JPH0477278U - - Google Patents
Info
- Publication number
- JPH0477278U JPH0477278U JP12091890U JP12091890U JPH0477278U JP H0477278 U JPH0477278 U JP H0477278U JP 12091890 U JP12091890 U JP 12091890U JP 12091890 U JP12091890 U JP 12091890U JP H0477278 U JPH0477278 U JP H0477278U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- mounting
- foil pads
- integrated circuit
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 239000011889 copper foil Substances 0.000 claims description 12
- 238000007689 inspection Methods 0.000 claims description 4
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ａ，ｂは本考案の一実施例の表面実装用
の集積回路部品搭載用銅箔パツドの正面図および
Ａ部の拡大図、第２図は本考案の実施例２の集積
回路部品搭載用銅箔パツド内に検査用銅箔パツド
を設けた拡大図、第３図は従来の表面実装用の集
積回路部品搭載用銅箔パツドの一例の正面図であ
る。 １……集積回路部品搭載用銅箔パツド、２……
検査用銅箔パツド、３……集積回路部品搭載用銅
箔パツド、４……１のエリア内の検査用銅箔パツ
ド、５……従来の表面実装用の集積回路部品搭載
用銅箔パツド。
の集積回路部品搭載用銅箔パツドの正面図および
Ａ部の拡大図、第２図は本考案の実施例２の集積
回路部品搭載用銅箔パツド内に検査用銅箔パツド
を設けた拡大図、第３図は従来の表面実装用の集
積回路部品搭載用銅箔パツドの一例の正面図であ
る。 １……集積回路部品搭載用銅箔パツド、２……
検査用銅箔パツド、３……集積回路部品搭載用銅
箔パツド、４……１のエリア内の検査用銅箔パツ
ド、５……従来の表面実装用の集積回路部品搭載
用銅箔パツド。
Claims (1)
- 表面実装用の集積回路部品搭載用銅箔パツドを
有する印刷配線板において、前記集積回路搭載用
銅箔パツドに電気検査用の銅箔パツドを直結から
チドリに配設したことを特徴とする印刷配線板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990120918U JP2546322Y2 (ja) | 1990-11-19 | 1990-11-19 | 印刷配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990120918U JP2546322Y2 (ja) | 1990-11-19 | 1990-11-19 | 印刷配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0477278U true JPH0477278U (ja) | 1992-07-06 |
| JP2546322Y2 JP2546322Y2 (ja) | 1997-08-27 |
Family
ID=31868799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990120918U Expired - Lifetime JP2546322Y2 (ja) | 1990-11-19 | 1990-11-19 | 印刷配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2546322Y2 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110870390A (zh) * | 2018-01-30 | 2020-03-06 | 株式会社Lg化学 | 用于制造具有测试点的印刷电路板的方法以及由此制造的印刷电路板 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62230084A (ja) * | 1986-03-31 | 1987-10-08 | 松下電器産業株式会社 | プリント配線板 |
-
1990
- 1990-11-19 JP JP1990120918U patent/JP2546322Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62230084A (ja) * | 1986-03-31 | 1987-10-08 | 松下電器産業株式会社 | プリント配線板 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110870390A (zh) * | 2018-01-30 | 2020-03-06 | 株式会社Lg化学 | 用于制造具有测试点的印刷电路板的方法以及由此制造的印刷电路板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2546322Y2 (ja) | 1997-08-27 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| EXPY | Cancellation because of completion of term |