JPH0475868B2 - - Google Patents

Info

Publication number
JPH0475868B2
JPH0475868B2 JP62134079A JP13407987A JPH0475868B2 JP H0475868 B2 JPH0475868 B2 JP H0475868B2 JP 62134079 A JP62134079 A JP 62134079A JP 13407987 A JP13407987 A JP 13407987A JP H0475868 B2 JPH0475868 B2 JP H0475868B2
Authority
JP
Japan
Prior art keywords
weight
parts
firing
temperature
molded body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62134079A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63297264A (ja
Inventor
Kenichi Hoshi
Shoichi Tosaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP62134079A priority Critical patent/JPS63297264A/ja
Publication of JPS63297264A publication Critical patent/JPS63297264A/ja
Publication of JPH0475868B2 publication Critical patent/JPH0475868B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0306Inorganic insulating substrates, e.g. ceramic, glass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676Single layer compositions

Landscapes

  • Compositions Of Oxide Ceramics (AREA)
JP62134079A 1987-05-29 1987-05-29 絶縁性磁器の製造方法 Granted JPS63297264A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62134079A JPS63297264A (ja) 1987-05-29 1987-05-29 絶縁性磁器の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62134079A JPS63297264A (ja) 1987-05-29 1987-05-29 絶縁性磁器の製造方法

Publications (2)

Publication Number Publication Date
JPS63297264A JPS63297264A (ja) 1988-12-05
JPH0475868B2 true JPH0475868B2 (enrdf_load_stackoverflow) 1992-12-02

Family

ID=15119909

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62134079A Granted JPS63297264A (ja) 1987-05-29 1987-05-29 絶縁性磁器の製造方法

Country Status (1)

Country Link
JP (1) JPS63297264A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS63297264A (ja) 1988-12-05

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