明は上記従来の問題点を解決し、一定量の
塗布剤を一定形状に安定して転写できる半導体装
置用塗布剤供給装置を提供することを目的とす
る。
SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned conventional problems and provide a coating agent supply device for a semiconductor device that can stably transfer a certain amount of coating agent into a fixed shape.
本発明は上記目的を達成するための、半導体装
置を製作する際、液状の塗布剤に先端を浸し引き
上げることによりこの先端部に塗布剤を付着さ
せ、この塗布剤を半導体装置に転写するための半
導体装置用塗布剤供給治具において、前記先端部
の底面に凹部を有することを特徴とする半導体装
置用塗布剤供給治具である。
In order to achieve the above object, the present invention has a method for applying a coating agent to the tip by dipping the tip into a liquid coating agent and pulling it up when manufacturing a semiconductor device, and transferring the coating agent to the semiconductor device. The coating agent supply jig for semiconductor devices is characterized in that the tip portion has a recessed portion on the bottom surface.
本発明治具の一実施例を図を用いて説明する。 An embodiment of the jig of the present invention will be described with reference to the drawings.
第１図に本実施例の半導体装置用塗布剤供給治
具を示す。 FIG. 1 shows a coating agent supply jig for semiconductor devices according to this embodiment.
この治具はピン棒１を有し、このピン棒１はペ
ースト状の塗布剤、例えば半田の如き接着剤とな
じみの良い材質、例えば鉄系金属やステンレス系
金属により形成されている。そしてこのピン棒１
の先端部１1の底面（先端面）には接着剤を付着
させるための凹部４が形成されている。なおこの
凹部４の内容積は接着剤の必要量に応じ任意に選
定される。そしてこのピン棒１の側周壁には接着
剤となじみにくい材質の膜、例えばテフロン膜６
が形成されている。 This jig has a pin rod 1, and the pin rod 1 is made of a material that is compatible with a paste-like coating agent, such as an adhesive such as solder, such as an iron metal or a stainless steel metal. And this pin rod 1
A recess 4 for adhering an adhesive is formed on the bottom surface (tip surface) of the tip 11 . Note that the internal volume of this recess 4 is arbitrarily selected depending on the required amount of adhesive. The side peripheral wall of this pin rod 1 is coated with a film made of a material that is difficult to mix with adhesive, such as a Teflon film 6.
is formed.
このような形状のピン棒１を用いてリード用フ
レームに半導体素子を接着剤を介して接着するい
わゆるダイボンデイング工程を第２図により説明
すると次のようになる。 A so-called die bonding process in which a semiconductor element is bonded to a lead frame using an adhesive using the pin rod 1 having such a shape will be explained with reference to FIG. 2 as follows.
すなわち、ピン棒１の先端部１1を図示しない
着剤槽に浸し引き上げると第２図ａに示すように
接着剤２はピン棒１の先端の凹部４の面に付着す
る。これをフレーム３のダイボンデイング部分に
押しあてると第２図ｂに示されるようフレーム３
に接着剤２は付着転写される。 That is, when the tip 11 of the pin rod 1 is immersed in an adhesive tank (not shown) and pulled up, the adhesive 2 adheres to the surface of the recess 4 at the tip of the pin rod 1, as shown in FIG. 2a. When this is pressed against the die bonding part of the frame 3, the frame 3
The adhesive 2 is adhered and transferred to.
そしてこの接着剤２の転写後、この接着剤２の
転写されたフレーム３上に半導体素子５を供給す
る。 After the adhesive 2 has been transferred, the semiconductor element 5 is supplied onto the frame 3 onto which the adhesive 2 has been transferred.
以上のような本実施例のピン棒１によると、接
着剤２の付着する底面に凹部４が形成してあるた
めこの凹部４の内容積に合わせ常に一定量の接着
剤２を安定してフレーム３上に転写することがで
きる。また転写後の接着剤２の形状も中央部が凸
形状の一定の形となる。 According to the pin rod 1 of this embodiment as described above, since the recess 4 is formed on the bottom surface to which the adhesive 2 adheres, a certain amount of the adhesive 2 is always stably applied to the frame according to the internal volume of the recess 4. 3 can be transferred onto. Further, the shape of the adhesive 2 after transfer also has a constant shape with a convex central portion.
またこのピン棒１の側周壁には接着剤２となじ
みの悪いテフロン膜６が形成してあるため、この
側周璧の接着剤２の這い上りを防止でき常に一定
量の接着剤２を安定して転写することができる。 Also, since a Teflon film 6, which is not compatible with the adhesive 2, is formed on the side wall of the pin rod 1, it is possible to prevent the adhesive 2 from creeping up on the side wall, and to maintain a constant amount of the adhesive 2 at all times. can be transcribed.
本発明は本実施例に限定されるものではなく、
例えばピン棒１の凹部４の形状は第３図ａのよう
に凹部底面が平担であつてもよく、また同図ｂの
ように円錐形のものであつてもよい。そしてこの
ような形状はその内容積および形状を変化させる
ことにより接着剤２の転写量及び転写形状を任意
に定めることができる。 The present invention is not limited to this example,
For example, the shape of the recess 4 of the pin rod 1 may be such that the bottom surface of the recess is flat as shown in FIG. 3a, or it may be conical as shown in FIG. 3b. By changing the internal volume and shape of such a shape, the transfer amount and transfer shape of the adhesive 2 can be arbitrarily determined.
また、ダイボンデイングにのみ限定されるもの
では無く、例えば半導体素子５の表面を絶縁性の
樹脂膜で覆いこれを保護膜とする場合の液状の樹
脂を半導体素子表面に転写する治具にも応用する
ことができる。 Furthermore, the application is not limited to die bonding, but can also be applied to a jig for transferring liquid resin onto the surface of a semiconductor element, for example, when the surface of the semiconductor element 5 is covered with an insulating resin film and this is used as a protective film. can do.
本発明の塗布剤供給装置によると、底面が凹部
を有することにより一定量の塗布剤を一定形状に
安定して半導体装置上に転写することができると
いう効果がある。
According to the coating agent supply device of the present invention, since the bottom surface has a recessed portion, there is an effect that a certain amount of coating agent can be stably transferred in a certain shape onto a semiconductor device.
第１図ａおよびｂは本発明の一実施例の塗布剤
供給治具の形状を夫々示す断面図及び斜視図、第
２図ａ，ｂは本実施例の治具によりリードフレー
ムに接着剤を転写する手順を示す断面図、第３図
ａ，ｂはいずれも本発明の他の実施例を示す断面
図、第４図は従来の治具の形状を示す斜視図、第
５図ａ，ｂおよびｃは従来のフレームへの接着剤
の転写手順を示す断面図である。
１……ピン棒、２……接着剤、３……フレー
ム、４……凹部、５……半導体素子、６……塗布
剤となじみ難い膜（テフロン）。
1A and 1B are cross-sectional views and perspective views showing the shape of a coating agent supplying jig according to an embodiment of the present invention, and FIGS. 2A and 2B are sectional views and FIGS. 3A and 3B are sectional views showing other embodiments of the present invention, FIG. 4 is a perspective view showing the shape of a conventional jig, and FIGS. 5A and 5B are sectional views showing the transfer procedure. and c are cross-sectional views showing a conventional procedure for transferring adhesive to a frame. 1... Pin rod, 2... Adhesive, 3... Frame, 4... Recess, 5... Semiconductor element, 6... Film (Teflon) that is difficult to mix with the coating agent.
Claims (1)
部を浸し引き上げることによりこの先端部に塗布
剤を付着させ、この塗布剤を半導体装置に転写す
るための半導体装置用塗布剤供給治具において、 前記先端部の底面に切れ目のない縁を有する第
１の材質の凹部と、前記先端部の側周壁に形成さ
れた第２の材質の膜とを有し、前記第２の材質
は、前記第１の材質よりも前記塗布剤に対するぬ
れ性が低いことを特長とする半導体装置用塗布剤
供給治具。 ２ 前記第２の材質の膜がテフロン膜であること
を特徴とする請求項１記載の半導体装置用塗布剤
供給治具。[Scope of Claims] 1. A coating for semiconductor devices in which, when manufacturing a semiconductor device, the tip is immersed in a liquid coating and pulled up to adhere the coating to the tip, and the coating is transferred to the semiconductor device. The agent supply jig includes a recess made of a first material having a continuous edge on the bottom surface of the tip, and a film made of a second material formed on a side peripheral wall of the tip, A coating agent supply jig for a semiconductor device, wherein the material has lower wettability to the coating agent than the first material. 2. The coating agent supplying jig for a semiconductor device according to claim 1, wherein the film of the second material is a Teflon film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1663385A JPS61177731A (en) | 1985-02-01 | 1985-02-01 | Coating supply jig for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1663385A JPS61177731A (en) | 1985-02-01 | 1985-02-01 | Coating supply jig for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61177731A JPS61177731A (en) | 1986-08-09 |
| JPH0479134B2 true JPH0479134B2 (en) | 1992-12-15 |
Family
ID=11921762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1663385A Granted JPS61177731A (en) | 1985-02-01 | 1985-02-01 | Coating supply jig for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61177731A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2672428B1 (en) * | 1991-02-04 | 1993-05-28 | Schiltz Andre | METHOD AND DEVICE FOR INSERTING CHIPS INTO HOUSINGS OF A SUBSTRATE BY SIZING HEAD. |
| JP5494119B2 (en) * | 2010-03-30 | 2014-05-14 | 富士通株式会社 | Flux pin, flux transfer device and flux transfer method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58146570U (en) * | 1982-03-29 | 1983-10-01 | 株式会社東芝 | adhesive applicator |
-
1985
- 1985-02-01 JP JP1663385A patent/JPS61177731A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61177731A (en) | 1986-08-09 |
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| JPH0434930Y2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |